semiconductorChip: A semiconductor device made by etching and wiring on a semiconductor sheet to realize a certain function.Not only silicon chips, but also semiconductor materials such as gallium arsenide (gallium arsenide is toxic, so some low-quality circuit boards should not be curious to decompose it), germanium, etc.Semiconductors are also trendy like cars.In the 1970s, American enterprises such as Intel gained the upper hand in the dynamic random access memory (D-RAM) market.However, due to the emergence of large computers, Japanese enterprises were among the best in the 1980s when high-performance D-RAM was needed.[1]
In order to meet the demand of mass production, the electrical properties of semiconductors must be predictable and stable, so the purity of dopants and the quality of semiconductor lattice structure must be strictly required.Common quality problems, including lattice dislocation, twin plane or stacking fault, will affect the properties of semiconductor materials.For a semiconductor device, the defect of material lattice (crystal defect) is usually the main factor affecting the performance of the device.[1]
At present, the most common method used to grow high-purity single crystal semiconductor materials is called the Tchaikoraski method (a common method in iron and steel fields).In this process, the seed of a single crystal is put into the dissolved liquid of the same material, and then slowly pulled up in a rotating manner.When the seed crystal is pulled up, the solute will solidify along the interface between the solid and the liquid, and rotation can make the temperature of the solute uniform.[1]
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The invention of semiconductor chip is an innovation in the 20th century, which createdInformation AgeIs the first of its kind.[1]
Everyone knows“Internet”And“computer”It is the most popular noun today.Computer has become an essential tool in our daily life. What chip does your computer CPU use? Is it "Intel" or "AMD"?In fact, both "Intel" and "AMD" are essentially the samesemiconductorChip.[1]
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Global semiconductor manufacturing industry will grow by 88% in 2010
The latest version of SEMI's forecast report on global integrated circuit manufacturers reveals that the expenditure of semiconductor manufacturers is expected to rise to more than 30 billion dollars in 2010, an increase of 88% over the same period of 2009.Many manufacturers andstorageThe company has announced plans to increase capital expenditure in the past few months.In addition, some previously "frozen" projects will also be unfrozen in succession, such as TI's RFAB, TSMC12 Plant Phase 5 and UMC12A Plant Phase 3/4 (the former 12B Plant), Samsung's 16th production line and IM's flash memory plant in Singapore.SEMI's observation report on global integrated circuit manufacturers also revealed plans for a number of new chip manufacturers to break ground, such as the fourth phase of TSMC14, the fifth factory of FlashAlliance and others.[1]
Of course, even though the expenditure in 2010 has shown a substantial growth trend, the expenditure of the former fab factory still needs to increase by at least 49% in 2011 to make the equipment expenditure return to the level of 2007.In addition, the equipment expenditure plan also depends on the sustained recovery of the global economy.The SEMIWorldFabForecast forecasts that the expenditure of the first fab in 2011 will be slightly lower than that in 2007, reaching US $42.3 billion.[1]
Weak growth of global semiconductor market in 2011
In 2011, the size of the global semiconductor market was US $300.94 billion, only achieving a slight growth of 0.88%. The main reason is that the global economic recovery after the financial crisis lacks momentum, the U.S. economy continues to be depressed, the European debt crisis is becoming more serious, and there is a lack of unified and effective means of relief, and inflation in emerging market countries is generally increasing.The recession of the economic environment and the suppression of inflation have directly led to the weakening of its demand for electronic complete machines.In addition,semiconductorDuring the financial crisis, the market effect of manufacturers' investment against the market to expand capacity was also concentrated in 2012. The slowdown in market demand and excess manufacturing capacity directly led to a sharp decline in product prices, with DRAM product prices falling the most.[1]
New process
In March 2023, developed by the joint team of researchers from Minnesota Twin Cities University and the National Institute of Standards and Technology (NIST)A breakthrough process for manufacturing spintronic devices，By using iron palladium materials instead of cobalt, iron and boron, the size of materials can be reduced to 5 nanometers, and this process may become a new industry standard for semiconductor chipsAccurate.[2]
