chip

General term for semiconductor component products

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Integrated circuit English: integrated circuit, abbreviated as IC; Or called Microcircuit （microcircuit）、 Microchip （microchip）、 wafer /Chip electronics Chinese is a kind of Circuit (mainly including semiconductor Equipment, including passive components, etc.) wafer On the surface.

In April 2023, For the first time, the international scientific research team will Quantum light source Completely integrated on one chip^[15] 。

Chinese name: chip
Foreign name: microchip

Alias: Microcircuit
Meaning: General term for semiconductor component products
Manufacturing equipment: Photolithography machine

catalog

one brief introduction
two introduce
three Development of integrated circuits
four classification
five manufacture
six model

▪ Technical level of packaging engineering
▪ Classification of packaging
nine principle
ten Chinese chip
▪ Relevant policies
▪ Development history
▪ Challenge
▪ Foreign media voice

brief introduction

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chip (4 sheets)

The circuit is manufactured in Semiconductor chip The surface integrated circuit is also called film (thin film) integrated circuit. Another thick film （thick-film） Integrated circuit (hybrid integrated circuit) is a miniaturization composed of independent semiconductor devices and passive components integrated into the substrate or circuit board Circuit 。

From 1949 to 1957, Werner Jacobi, Jeffrey Dummer, Sidney Darlington and Yasuo Tarui all developed prototypes, but modern integrated circuits were developed by Jack Kilby It was invented in 1958. It was awarded the title of Nobel Prize in Physics But at the same time, modern and practical integrated circuits also developed Robert Noyce , but died in 1990.

introduce

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After the invention and mass production of transistors, various solid-state semiconductor components such as diode 、 transistor And replaced Vacuum tube Function and role in the circuit. In the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible. Compared with the manual assembly circuit using individual discrete electronic components, the integrated circuit can integrate a large number of microcrystalline tubes into a small chip, which is a huge progress. The scale production capacity, reliability and modularization method of circuit design of integrated circuits ensure the rapid adoption of standardized integrated circuits instead of discrete transistors in the design.

Integrated circuits have two main advantages for discrete transistors: cost and performance. The low cost is due to the fact that the chip prints all components as a unit through photolithography technology, rather than making only one transistor at a time. The high performance is due to the fast switching of components, which consumes less energy, because the components are small and close to each other. In 2006, the chip area ranged from several square millimeters to 350 mm ², and each mm ² could reach one million transistors.

The first prototype of integrated circuit was created by Jack Kilby Completed in 1958, including one Bipolar transistor , three resistance And a capacitor 。

According to the integrated Microelectronic device The number of integrated circuits can be divided into the following categories:

Small Scale Integration Logic gate Less than 10 or less than 100 transistors.
11~100 logic gates or 101~1k transistors of Medium Scale Integration (MSI).
large-scale integrated circuit (LSI's full English name is Large Scale Integration) 101~1k logic gates or 1001~10k transistors.
vlsi (The full English name of VLSI is Very large scale integration) 1001~10k logic gates or 10001~100k transistors.
There are 10001~1M logic gates or 100001~10M transistors in ULSI.
GLSI (full English name is Giga Scale Integration) has more than 10000001 logic gates or more than 10000001 transistors.

Development of integrated circuits

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The most advanced Integrated circuit yes microprocessor Or multi-core processor core, which can control computer reach mobile phone To number Microwave Oven Everything. Although the cost of designing and developing a complex integrated circuit is very high, the cost of each integrated circuit is minimized when it is distributed to products usually in millions. The performance of integrated circuits is very high, because small size brings short paths, making low-power logic circuits can be used in fast switching speed applications.

Over the years, integrated circuits have continued to develop towards smaller dimensions, enabling each chip to package more Circuit 。 This increases the capacity per unit area, which can reduce costs and increase functions. See Moore's law The number of transistors in integrated circuits has doubled every 1.5 years. In short, with the reduction of overall dimensions, almost all indicators have improved, unit cost and switching power consumption have decreased, and speed has increased. However, integration nanometer There are also problems with the IC of level equipment, mainly leakage current 。 Therefore, the increase in speed and power consumption for end users is very obvious, and manufacturers face a sharp challenge to improve the chip structure. This process and the expected progress in the next few years are well described in the semiconductor international technology roadmap.

Only half a century after its development, integrated circuits have become ubiquitous, and computers, mobile phones and other digital appliances have become an indispensable part of the social structure. This is because modern computing, communication, manufacturing and traffic System, including internet , all depend on the existence of integrated circuits. Even many scholars believe that the digital revolution brought about by integrated circuits is the most important event in human history. The maturity of IC will bring about a great leap forward in science and technology, not only in design technology, but also in semiconductor technology, both of which are necessary.^[1]

classification

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There are many ways to classify integrated circuits simulation or number , can be divided into: Analog integrated circuit 、 Digital integrated circuit And mixed signal integrated circuits (analog and digital on one chip).

Digital integrated circuits can contain anything from thousands to millions of Logic gate 、 trigger , multi tasker and other circuits. The small size of these circuits enables higher speed and lower power consumption than board level integration (see Low power design ）And the manufacturing cost is reduced. These digital ICs are based on microprocessor Digital Signal Processor and micro controller As representative, used in work Binary , processing 1 and 0 signals.

Analog integrated circuits include, for example sensor , power control circuit and Operational amplifier , processing analog signal 。 complete enlarge 、 wave filtering 、 demodulation 、 mixing Function, etc. By using analog integrated circuits designed by experts with good characteristics, the burden of circuit designers is reduced, and everything does not need to be designed from the basic transistors.

Integrated circuits can integrate analog and digital circuits on a single chip to make Analog digital converter And digital analog converter. This circuit provides a smaller size and lower cost, but you must be careful about signal collisions.^[1]

manufacture

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See: semiconductor device manufacturing and Integrated Circuit Design

Since the 1930s, periodic table of ele ments Of the chemical elements in semiconductor Subjects such as Bell Laboratories Of William Shockley (William Shockley) thinks it is the most possible raw material for solid vacuum tubes. from Cupric oxide reach germanium , then silicon The raw materials were systematically studied in the 1940s and 1950s. Although some III-V compounds in the periodic table are Gallium arsenide For special purposes such as: light-emitting diode 、 laser 、 Solar cell And the highest speed integrated circuit, monocrystalline silicon Become the basic level of mainstream integrated circuit. It took decades to create defect free crystals.

Semiconductor integrated circuit Process, including the following steps, and reuse:

Photolithography
Etching
film （ Chemical vapor deposition or Physical vapor deposition ）
doping (Thermal diffusion or ion implantation ）
Chemical mechanical flattening CMP

Use monocrystalline silicon wafer (or III-V family, such as Gallium arsenide ）Used as the base layer, and then used photolithography, doping CMP And other technologies MOSFET or BJT And other components, and then use the thin film and CMP technology to make wires, so that the chip production can be completed. Due to product performance requirements and cost considerations, conductors can be divided into aluminum processes (based on Sputter plating Mainly) and copper process (mainly electroplate See Synonyms at main Damascene ）。 The main process technologies can be divided into the following categories: yellow photolithography, etching, diffusion, film, flattening and metallization.

IC is composed of many overlapping layers, each layer is defined by video technology, and is usually represented by different colors. Some layers indicate where different dopants diffuse into the base layer (become the diffusion layer), some define where additional ions are implanted (implanted layer), and some define conductors（ polysilicon Or metal layer), some define the connection between conductive layers (via or contact layer). All components consist of specific combinations of these layers.

In a self arrangement（ CMOS ）In the process, transistors are formed where all gate layers (polysilicon or metal) pass through the diffusion layer.
resistance Structure, the length width ratio of the resistance structure, combined with the surface resistance coefficient, determines the resistance.
capacitance Due to the size limitation, the structure can only produce very small capacitance on the IC.
Rarer inductance The inductor can be made on chip or simulated by gyrotron.

Because CMOS devices only guide current conversion between logic gates, CMOS devices are better than bipolar components (such as Bipolar transistor ）It consumes much less current. Through circuit design, multiple transistor tubes can be drawn on the silicon wafer, and integrated circuits with different functions can be drawn.

Random access memory It is the most common type of integrated circuit, so the equipment with the highest density is storage , but even microprocessors have memory. Although the structure is very complex - chip width has been reduced for decades - the layers of integrated circuits are still much thinner than the width. The component layer is made much like a photographic process. although Visible spectrum The light waves in cannot be used to expose component layers because they are too large. High frequency photons (typically ultraviolet rays ）Used to create patterns for each layer. Because each feature is very small, for a process engineer who is debugging the manufacturing process, electron microscope It is a necessary tool.

in use Automatic test equipment (ATE) Before packaging, each equipment shall be tested. The test process is called wafer testing or wafer probing. The wafer is cut into rectangular blocks, each called wafer （“die”）。 Each good die is connected to the package by the aluminum wire or gold wire soldered on the "pads", and the pads are usually on the edge of the die. After packaging, the equipment shall undergo final inspection on the same or similar ATE used in wafer probing. The test cost can reach 25% of the manufacturing cost of low-cost products, but for low output, large and/or high cost equipment, it can be ignored.

In 2005, a manufacturing plant (usually referred to as semiconductor plant, often referred to as fab The construction cost will exceed US $1 billion, because most operations are automated.^[1]

manufacturing process

The whole process of chip manufacturing includes chip design, chip manufacturing, packaging manufacturing, testing and other aspects, of which the chip manufacturing process is particularly complex.

The first is chip design. According to the design requirements, the generated "pattern"

Raw wafer of chip

The component of wafer is silicon, which is refined by Shi Yingsha. The wafer is the silicon element that is purified (99.999%). Then the pure silicon is made into silicon crystal bars, which become the material for manufacturing quartz semiconductor of integrated circuits. Slicing it is the wafer required for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the process requirements.

Wafer coating

Wafer coating can resist oxidation and temperature, and its material is a kind of light resistance.

wafer Photolithography development 、 etching

The basic flow of lithography process is shown in Figure 1^[2] As shown in. First, a layer of photoresist is coated on the surface of the wafer (or substrate) and dried. The dried wafer is transferred to the lithography machine. Light passes through a Mask The pattern on the mask is projected onto the wafer surface Photoresist On, realize exposure and excitation Photochemical reaction 。 The exposed wafer is baked for the second time, which is called Bake after exposure Post baking makes photochemical reaction more sufficient. Finally, the developer is sprayed on the photoresist on the wafer surface to develop the exposed pattern. After development, the pattern on the mask is saved on the photoresist. Glue coating, baking and development are all completed in the uniform glue developing machine, and exposure is completed in the lithography machine. The uniform glue developing machine and the lithography machine are generally operated online, and the wafer is transferred between each unit and the machine through a manipulator. The entire exposure development system is closed, and the wafer is not directly exposed to the surrounding environment, so as to reduce the impact of harmful components in the environment on photoresist and photochemical reaction^[2] 。

Figure 1: Basic process of modern photolithography and detection steps after photolithography

This process uses chemicals that are sensitive to UV light, that is, they become soft when exposed to UV light. The shape of the chip can be obtained by controlling the position of the shading object. Apply photoresist on the silicon wafer to make it dissolve in the presence of ultraviolet light. At this time, the first part of sunscreen can be used to dissolve the part directly exposed to ultraviolet light, and then the dissolved part can be washed away with solvent. The remaining part is the same as the shape of the shading object, and this effect is exactly what we want. So we can get what we need silicon dioxide Layer.

Adulterate

Implant ions into the wafer to generate corresponding class P and N semiconductors.

The specific process is to start from the exposed area on the silicon wafer and put it into the chemical ion mixture. This process will change the conductive mode of the doping region, so that each transistor can turn on, off, or carry data. A simple chip can only use one layer, but a complex chip usually has many layers. At this time, the process is repeated constantly, and different layers can be connected by opening a window. This is similar to the manufacturing principle of multilayer PCB board. More complex chips may require multiple silicon dioxide layers, which can be realized through repeated lithography and the above process to form a three-dimensional structure.

wafer probe

After the above processes, lattice grains are formed on the wafer. The electrical characteristics of each grain are tested by needle measurement. Generally, each chip has a large number of grains, and it is a very complex process to organize a single pin test mode, which requires mass production of models with the same chip specification and structure. The larger the quantity is, the lower the relative cost will be, which is also a factor why the cost of mainstream chip devices is low.

encapsulation

Fix the finished wafer, bind the pins, and make different packaging forms according to the requirements, which is why the same chip core can have different packaging forms. For example, DIP, QFP, PLCC, QFN, etc. This is mainly determined by the user's application habits, application environment, market form and other peripheral factors.

Testing and packaging

After the above process flow, the chip production has been completed. This step is to test the chip, remove defective products, and package it.

model

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The chip naming method is generally: letter+number+letter

The preceding letter is the abbreviation of a chip manufacturer or a chip family. For example, MC started with Motorola, and MAX started with Maxin.

The number in the middle is the function model. Like the MC7805 and LM7805, it can be seen from the 7805 that their function is to output 5V, but the manufacturer is different.

The following letters are mostly packaging information. You can know what specific letters represent only by the information provided by the manufacturer.

The 74 series is the common name of standard TTL logic devices, such as 74LS00, 74LS02, etc. It is impossible to see what company's products are from 74 alone. Different companies will prefix 74, such as SN74LS00.

Relevant expansion

A complete IC model must generally include at least the following four parts:

Prefix (first label) - many can speculate which company is the product.

Device name ---- generally, the function of the product can be inferred (memory can know its capacity).

Temperature class - commercial, industrial, military, etc. Generally, C stands for civil grade, I stands for industrial grade, E stands for extended industrial grade, A stands for aviation grade, and M stands for military grade.

Packaging - indicates the packaging and pin number of the product. Some IC models also have other contents:

Rate ---- For example, memory, MCU, DSP, FPGA and other products have different rates, such as - 5 and - 6.

Process structure - for example, there are two types of universal digital IC: COMS and TL, which are usually represented by the letters C and T.

Whether it is environmentally friendly - there is a letter at the end of the model to indicate whether it is environmentally friendly, such as z, R,+, etc.

Packaging - indicates the packaging of the material, such as tube, T/R, rail, trail, etc.

Version No. - displays the number of times the product has been modified. Generally, M is the first version.

Common sense and naming rules of IC naming and packaging

Temperature range:

C=0 ℃ to 60 ℃ (commercial grade); I=- 20 ℃ to 85 ℃ (industrial grade); E=- 40 ℃ to 85 ℃ (extended industrial grade); A=- 40 ℃ to 82 ℃ (aviation grade); M=- 55 ℃ to 125 ℃ (military grade)

Encapsulation type:

A-SSOP; B-CERQUAD; C-TO-200, TQFP; D-ceramic copper top; E-QSOP; F-Ceramic SOP; H-SBGAJ-ceramic DIP; K-TO-3; L-LCC, M-MQFP; N-narrow DIP; N-DIP;; Q-PLCC; R-narrow ceramic DIP (300mil); S-TO-52, T-TO5, TO-99, TO-100; U-TSSOP, uMAX, SOT; W-wide body small shape (300mil); X-SC-60 (3P, 5P, 6P); Y-narrow body copper top; Z-TO-92, MQUAD; D-die/ PR reinforced plastic packaging;/W-wafer.

Number of pins:

A—8；B—10﹔C—12，192； D—14；E—16；F——22，256；G—4；H—4；I—28 ；J—2；K—5，68；L—40；M—6，48；N—18；O—42；P—20﹔Q—2，100﹔R—3，843； S-4, 80; T-6160; U-60; V-8 (round); W-10 (round); X-36; Y-8 (round); Z-10 (round).

Note: The first letter of the four letter suffix of interface products is E, which means that the device has anti-static function

Development of packaging technology

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The earliest integrated circuit used ceramic flat package, which has been used by the military for many years because of its reliability and small size. Commercial circuit packaging is rapidly changing to Dual In Line Package , first ceramics, then plastics. In the 1980s, VLSI circuit pins exceeded DIP package Application restrictions, and finally lead to the pin grid array and Chip carrier The occurrence of.

Surface mount packaging appeared in the early 1980s and became popular in the late 1980s. It uses a finer pitch between the pins, and the pin shape is seagull airfoil or J type. Taking the Small Outline Integrated Circuit (SOIC) as an example, it is 30-50% less in area and 70% less in thickness than the equivalent DIP. The package has seagull airfoil pins protruding on two long sides, with a pin spacing of 0.05 inches.

Small Outline Integrated Circuit (SOIC) and PLCC Encapsulation. In the 1990s, although PGA packaging was still often used for high-end microprocessors. PQFP And thin small outline package (TSOP) become the common package of high pin count devices. Intel and AMD's high-end microprocessors have shifted from PGA (Pine Grid Array) packaging to Planar grid array encapsulation (Land Grid Array, LGA) encapsulation.

The ball grid array packaging began to appear in the 1970s. In the 1990s, the coated ball grid array packaging with more pins than other packaging was developed. In FCBGA package, wafer (die) is installed by flipping PCB A similar base layer rather than a line is connected to the solder ball on the package. FCBGA packaging makes the input and output signal array (called I/O area) distributed on the surface of the entire chip, rather than limited to the periphery of the chip. In today's market, packaging has become an independent part, and packaging technology will also affect the quality and yield of products.^[1]

Overview of IC Chip Packaging

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Encapsulation concept

Narrow sense: the process of arranging, pasting, fixing and connecting chips and other elements on the frame or substrate by using membrane technology and micro processing technology, leading out terminal blocks and sealing them with plastic insulating medium to form an overall three-dimensional structure.

Broad sense: It refers to the project of connecting and fixing the package with the substrate, assembling it into a complete system or electronic equipment, and ensuring the comprehensive performance of the whole system.

Functions realized by chip packaging

1. Transfer function; 2. Transmission circuit signal; 3. Provide heat dissipation path; 4. Structure protection and support.

Technical level of packaging engineering

Packaging engineering starts after the fabrication of integrated circuit chips, including all processes before the completion of the final product, including the pasting and fixing of integrated circuit chips, interconnection, packaging, sealing protection, connection with circuit boards, and system combination.

The first level: also known as chip level packaging, refers to the process of pasting and fixing the integrated circuit chip and the packaging substrate or foot stand, and the circuit wiring and packaging protection, making it easy to take, place and transport, and can be assembled and connected to the next level of module (component) components.

The second level: the process of combining several packages completed in the first level with other electronic components to form a circuit card. The third level: the process of combining several circuit cards completed by the second level into a main circuit board to make it a component or subsystem.

Level 4: the process of assembling several subsystems into a complete electronic product.

The wiring process between integrated circuit components on the chip is also called zero level packaging, so packaging engineering can also be distinguished by five levels.

Classification of packaging

1. According to the number of integrated circuit chips packaged: single chip package (scP) and multi chip package (MCP);

2. According to sealing materials: polymer materials (plastic) and ceramics;

3. According to the interconnection mode between the device and the circuit board: pin insertion type (PTH) and surface mount type (SMT) 4. According to the pin distribution form: single side pin, double side pin, four side pin and bottom pin;

SMT devices have L type, J type and I type metal pins.

SIP: single line package SQP: miniaturization package MCP: metal can package DIP: dual line package CSP: chip size package QFP: quad flat package PGA: dot matrix package BGA: ball grid array package LCCC: leadless ceramic chip carrier

principle

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A chip is an integrated circuit, which is composed of a large number of transistors. Different chips have different integration scales, up to several hundred million; As small as tens or hundreds of transistors. Transistors have two states, on and off, represented by 1 and 0. Multiple 1 and 0 signals generated by multiple transistors are set as specific functions (i.e. instructions and data) to represent or process letters, numbers, colors, graphics, etc. After the chip is powered on, a start command is generated first to start the chip, and then new commands and data are continuously received to complete the function.

Chinese chip

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Relevant policies

Issued by the State Council in August 2020《 Several policies to promote high-quality development of integrated circuit industry and software industry in the new era 》, so that the already very hot domestic chip industry can add another big advantage.^[3]

According to a report on August 10 on the website of the US consumer news and business channel, China has announced a series of policies to help boost the domestic economy Semiconductor industry 。 Most incentives focus on tax cuts. For example, if the operation period is more than 15 years Integrated circuit line width Manufacturers smaller than 28nm (inclusive) will be exempted from corporate income tax for up to 10 years. For chip manufacturers, the preferential period starts from the profit year. The new policy also focuses on financing issues and encourages companies to list on the science and technology oriented securities trading board.^[4]

Development history

1965-1978 entrepreneurial period

In 1965, the first batch of transistors and digital circuits developed domestically Hebei Semiconductor Research Institute Identification succeeded.

In 1968, Shanghai No.14 Radio Factory was the first to produce PMOS (P-type metal oxide semiconductor) integrated circuits.

In 1970, Background878 Plant and Shangwu 19 Plant were completed and put into operation.

In 1972, China's first PMOS type LSI circuit was made in Sichuan Yongchuan 1424 Research Institute.

In 1976, the Computing Institute of the Chinese Academy of Sciences adopted ECL developed by 109 Plant of the Chinese Academy of Sciences (now the Institute of Microelectronics of the Chinese Academy of Sciences)（ Emitter coupled logic circuit ）10 million large-scale electronic computers have been successfully developed.^[5]

1978-1989 Exploration period

In 1980, China's first 3-inch line was put into operation in 878 Factory.

In 1982, Jiangsu Wuxi 724 Factory introduced TV integrated circuit production line from Toshiba, which was the first time that China introduced integrated circuit technology from abroad;

The State Council established the Electronic Computer and large-scale integrated circuit The leading group formulated China's IC development plan and proposed to carry out technological transformation of the semiconductor industry during the "Sixth Five Year Plan" period.

In 1985, the first 64K DRAM was successfully trial produced in the state-owned 724 factory in Wuxi.

In 1988, Shangwu No.14 Factory built the first 4-inch line in China.

In 1989, the Ministry of Machinery and Electronics held the "Eighth Five Year Plan" integrated circuit development strategy seminar in Wuxi, proposing the development strategy of revitalizing integrated circuits;

Factory 724 and Wuxi Branch of Yongchuan Semiconductor Research Institute merged to form China Huajing Electronics Group.^[5]

1990-2000 key construction period

In 1990, the State Council decided to implement the "908" project.

In 1991, Capital Iron and Steel Company And Japan NEC Corporation Sino foreign joint venture ——Shougang NEC Electronics Co., Ltd.

In 1992, Shanghai Philips built the first 5-inch line in China.

In 1993, the first 256K DRAM was successfully trial produced in China Huajing Electronics Group Corporation.

In 1994, Shougang Electric Co., Ltd. built the first 6-inch line in China.

In 1995, the State Council decided to continue to implement the special project of integrated circuit ("909" project) and focus on the construction of China's first 8-inch production line.

In 1996, Intel invested in the construction of a sealing and testing plant in Shanghai.

In 1997, it was jointly established by Shanghai Huahong Group and Japanese NEC Shanghai Hua Hong NEC Electronics Company , mainly responsible for "909" main works vlsi Chip production line project construction.

In 1998, Huajing signed a contract with Shanghua to jointly produce MOS wafers, starting the Foundry era in mainland China; from General Research Institute for Nonferrous Metals National Engineering Research Center for Semiconductor Materials The first 8-inch silicon single crystal polishing production line in China was completed and put into operation.

In 1999, the first 8-inch production line of Shanghai Huahong NEC was officially completed and put into production.^[5]

Development acceleration period from 2000 to 2011

In 2000, SMIC International was established in Shanghai, and the State Council's No. 18 document increased support for integrated circuits.

In 2002, China's first general-purpose CPU chip "Godson-1" put into mass production was successfully developed.

In 2003, TSMC (Shanghai) Co., Ltd. settled in Shanghai.

In 2004, the first 12 inch line in mainland China was put into production in Beijing.

In 2006, "National Major Science and Technology Project" was established; Wuxi Hynix Italian Semiconductor was officially put into production.

In 2008, China Star Microelectronics Mobile multimedia chip The global sales exceeded 100 million.

In 2009, the national "nuclear high base" major special project entered the stage of declaration and implementation.

In 2011, the Notice on Printing and Distributing Several Policies to Further Encourage the Development of the Software Industry and Inherit the Circuit Industry.^[5]

2012-2019 High quality development period

In 2012, the 12th Five Year Plan for the Development of Integrated Circuit Industry was released; South Korea Samsung's $7 billion first phase investment in flash memory chip project settled in Xi'an.

In 2013, Unisplendor acquired Spreadtrum Communications and Redico; Continental IC Design Company entered the $1 billion club.

In 2014《 Outline for Promoting the Development of National Integrated Circuit Industry 》Formal release and implementation; "National Integrated Circuit Industry Development Investment Fund" (large fund) was established.

In 2015, Changdian Technology acquired Xingke Jinpeng with 780 million dollars; SMIC International achieved mass production of 28nm products.

In 2016, Big Fund and Unisplendor invested in Changjiang Storage; The first supercomputer "Sunway Taihu Light" built entirely with domestic processors won the world supercomputing champion.

In 2017, the Yangtze River Storage Phase I project was capped; The construction of memory production line was fully started; The world's first AI chip unicorn startup was established; Huawei Release the world's first AI chip Kirin 970 。

In 2018, Unisplendor mass produced 32 layers of 3D NAND (zero breakthrough).

In 2019, HiSilicon, a subsidiary of Huawei, released the world's first 5G SoC chip HiSilicon Kirin 990 adopts the world's advanced 7nm process; 64 layer 3D NAND flash memory Mass production of chips; SMIC International 14 nanometer process mass production.^[5]

In July 2021, Godson3A5000, the first processor chip designed by LoongArch, an autonomous instruction system, was officially released^[12]

Challenge

On August 7, 2020, Huawei Managing Director Huawei Consumer Business CEO Yu Chengdong stay 2020 Summit of China Informatization Hundred Talents Association In the last speech, it was said that under the influence of regulation, the Kirin 9000 chip carried by Mate 40 launched in the second half of the year may be the last generation of Kirin chip developed by Huawei itself.

The downstream of chips mainly manufacturing is China Integrated circuit industry The weakest link. Due to the complex process, chip manufacturing involves the long-term accumulation of materials, engineering, physics, chemistry, optics and other aspects from academia to industry, which is difficult to make up for in the short term.^[6]

Ren Zhengfei Long said: Huawei is like a fight in a disastrous state Most of the holes have been repaired, and some important holes will take two or three years to completely overcome.

As the ban becomes more severe, more and more holes need to be filled,^[10] Yu Chengdong Yes, I admit that I did nothing but design production It's a mistake. In addition to mending holes, we need to expand new territory.

Huawei and its partners are moving in this direction - Huawei's plan is to IDM ， industry insiders To Touzhong. com.^[10] IDM， It is a design and production mode in the chip field encapsulation reach test ， cover whole Industrial chain 。^[10] On the one hand, Huawei is chip design Extends upstream. Yu Chengdong once said that Huawei would comprehensive Take root and break through physics Materials Science Of fundamental research And precision manufacturing.^[10] Huawei Consumer Business Set up a special department to make screen driver chips and enter the screen industry. Earlier, the network revealed that Huawei was enabled internally Tashan Plan ： get set Build a project that has no American technology 45nm At the same time, we are also exploring cooperation to establish a 28nm independent technology chip production line.

According to the information circulated, this plan includes EDA Design, materials, production and manufacturing of materials, process, design, semiconductor manufacturing, chip sealing and testing, etc semiconductor technology Comprehensive Autonomous and controllable 。^[10]

Foreign media voice

1. Japan's Nikkei Asia Review reported in an article on August 12 that China has recruited more than 100 former employees TSMC Engineers strive to gain the leading position in chip (industry). As the largest foundry of chips in the world, TSMC has become the primary target of chip projects in China (mainland) seeking talents.

Roger Sheng, semiconductor analyst at Gartner Consulting, said: "China is still in a critical shortage of chip talents, because the country is carrying out many large-scale projects at the same time. The lack of talents is the bottleneck restricting the development of semiconductors.^[7]

2、 Huawei Consumer Business CEO Yu Chengdong Recently, it was admitted that due to the second round of sanctions imposed on Huawei by the United States, Huawei Kirin high-end chips will run out of stock by September 16. How Huawei broke the chip crisis in the United States CNBC According to the website's analysis on the 11th, Huawei has five choices, but at the same time, "all five choices face major challenges".^[8]

3. Germany《 Economic Weekly 》He said that, taking the semiconductor industry as an example, although China's chip demand has reached 60% of the world's total, only 13% of the chips are produced by China itself. Reuters said that while the United States has intensified its crackdown on Huawei, China has pushed for an internal economic cycle, striving to be free from restrictions in the high-tech field.^[8]

4. On August 10, the website of the US Consumer News and Business Channel reported that China plans to increase the semiconductor self-sufficiency rate to 40% by 2020 and 70% by 2025.^[4]

Neil Camplin, head of technology, media and telecommunications research at Mirabo Securities in Switzerland, told reporters from the Consumer News and Business Channel in an email: "I think this new technological cold war is the reason why China has climbed the technological curve and actively developed its own technology."^[4]

Paul Treolo, head of Eurasia Group's geo technology business, said: "The preferential treatment listed in the new policy will help in some areas, but in the short term, it will only help Chinese semiconductor enterprises climb up the value chain and improve their global competitiveness."^[4]

Related news

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On August 13, 2020, it was reported that the State Council had recently issued Several Policies to Promote the High Quality Development of the Integrated Circuit Industry and the Software Industry in the New Era, which made the already hot domestic chip industry more profitable. Heavy policy activates trillion market, and "new economy" and "new infrastructure" give birth to new opportunities. "New demand" erupts, and domestic chips welcome the golden development period.^[3]

On August 10, 2020, according to the website of the US Consumer News and Business Channel, China announced a series of policies to help boost the domestic semiconductor industry. Most incentives focus on tax cuts.^[4]

On February 8, 2022, the EU announced the Chip Act.^[11]

In November 2022, a research team led by the Engineering School of the University of Pennsylvania in the United States invented a chip whose security and robustness exceed the existing quantum communication Hardware^[14] 。

Chip shortage intensifies

--- Accelerated localization in China

After the United States disrupted the global chip supply chain for many times, the situation of chip supply exceeding demand is spreading. After several automobile manufacturers such as Volkswagen and General Motors were forced to announce production cuts due to chip shortages, it seems that Apple, the US technology giant, will stop producing the iPhone 12 mini recently because of insufficient chip supply.^[9]

To make matters worse, Samsung, Infineon, NXP and other chip manufacturers have closed some of their production capacity in the United States at a time when the global chip supply shortage is growing. What is the matter?^[9]

The latest report of MarketWatch on Thursday (February 18) showed that some chip companies in the United States were forced to stop production due to the impact of extreme snowstorm weather on their facilities, which may exacerbate the problem of chip shortage, thus indirectly affecting the output of automobile manufacturers in the country.^[9]

According to the report, South Korea, one of the world's largest chip manufacturers Samsung Electronics A spokesman for the company said that the company has two factories in Austin, Texas, the United States, and on Tuesday the local government had asked the company to close these two factories. It is reported that the Austin factory accounts for about 28% of Samsung's total chip production capacity. A spokesman said Samsung would resume production as soon as possible, but had to wait for power supply to resume.^[9]

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It is reported that about 3.8 million residents in Texas were cut off. In order to solve this problem as soon as possible, the Texas government issued a ban on the sale of natural gas to foreign countries on Thursday, requiring natural gas producers to sell natural gas to local power plants. Dan Woodfin, an executive of Ercot, a Texas power grid operator, said in an interview that the lack of natural gas supply was one of the reasons why it was difficult to restore power supply.^[9]

However, when a large number of people in Texas suffer from power failure, the power demand of factories cannot be satisfied first. According to the report, Samsung is not required to close its chip factory. NXP and Infineon The chip giants also closed their local factories due to power supply interruption.^[9]

At the same time, the process of Chinese chip localization is accelerating. According to the latest news on Thursday, Baidu Its chip progress was disclosed for the first time in its latest financial report. The financial report shows that the Kunlun 2 chip independently developed by Baidu is about to be mass produced to improve the computing power advantage of Baidu's intelligent cloud.^[9]

Entangled quantum light source

In April 2023, An international scientific research team composed of German and Dutch scientists completely integrated a quantum light source capable of emitting entangled photons on a chip for the first time^[15] 。

Atomic thin transistor

In 2023, An interdisciplinary team from Massachusetts Institute of Technology has developed a low-temperature growth process that can effectively and efficiently "grow" two-dimensional (2D) transition metal disulfide (TMD) material layers directly on silicon chips to achieve more intensive integration.^[16]

Industrial technology issues

Announce

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On June 27, 2022, at the closing ceremony of the 24th annual meeting of the China Association for Science and Technology, the China Association for Science and Technology solemnly released 10 industrial technology issues that play a leading role in industrial development, including "How to realize the engineering and industrialization of integrated memory and computing chips?" 。^[13]

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