TSOP is the abbreviation of "Thin Small Outline Package", which means thin small size package.TSOP memory is made around the chipPin, usingSMTTechnology（Surface mountingTechnology) is directly attached to the surface of PCB board.
When TSOP is packaged, parasitic parameters (output voltage disturbance caused by large current changes) are reduced. It is suitable for high-frequency applications, easy to operate, and has high reliability.At the same time, TSOP packaging has the advantages of high yield and low price, so it has been widely used.
In the 1980s, the chip TSOP packaging technology appeared and was widely recognized by the industry.A very obvious feature of TSOP packaging is that the length width ratio of the finished product is about 2:1 in the form of a thin strip, and only two sides have feet. It is suitable for SMT technology (surface mounting technology) to install and wire on PCB (printed circuit board).When TSOP package size is used, parasitic parameters (output voltage disturbance caused by large current changes) are reduced, which is suitable for high-frequency applications. It is easy to operate and has high reliability. At the same time, TSOP package has the advantages of simple technology, high yield, low cost, etc., so it has been widely used.
Package comparison
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Compared with FBGA, TSOP is relatively cheap, but its high-frequency advantage is worse than FBGA.
TSOP can be made into SD card, MiniSD card, CF card through SMD, or integrated into different terminal products such as MP3/MP4, mobile memory, with flexibility.In the TSOP packaging mode, the memory chip is soldered on the PCB board through the chip pin, and the contact area between the solder joint and the PCB board is small, which makes it relatively difficult for the chip to heat the PCB board.In addition, when the memory of TSOP packaging mode exceeds 150MHz, it will generate large signal interference and electromagnetic interference.
Encapsulated memory
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In TSOP packaging mode,Memory chipIt is soldered on thePCB board, solder joint and PCB boardcontact area Small size makes it relatively difficult for the chip to heat the PCB board.In addition, when the memory of TSOP packaging mode exceeds 150MHz, it will generate large signal interference and electromagnetic interference.
Development of TSOP Packaging
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Stacked chip packaging is the mainstream of packaging technology development, because it conforms to the trend of packaging technology development, that is, large capacity, high density, multi-function, low cost.Compared with the single chip packaging technology in the past, it has broken the restrictions of realizing large capacity, high density, multi-function and low cost by simply replacing the packaging type. Moreover, due to the emergence of stacking technology, it has revitalized some seemingly outdated packaging types.
2006 is a very important year for TSOP packaging.Because the volume ratio and running speed of TSOP package are lower than that of BGA package, this package type once widely used in DRAM has disappeared in DDR/DDRII.However, with the popularization of digital products, people's demand for memory cards with large capacity, high density and low cost has surged, and it has become the packaging type of NAND memory, second only to SIP.
In terms of the development of TSOP packaging technology, there are mainly TSOP2+0, TSOP2+1, TSOP3+0, TSOP4+0, TSOP5+0, TSOP4+3, etc. The technology has been very mature with high yield.As the chip area becomes larger and larger, in order to solve the shortage of welding space, some new technologies applied in SIP packaging will also begin to appear in TSOP high-density packaging.In order to solve the problem of insufficient flexibility of SIP, TSOPSIP will also become another development direction.
