S S D:SAMSUNG. MZVLB512HAJQ-000H1.
WLAN: I N T E L . AX200NGW
R A M: S AMSUNG D4-8G x2
Heat conduction increasing method: use pink 2.5 thick silica gel pad to paste two SSDs, CPU heat pipes, WLAN, and batteries to make them contact the D-side bottom shell for heat conduction.