Integrated circuit is a kind of micro electronic device or component.Use a certain process to transfer thetransistor、resistance、capacitanceandinductanceAnd other components and wiring are interconnected together and made into a small piece or several piecessemiconductorWafer ormediumSubstrate, and then packaged in a tube shell to become a micro structure with the required circuit functions;All the components have formed a whole in structure, which makes electronic components move towards miniaturization, low power consumption, intelligence and high reliability.It uses letters in the circuit“IC”Represents.The inventor of integrated circuit isJack Kilby(Ge based integrated circuits) andRobert Noyce (Si based integrated circuits).Nowadays, most of the applications in the semiconductor industry are silicon based integrated circuits.
Integrated Circuit, abbreviated as IC;As the name implies, it is a circuit with specific functions that integrates a certain number of commonly used electronic components, such as resistors, capacitors, transistors, and the connections between these components through semiconductor technology.It is a new type developed from the late 1950s to the 1960ssemiconductor device 。It is throughoxidation、Photolithography、spread、extension, aluminum evaporation and other semiconductor manufacturing processesCircuitRequired semiconductorsresistance, capacitors and other components and the connecting wires between them are all integrated on a small piece of silicon chip, and then the electronic devices are welded and packaged in a tube shell.The packaging shell has various forms such as round shell type, flat type or dual in-line type.Integrated circuit technology includes chip manufacturing technology and design technology, which are mainly reflected in processing equipment, processing technology, packaging test, batch production and design innovation capabilities.
Why are integrated circuits produced?We know that there is a driving force behind any invention and creation, and the driving force often comes from problems.So what was the problem before IC came into being?Let's take a look at the world's first electronic computer, which was born in 1946 in the United States. It is a giant with an area of 150 square meters and a weight of 30 tons. 17468 computers were used in the circuitElectronic tube7200 resistors, 10000 capacitors, 500000 lines, 150 kW power consumption[1]。Obviously, its most intuitive and prominent problem is that it occupies a large area and cannot be moved;If only these electronic components and wires could be integrated on a small carrier!We believe that many people have thought about this problem and put forward various ideas.A typical example is Darmer, a scientist at the British Radar Research Institute, who proposed at a conference in 1952 that discrete components in the electronic circuit can be made on a single semiconductor chip. A small chip is a complete circuit. In this way, the size of the electronic circuit can be greatly reduced and the reliability can be greatly improved.This is the idea of the early integrated circuit. The invention of the transistor made this idea possible. In 1947Bell Lab Made the firsttransistorBefore that, the realization of current amplification could only rely on the electronic tubes with large volume, large power consumption and fragile structure.Transistors have the main functions of electronic tubes and overcome the above shortcomings of electronic tubes. Therefore, after the invention of transistors, the idea of integrated circuits based on semiconductors soon emerged, and integrated circuits were also invented soon.Jack Kilby and Robert Noyce invented germanium integrated circuit and silicon integrated circuit respectively during 1958~1959.
Now, integrated circuit has played a very important role in all walks of life, and is the cornerstone of modern information society.The meaning of integrated circuit has gone far beyond its original definition, but its core part remains unchanged, that is, "integration". The various disciplines derived from it are mostly around the three issues of "what to integrate", "how to integrate", and "how to deal with the advantages and disadvantages of integration".Silicon integrated circuit is the mainstream, that is, all kinds of components required for a circuit to achieve a certain function are placed on a silicon chip, and the whole formed is called integrated circuit.For "integration", it is easy to understand the house we lived in: many people lived in a rural house when they were young. At that time, the main body of the house might be three or two bungalows, which played the role of a bedroom. A small courtyard at the door was set up with a pair of tables and chairs, which served as a guest room. There was also a small hut beside it, which was a kitchen and a toilet with unique functions,There needs to be some isolation. It may be more than ten meters behind the house... Later, when we arrived in the city or in rural urbanization, we all lived in buildings or suites. In a suite, there are living rooms, bedrooms, kitchens, toilets, and balconies, which may only cover tens of square meters, but they have all the functions of a rural house that originally covered hundreds of square meters,This is integration.
Of course, today's integrated circuits are far more integrated than a suite. Perhaps a modern building can better analogy: there are shops, offices, canteens, hotel apartments on the ground, several floors underground are parking lots, and there is foundation under the parking lot - this is the layout of integrated circuits, analog circuits and digital circuits are separated,The sensitive circuit for processing small signals is separated from the control logic with frequent overturning, and the power supply is placed in a separate corner.The room layout of each floor is different, and the corridor is also different. There are zigzag, I-shaped, and zigzag - this is the design of integrated circuit devices. In low-noise circuits, folded or "interdigital" transistors can be used to reduce the junction area and gate resistance.Each floor is directly accessible by high-speed elevators. For the sake of efficiency and functional isolation, there may be multiple elevators. Each elevator can reach different floors - this is the wiring of integrated circuits. The power lines and ground wires are routed separately, and the lines with large loads are also wide;The clock is separated from the signal;The wiring between each layer shall be vertical to avoid interference;The high-speed bus between CPU and storage is equivalent to an elevator, and the through-hole between floors is equivalent to an elevator lobby
characteristic
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Integrated circuitOr calledMicrocircuit（microcircuit）、Microchip（microchip）、chip（chip）In electronics, it is a way to miniaturize circuits (mainly including semiconductor devices, passive components, etc.), and it is usually manufactured on the surface of semiconductor wafers.
The aforementioned integrated circuit manufacturing the circuit on the surface of the semiconductor chip is also calledfilm(thin film) integrated circuit.Another kind of thick film hybrid integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into the substrate or circuit board.
The integrated circuit has the advantages of small size, light weight, few outgoing lines and welding points, long life, high reliability, good performance, low cost, and is convenient for large-scale production.It is not only widely used in industrial and civil electronic equipment such as radio recorders, televisions, computers, etc., but also widely used in military, communication, remote control, etc.The assembly density of electronic equipment assembled with integrated circuits can be tens to thousands of times higher than that of transistors, and the stable working time of equipment can also be greatly improved.
Analog integrated circuits, also called linear circuits, are used to generate, amplify and process various analog signals (signals whose amplitude changes with time. For exampletransistor radioThe input signal is proportional to the output signal.andDigital integrated circuitIt is used to generate, amplify and process various digital signals (referring to signals that take discrete values in time and amplitude, such as audio signals and video signals of logic control and playback of 5G mobile phones, digital cameras, computer CPUs and digital televisions).
GSIC VLSI is also called VLSI or Giga Scale Integration.
Different conductive types
Integrated circuits can be divided intoBipolar integrated circuitAnd unipolar integrated circuits, they are digital integrated circuits.
Bipolar integrated circuits have complex manufacturing process and high power consumption, and representative integrated circuits include TTL, ECL, HTL, LST-TL, STTL, etc.Monopolar integrated circuits are easy to be made into large-scale integrated circuits due to their simple manufacturing process and low power consumption. The representative integrated circuits include CMOS, NMOS, PMOS and other types.
By use
Integrated circuit
Integrated circuits can be divided intoTelevisionIntegrated circuit, audio integrated circuit, video player integrated circuit, video recorder integrated circuit, computer (microcomputer) integrated circuit, electronic organ integrated circuit, communication integrated circuit, camera integrated circuit, remote control integrated circuit, language integrated circuit, alarm integrated circuit and various special integrated circuits.
1. Integrated circuits for TV include line and field scanning integrated circuits, intermediate amplifier integrated circuits, audio integrated circuits, color decoding integrated circuits, AV/TV conversion integrated circuits, switching power integrated circuits, remote control integrated circuits, Liyin decoding integrated circuits, picture in picture processing integrated circuits, microprocessor (CPU) integrated circuits, memory integrated circuits, etc.
2. Integrated circuits for audio include AM/FM high and intermediate frequency circuitsStereo decoding circuit, audio preamplifier circuit, audio operational amplifier integrated circuit, audio power amplifier integrated circuit, surround sound processing integrated circuit, level driving integrated circuit, electronic volume control integrated circuit, delay reverberation integrated circuit, electronic switch integrated circuit, etc.
3. The integrated circuits used for DVD player include system control integrated circuit, video coding integrated circuit, MPEG decoding integrated circuit, audio signal processing integrated circuit, audio effect integrated circuit, RF signal processing integrated circuit, digital signal processing integrated circuit, servo integrated circuit, electric motor drive integrated circuit, etc.
4. Integrated circuits for video recorders include system control integrated circuit, servo integrated circuit, drive integrated circuit, audio processing integrated circuit and video processing integrated circuit.
5. Computer integrated circuit, including central control unit (CPU), internal memory, external memory, I/O control circuit, etc.
6. Communication integrated circuit
7. Professional control integrated circuit
By application field
Integrated circuits can be divided into standard general purpose integrated circuits and application specific integrated circuits according to their application fields.
By shape
According to the shape, integrated circuits can be divided into circular (metal case transistor package, generally suitable for high-power), flat (good stability, small size) and dual in-line type.
brief history
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Development History of Integrated Circuits in the World
1950: R Ohl and Shockley invented the ion implantation process
1951: Invention of field effect transistor
1956: C S Fuller invented the diffusion process
In 1958, Robert Noyce of Xiantong Company and Kirby of Deyi Company invented integrated circuits every few months, creating the history of microelectronics in the world;
1960: H H Loor and E Castellani invented the lithography process
1962: American RCA Company developed MOS field-effect transistor
1964: Intel Moore proposed Moore's Law and predicted that transistor integration would double every 18 months
1966: RCA Corporation of the United States developed CMOS integrated circuits and the first gate array (50 gates), laying a solid foundation for the development of large-scale integrated circuits today, which is a milestone
1967:Applied Materials(Applied Materials) was established and has become the world's largest semiconductor equipment manufacturing company
1971: Intel launched 1kb dynamic random access memory (DRAM), marking the emergence of large-scale integrated circuits
1971: The world's first microprocessor 4004 was launched by Intel Corporation, which uses MOS technology, which is a landmark invention
1974: RCA Company launched the first CMOS microprocessor 1802
1976: 16kb DRAM and 4kb SRAM
1978: 64kbDynamic random access memoryThe birth of 140000 transistors on a silicon chip less than 0.5 square centimeter marksvlsi(VLSI) era
1979: Intel launched a 5MHz 8088 microprocessor, and then IBM launched the world's first PC based on 8088
1981: 256kb DRAM and 64kb CMOS SRAM came out
1984: Japan announced the launch of 1Mb DRAM and 256kb SRAM
1985: 80386 microprocessor came out, 20MHz
1988: 16M DRAM was introduced, and 35 million transistors were integrated on the silicon chip with the size of 1 square centimeter, marking the entry of the very large scale integrated circuit (VLSI) stage
1989: 1Mb DRAM entered the market
1989: 486 microprocessor was launched, with 25MHz and 1 μ m process, and later 50MHz chip adopted 0.8 μ m process
1992: 64M bit RAM came out
1993: 66MHz Pentium processor was launched, adopting 0.6 μ m process
Integrated circuit
1995: Pentium Pro, 133MHz, 0.6-0.35 μ m process;1997: 300MHz Pentium II was launched with 0.25 μ m process
1999: Pentium III came out, 450MHz, 0.25 μ m process was adopted, and then 0.18 μ m process was adopted
2000: 1Gb RAM launched on the market
2000: Pentium 4 was launched, 1.5GHz, using 0.18 μ m process
2001: Intel announced the adoption of 0.13 μ m process in the second half of 2001.
2003: Pentium 4E series was launched with 90nm process.
2005: Intel Core 2 series came into the market with 65nm process.
2007: Intel Core 2 E7/E8/E9 based on the new 45nm High-K process was launched.
In 2009, Intel Core i series was newly launched, adopting a record leading 32nm process, and the next generation 22nm process is being developed.
Development History of Integrated Circuits in China
1965-1978: With the goal of supporting computers and military industry and the development of logic circuits as the main product, the industrial foundation of integrated circuits and the supporting conditions of related equipment, instruments and materials were initially established
1978-1990: It mainly introduced second-hand equipment from the United States to improve the level of integrated circuit equipment, and at the same time, it solved the problem of localization of color TV integrated circuits by focusing on consumer products
1990-2000: Focusing on 908 Project and 909 Project, taking CAD as the breakthrough point, we did a good job in tackling key problems in science and technology and building research and development bases in the north, serving the information industry, and the integrated circuit industry made new development.
The integrated circuit industry is a general description of the market sales of each link of the integrated circuit industry chain. It not only includes the integrated circuit market, but also includes the IP core market, EDA market, chip OEM market, seal test market, and even extends to the equipment and material market.
The integrated circuit industry no longer depends on the development of CPU, memory and other single devices. Mobile interconnection, triple play, multi screen interactionIntelligent terminalIt has brought multiple market spaces, and business model innovation has injected new vitality into the market.At present, China's integrated circuit industry has a certain foundation. Over the years, China's integrated circuit industry has gathered technological innovation vitality, market expansion ability, resource integration power and broad market potential, laying the foundation for the industry to achieve rapid development and step onto a new stage in the next five to ten years.
Common sense of detection
1. Understand the working principle of integrated circuits and related circuits before testing
Before checking and repairing the integrated circuit, it is necessary to be familiar with the function of the used integrated circuit, the internal circuit, the main electrical parameters, the role of each pin, the normal voltage of the pin, the working principle of the circuit composed of the waveform and the peripheral components.
2. Test to avoid short circuit between pins
Voltage measurement orOscilloscope probeWhen testing the waveform, it is better to measure on the peripheral printed circuit directly connected with the pin to avoid short circuit between the pins.Any momentary short circuit is easy to damage the integrated circuit, especially when testing CMOS integrated circuits in flat packages.
3. Do not useIsolation transformerUse grounded test equipment to contact live TV, audio, video and other equipment on the backplane
It is strictly prohibited to directly test the TV, audio, video and other equipment without power isolation transformer with the instrument and equipment whose shell has been grounded.Although general radio recorders have power transformers, when touching special TV or audio equipment, especially those with large output power or little understanding of the nature of the power supply used, it is necessary to first find out whether the chassis of the radio recorder is charged, otherwise it is very easy to cause power short circuit with live TV, audio and other equipment on the backplane, affecting the integrated circuit, and causing further expansion of the fault.
4. Pay attention to the insulating property of electric soldering iron
It is not allowed to use the soldering iron for welding with electricity. Make sure that the soldering iron is not charged. It is better to ground the shell of the soldering ironMOS circuitBe more careful. It is safer to use 6-8V low-voltage electric soldering iron.
5. To ensure the welding quality
When welding, it is sure to weld firmly. The accumulation of solder and air holes are easy to cause faulty soldering.The welding time generally does not exceed 3 seconds, and the power of the soldering iron should be about 25W of internal heating type.The soldered integrated circuit should be carefully checked. It is better to use an ohmmeter to measure whether there is a short circuit between the pins, and then turn on the power after confirming that there is no solder adhesion.
6. Don't judge the damage of integrated circuit easily
Do not easily judge that the integrated circuit is damaged.Because the vast majority of integrated circuits are directly coupled, once a circuit is abnormal, it may lead to multiple voltage changes, and these changes are not necessarily caused by the damage of the integrated circuit. In addition, in some cases, when the measured voltage of each pin is consistent with or close to the normal value, it does not necessarily mean that the integrated circuit is good.Because some soft faults will not cause changes in DC voltage.
7. The internal resistance of the test instrument should be large
When measuring DC voltage of integrated circuit pins, a multimeter with internal resistance greater than 20K Ω/V on the meter head should be selected, otherwise there will be large measurement errors for some pin voltages.
8. Pay attention to the heat dissipation of power integrated circuits
Power integrated circuitThe heat dissipation shall be good, and it is not allowed to work under high-power condition without radiator.
9. The lead wire should be reasonable
If it is necessary to add peripheral components to replace the damaged parts inside the integrated circuit, small components should be selected, and the wiring should be reasonable to avoid unnecessary parasitic coupling, especially the grounding terminal between the audio power amplifier integrated circuit and the preamplifier circuit.
Meaning of each part of integrated circuit model
Part 0
Part I
Part II
Part III
Part IV
Symbol
significance
accord with
significance
significance
Symbol
significance
accord with
significance
C
C means
made in China
T
TTL circuit
Use digital meter
Indicator
Series code
C
0~70℃
F
Multilayer ceramic flat
H
HTL circuit
G
‐25~70℃
B
Plastic flat
E
ECL circuit
L
‐24~85℃
H
Black porcelain flat
C
cmos circuits
E
‐40~85℃
D
Multilayer ceramic DIP
M
storage
R
‐55~85℃
J
Black porcelain dual in-line plug
µ
Microcomputer circuit
M
‐55~125℃
P
Plastic dual inline
F
Linear amplifier
S
Plastic single in-line plug
W
stabilizer
K
Metal diamond
B
Nonlinear circuit
T
Metal round
J
interface circuit
C
Ceramic chip carrier
AD
A/D converter
E
Plastic chip carrier
DA
D/A converter
G
Network pin grid display
D
Audio and TV circuits
SC
Special circuit for communication
SS
Sensitive circuit
SW
Clock circuit
For example: Schottky 4 input NAND gate CT54S20MD
C - Conform to national standards
T-TTL circuit
54S20-Schottky double 4-input NAND gate
M—‐55~125℃
D - Multilayer ceramic dual in-line package
1、BGA
(ball grid array)
Integrated circuit
Spherical contact array, one of surface mount packages.A spherical bump is made on the back of the printed substrate in an array manner to replace the pin, LSI chips are assembled on the front of the printed substrate, and then sealed with molding resin or potting method.Also known as a bump array carrier (PAC).The pins can exceed 200, which is a kind of package for multi pin LSI.The package body can also be smaller than the QFP (four side pin flatpack).For example, the 360 pin BGA with a pin center distance of 1.5mm is only 31mm square;The 304 pin QFP with a pin center distance of 0.5mm is 40mm square.And BGA does not have to worry about pin deformation like QFP (see the figure).
2、BQFP
(quad flat package with bumper)
Four side pin flatpack with cushioning.QFP packageOne is to set protrusions (buffer pads) at four corners of the package body to prevent pins from bending and deformation during transportation.American semiconductor manufacturers mainly use this package in microprocessors, ASICs and other circuits.The pin center distance is 0.635mm, and the number of pins ranges from 84 to 196 (see QFP).
3、C－
(ceramic)
A mark representing a ceramic package.For example, CDIP represents ceramic DIP.It is a mark often used in practice.
4、Cerdip
Glass sealed ceramic dual in-line package is used for ECL RAM, DSP (digital signal processor) and other circuits.Cerdip with glass window is used for ultraviolet erasable EPROM and microcomputer circuit with EPROM inside.The pin center distance is 2.54mm, and the number of pins ranges from 8 to 42.In Japan, this package is referred to as DIP-G (G means glass seal).
5、Cerquad
Integrated circuit
One of surface mount packages, namely ceramic QFP with lower seal, is used to package logic LSI circuits of DSP, etc.Cerquad with window is used to encapsulate EPROM circuit.Heat dissipation is better than plastic QFP, and 1.5~2W power can be allowed under natural air cooling conditions.However, the packaging cost is 3-5 times higher than that of plastic QFP.The pin center distance is 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm and other specifications.The number of pins ranges from 32 to 368.
The ceramic chip carrier with pins is one of the surface mount packages. The pins are led out from the four sides of the package in a T-shape.Windows are used to package ultraviolet erasable EPROMs and microcomputer circuits with EPROMs.This package is also called QFJ, QFJ-G (see QFJ).
6、COB
(chip on board)
Chip on board packaging is one of the bare chip mounting technologies, and semiconductor chips are transferred and mounted inPrinted circuit boardOn the other hand, the electrical connection between the chip and the substrate is realized by the wire suture method, and the electrical connection between the chip and the substrate is realized by the wire suture method, and is covered with resin to ensure reliability.Although COB is the simplest bare chip mounting technology, its package density is far less than TAB and flip chip bonding technology.
7、DFP
(dual flat package)
Two sided pin flatpack.It is another name of SOP (see SOP).This name was used before, but it was basically not used in the late 1980s.
8、DIC
(dual in-line ceramic package)
Alternative name for ceramic DIP (including glass seal) (see DIP)
9、DIL
(dual in-line)
Alternative name for DIP (see DIP).European semiconductor manufacturers often use this name.
10、DIP
(dual in-line package)
Dual In Line Package.One of the plug-in packages, the pins are led out from both sides of the package, and the packaging materials are plastic and ceramic.DIP is the most popular plug-in package, and its application range includes standard logic IC, memory LSI, microcomputer circuit, etc.The pin center distance is 2.54mm, and the number of pins ranges from 6 to 64.The package width is usually 15.2mm.Some packages with a width of 7.52mm and 10.16mm are called skinny DIP and slim DIP respectively.However, in most cases, it is not differentiated and is simply referred to as DIP.In addition, ceramic DIPs sealed with low melting point glass are also called cerdip (see cerdip).
11、DSO
(dual small out-lint)
Double side pin small outline package.Alternative name of SOP (see SOP).Some semiconductor manufacturers use this name.
12、DICP
(dual tape carrier package)
Integrated circuit
Double side pin loaded package.One of TCP (encapsulation on load).The pins are made on the insulating tape and led out from both sides of the package.Due to the TAB (automatic on load welding) technology, the package is very thin.It is commonly used to drive LSI for LCD, but most of them are customized products.In addition, the memory LSI thin package with a thickness of 0.5mm is under development.In Japan, DICP is named DTP according to the EIAJ (Japan Electronics and Machinery Industry) Association standards.
13、DIP
(dual tape carrier package)
ditto.Naming of DTCP according to the standards of Japan Electronic Machinery Industry Association (see DTCP).
14、FP
(flat package)
Flatpack.One of surface mount packages.Alternative name for QFP or SOP (see QFP and SOP).Some semiconductor manufacturers use this name.
15、flip-chip
Backsolder chips.As one of the bare chip packaging technologies, the metal bump is made in the electrode area of the LSI chip, and then the metal bump is pressure welded with the electrode area on the printed substrate.The footprint of the package is basically the same as the chip size.It is the smallest and thinnest of all packaging technologies.But if the base plateCoefficient of thermal expansionDifferent from LSI chips, it will react at the junction, thus affecting the reliability of the connection.Therefore, LSI chips must be reinforced with resin and substrate materials with basically the same thermal expansion coefficient must be used.
16、FQFP
(fine pitch quad flat package)
Small pin center distance QFP.Usually refers to QFP with pin center distance less than 0.65mm (see QFP).Some conductor manufacturers use this name.
17、CPAC
(globe top pad array carrier)
Alternative name for BGA of Motorola (see BGA).
18、CQFP
(quad fiat package with guard ring)
Four side pin flatpack with guard ring.One of the plastic QFPs, the pin is covered with a resin protective ring to prevent bending deformation.Before assembling the LSI on the printed substrate, cut the pins from the protection ring and make them into a seagull wing shape (L shape).This kind of package has been mass produced by Motorola in the United States.The center distance of pins is 0.5mm, and the maximum number of pins is about 208.
19、H-
(with heat sink)
Indicates a mark with a radiator.For example, HSOP represents SOP with radiator.
20、pin grid array
(surface mount type)
Integrated circuit
Surface mount PGA.Generally, PGA is a plug-in package with a pin length of about 3.4mm.Surface mount PGA has arrayed pins on the bottom of the package, whose length ranges from 1.5mm to 2.0mm.The mounting method is butt welding with the printed substrate, so it is also called butt welding PGA.Because the pin center distance is only 1.27mm, which is half smaller than the plug-in PGA, the package body can be made not too large, and the number of pins is more than the plug-in PGA (250~528), which is a package for large-scale logic LSI.The substrate for packaging includes multilayer ceramic substrate and glass epoxy resin printing base.Packaging with multilayer ceramic substrate has become practical.
21、JLCC
(J-leaded chip carrier)
J-pin chip carrier.Refers to CLCC with window and ceramic QFJ with window (see CLCC and QFJ).Name adopted by some semiconductor manufacturers.
22、LCC
(Leadless chip carrier)
No pin chip carrier.It refers to the surface mount package with only electrode contact but no pins on the four sides of the ceramic substrate.It is a package for high-speed and high-frequency IC, also known as ceramic QFN or QFN-C (see QFN).
23、LGA
(land grid array)
Contact array packaging.That is to say, an array state flat electrode contact package is made on the bottom surface.Insert the socket when assembling.The ceramic LGA with 227 contacts (1.27mm center to center distance) and 447 contacts (2.54mm center to center distance) has been applied to high-speed logic LSI circuits.Compared with QFP, LGA can accommodate more input and output pins in a smaller package.In addition, due to the small impedance of the lead, it is very suitable for high-speed LSI.However, due to the complex production and high cost of sockets, they were hardly used in the 1990s.It is expected that the demand for them will increase in the future.
24、LOC
(lead on chip)
On chip lead packaging.As one of LSI packaging technologies, the front end of the lead frame is a structure above the chip, and a convex solder joint is made near the center of the chip, which is electrically connected by sewing the leads.Compared with the original structure where the lead frame is arranged near the side of the chip, the chip contained in the same size package is about 1mm wide.
25、LQFP
(low profile quad flat package)
Low profile QFP.It refers to the QFP with the package body thickness of 1.4mm, which is the name used by the Japanese Electronic Machinery Industry Association according to the new QFP outline specification.
26、L－QUAD
One of ceramic QFPs.Aluminum nitride is used as the packaging substrate. Its thermal conductivity is 7~8 times higher than that of aluminum oxide, and it has good heat dissipation.The encapsulated frame is sealed with aluminum oxide, and the chip is sealed with potting method, thus inhibiting the cost.It is a package developed for logic LSI, which can allow W3 power under natural air cooling conditions.The LSI logic packages with 208 pins (0.5mm center distance) and 160 pins (0.65mm center distance) have been developed and put into mass production since October 1993.
27、MCM
(multi-chip module)
Multichip module.A package that assembles multiple semiconductor bare chips on a wiring substrate.According to the substrate material, it can be divided into three categories: MCM-L, MCM-C and MCM-D.MCM-L is a component that uses the common glass epoxy resin multilayer printed substrate.The wiring density is not very high and the cost is low.MCM-C is a module that uses thick film technology to form multi-layer wiring, and uses ceramics (alumina or glass ceramics) as the substrate. It is similar to thick film hybrid ICs that use multilayer ceramic substrates.There is no significant difference between the two.The wiring density is higher than MCM-L.
MCM-D is a module that uses thin film technology to form multi-layer wiring, and uses ceramics (aluminum oxide or aluminum nitride) or Si, Al as the substrate.Cabling conspiracy is the highest among the three components, but its cost is also high.
28、MFP
(mini flat package)
Small Flatpack.Alternative name for plastic SOP or SSOP (see SOP and SSOP).Name adopted by some semiconductor manufacturers.
29、MQFP
(metric quad flat package)
A classification of QFP according to JEDEC standards.Refers to the standard QFP with the pin center distance of 0.65mm and the body thickness of 3.8mm~2.0mm (see QFP).
30、MQUAD
(metal quad)
A QFP package developed by American Olin Company.The base plate and cover are made of aluminum and sealed with adhesive.Under natural air cooling conditions, 2.5W~2.8W power can be allowed.Japan Shinko Electric Industry Co., Ltd. was licensed to start production in 1993.
31、MSP
(mini square package)
The alias of QFI (see QFI) is often called MSP at the beginning of development.QFI is the name specified by Japan Electronic Machinery Industry Association.
34、OPMAC(over molded pad array carrier)
Molded resin sealed bump display carrier.The name adopted by Motorola for molded resin seal BGA (see BGA).
32、P－
(plastic)
A mark indicating the plastic package.For example, PDIP means plastic DIP.
33、PAC
(pad array carrier)
Bump display carrier, another name of BGA (see BGA).
34、PCLP
(printed circuit board leadless package)
pcbNo lead encapsulation.The name adopted by Fujitsu for plastic QFN (plastic LCC) (see QFN).lead
The foot center distance is 0.55mm and 0.4mm.
35、PFPF
(plastic flat package)
Plastic Flatpack.Alternative name for plastic QFP (see QFP).Names adopted by some LSI manufacturers.
36、PGA
(pin grid array)
Integrated circuit
Display pin package.One of the plug-in packages, the vertical pins on the bottom of which are arranged in an array.Multilayer ceramic substrate is basically used as packaging substrate.Most of them are ceramic PGAs, which are used for high-speed large-scale logic LSI circuits without special material names.High cost.The pin center distance is usually 2.54mm, and the number of pins ranges from 64 to 447.In order to reduce cost, the packaging substrate can be replaced by glass epoxy resin printed substrate.There are also 64~256 pin plastic PGA.In addition, there is also a short pin surface mount PGA (butt welded PGA) with a pin center distance of 1.27mm.(See surface mount PGA).
37、piggy back
Piggyback packaging.It refers to the ceramic package with socket, and the shape switch is similar to DIP, QFP and QFN.It is used to evaluate program confirmation operation when developing equipment with microcomputer.For example, insert the EPROM into the socket for debugging.This kind of packaging is basically a customized product, which is not very popular in the market.
38、PLCC
(plastic leaded chip carrier)
Plastic chip carrier with leads.One of surface mount packages.The pin leads out from the four sides of the package in a T-shape, which is a plastic product.Texas Instruments first adopted 64k bit DRAM and 256kDRAM, and it has been widely used in logic LSI, DLD (or process logic device circuit) in the 1990s.The pin center distance is 1.27mm, and the number of pins is from 18 to 84.J-shaped pin is not easy to deform and is easier to operate than QFP, but it is difficult to inspect the appearance after welding.PLCC is similar to LCC (also known as QFN).Previously, the only difference between the two was that the former used plastics and the latter used ceramics.But now there are J-shaped pin packages made of ceramics and non pin packages made of plastics (marked as plastic LCC, PC LP, P-LCC, etc.), which can no longer be distinguished.For this reason, the Japan Electronics and Machinery Industry Association decided in 1988 to call the package with J-shaped pins from four sides QFJ and the package with electrode bumps on four sides QFN (see QFJ and QFN).
Sometimes it is another name for plastic QFJ, sometimes it is another name for QFN (plastic LCC) (see QFJ and QFN).part
The LSI manufacturer uses PLCC to indicate package with lead wire and P-LCC to indicate package without lead wire for differentiation.
40、QFH
(quad flat high package)
Four side pin thick body flatpack.It is a kind of plastic QFP. In order to prevent the package body from breaking, the QFP body is made thicker (see QFP).Name adopted by some semiconductor manufacturers.
41、QFI
(quad flat I-leaded packgac)
Four side I-pin flatpack.One of surface mount packages.The pin leads out from the four sides of the package and presents an I word downward.Also called MSP (see MSP).The mounting is connected with the printed substrate by butt welding.Since there is no protruding part of the pin, the mounting area is smaller than QFP.Hitachi Production has developed and used this package for video analog ICs.In addition, the PLL IC of Motorola in Japan also adopts this kind of packaging.The pin center distance is 1.27mm, and the number of pins ranges from 18 to 68.
42、QFJ
(quad flat J-leaded package)
Four sided J-pin flatpack.One of the surface mount packages.The pins lead out from the four sides of the package and downward in J shape.It is the name specified by the Japan Electronic Machinery Industry Association.The pin center distance is 1.27mm.
The materials are plastic and ceramic.In most cases, plastic QFJ is called PLCC (see PLCC), and is used in microcomputer, door display, DRAM, ASSP, OTP and other circuits.The number of pins ranges from 18 to 84.
Ceramic QFJ is also called CLCC, JLCC (see CLCC).The package with window is used for ultraviolet erasable EPROM and microcomputer chip circuit with EPROM.The number of pins ranges from 32 to 84.
43、QFN
(quad flat non-leaded package)
Integrated circuit
Four side no pin flatpack.One of surface mount packages.In the late 1990s, it was often called LCC.QFN is the name specified by Japan Electronic Machinery Industry Association.The four sides of the package are equipped with electrode contacts. Because there is no pin, the mounting area is smaller than QFP, and the height is lower than QFP.However, when the stress is generated between the printed substrate and the package, it cannot be relieved at the electrode contact.Therefore, it is difficult to have as many electrode contacts as QFP pins, generally from 14 to 100.The materials are ceramic and plastic.When there is LCC mark, it is basically ceramic QFN.The center distance of electrode contact is 1.27mm.
Plastic QFN is a low-cost packaging based on glass epoxy resin printed substrate.In addition to 1.27mm, there are 0.65mm and 0.5mm electrode contact center distance.This package is also called plastic LCC, PCLC, P-LCC, etc.
44、QFP
(quad flat package)
Four side pin flatpack.One of the surface mount packages, the pins lead out from the four sides in a seagull wing (L) shape.There are three kinds of substrates: ceramic, metal and plastic.In terms of quantity, plastic packaging accounts for the vast majority.When no special material is indicated, plastic QFP is used in most cases.Plastic QFP is the most popular multi pin LSI package.It is not only used for microprocessor, gate display and other digital logic LSI circuits, but also used for VTR signal processing, audio signal processing and other analog LSI circuits.The pin center distance is 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm and other specifications.The maximum number of pins in 0.65mm center distance specification is 304.
In Japan, QFP with pin center distance less than 0.65mm is called QFP (FP).However, after 2000, Japan Electronics and Machinery Industry Association reassessed the appearance specifications of QFP.There is no difference in the pin center distance, but it is divided into QFP (2.0mm~3.6mm thick), LQFP (1.4mm thick) and TQFP (1.0mm thick) according to the thickness of the package body.
In addition, some LSI manufacturers refer to QFPs with a pin center distance of 0.5mm as retractable QFPs or SQFPs and VQFPs. However, some manufacturers refer to QFPs with a pin center distance of 0.65mm and 0.4mm as SQFPs, so that the name is slightly confused.The disadvantage of QFP is that when the pin center distance is less than 0.65mm, the pin is easy to bend.In order to prevent pin deformation, several improved QFP varieties have emerged.For example, BQFP with tree finger buffer pad at four corners of the package (see BQFP);GQFP with resin protection ring covering the front end of the pin (see GQFP);TPQFP (see TPQFP) that can be tested by setting test bumps in the package body and placing them in a special fixture to prevent pin deformation.In terms of logic LSI, many development products and high reliability products are packaged in multilayer ceramic QFP.The minimum pin center distance is 0.4mm, and the maximum number of pins is 348.In addition, glass sealed ceramic QFP is also used (see Gerqa d).
45、QFP
(FP)(QFP fine pitch)
Small center distance QFP.The name specified in the standards of Japan Electronic Machinery Industry Association.Refers to QFP with pin center distance of 0.55mm, 0.4mm, 0.3mm, etc. less than 0.65mm (see QFP).
46、QIC
(quad in-line ceramic package)
Alternative name for ceramic QFP.Names adopted by some semiconductor manufacturers (see QFP, Cerquad).
47、QIP
(quad in-line plastic package)
Alternative name for plastic QFP.Names adopted by some semiconductor manufacturers (see QFP).
48、QTCP
(quad tape carrier package)
Four side pin loaded package.One of TCP packages, forming pins on the insulating tape and leading out from the four sides of the package.It is a thin package using TAB technology (see TAB, TCP).
49、QTP
(quad tape carrier package)
Four side pin loaded package.The name used by the Japan Electronics and Machinery Industry Association for the appearance specifications formulated by QTCP in April 1993 (see TCP).
50、QUIL
(quad in-line)
Alternative name for QUIP (see QUIP).
51、QUIP
(quad in-line package)
Four pin in-line package.The pins are led out from the two sides of the package, and every other pin is staggered and bent downward into four columns.The pin center distance is 1.27mm. When the printed substrate is inserted, the insertion center distance becomes 2.5mm.Therefore, it can be used for standard printed circuit board.It is a smaller package than standard DIP.Nippon Electric CorporationSome kinds of packages are used in microcomputer chips of desktop computers and household appliances.The materials are ceramic and plastic.Number of pins 64.
52、SDIP
(shrink dual in-line package)
Shrink DIP.One of the plug-in packages with the same shape as DIP, but the pin center distance (1.778mm) is less than DIP (2.54mm),
Therefore, it is called.The number of pins ranges from 14 to 90.It is also called SH － DIP.The materials are ceramic and plastic.
53、SH－DIP
(shrink dual in-line package)
Same as SDIP.Name adopted by some semiconductor manufacturers.
54、SIL
(single in-line)
Alternative name for SIP (see SIP).Most European semiconductor manufacturers use the name SIL.
55、SIMM
(single in-line memory module)
Single row memory assembly.A memory assembly equipped with electrodes only near one side of the printed substrate.Usually refers to the component inserted into the socket.The standard SIMM has two specifications: 30 electrodes with a center distance of 2.54mm and 72 electrodes with a center distance of 1.27mm.SIMM with 1-megabit and 4-megabit DRAM packaged with SOJ on one or both sides of the printed substrate has been widely used in personal computers, workstations and other devices.At least 30-40% of DRAMs are installed in SIMM.
56、SIP
(single in-line package)
Single in-line package.The pins lead out from one side of the package and are arranged in a straight line.When assembled on the printed substrate, the package is in a side standing shape.The pin center distance is usually 2.54mm, and the number of pins ranges from 2 to 23, most of which are customized products.The shapes of packages vary.Others call the encapsulation with the same shape as ZIP SIP.
57、SK－DIP
(skinny dual in-line package)
A type of DIP.It refers to a narrow DIP with a width of 7.62mm and a pin center distance of 2.54mm.Generally referred to as DIP (see DIP).
58、SL－DIP
(slim dual in-line package)
A type of DIP.It refers to a narrow DIP with a width of 10.16mm and a pin center distance of 2.54mm.Generally referred to as DIP.
59、SMD
(surface mount devices)
Surface mount devices.Occasionally, some semiconductor manufacturers classify SOP as SMD (see SOP).
Alternative name for SOP.Many semiconductor manufacturers in the world use this nickname.(See SOP).
60、SOI
(small out-line I-leaded package)
I-shaped pin small outline package.One of surface mount packages.The pins lead out from both sides of the package in a downward I-shape, with a center distance of 1.27mm.The installation area is less than SOP.Hitachi adopts this package in analog IC (IC for motor drive).Number of pins 26.
61、SOIC
(small out-line integrated circuit)
Alternative name of SOP (see SOP).Many foreign semiconductor manufacturers use this name.
62、SOJ
(Small Out-Line J-Leaded Package)
J-pin small outline package.One of surface mount packages.The pins lead out from both sides of the package in a J-shaped downward direction, hence the name.They are usually plastic products, most of which are used in memory LSI circuits such as DRAM and SRAM, but most of them are DRAM.Many DRAM devices packaged with SOJ are assembled on SIMM.The pin center distance is 1.27mm, and the number of pins is from 20 to 40 (see SIMM).
63、SQL
(Small Out-Line L-leaded package)
The name adopted for SOP according to JEDEC (Joint Electronic Equipment Engineering Committee) standards (see SOP).
64、SONF
(Small Out-Line Non-Fin)
SOP without heat sink.Same as the usual SOP.In order to show the difference of no heat sink in the power IC package, the NF (non fin) mark is intentionally added.Names adopted by some semiconductor manufacturers (see SOP).
65、SOP
(small Out-Line package)
Small form factor package.One of the surface mount packages, the pins lead out from both sides of the package in a seagull wing shape (L-shaped).The materials are plastic and ceramic.Also called SOL and DFP.
SOP is not only used for memory LSI, but also widely used for circuits such as ASSP, which is not very large in scale.SOP is the most popular surface mount package in the field where the input and output terminals are no more than 10~40.The pin center distance is 1.27mm, and the number of pins ranges from 8 to 44.
In addition, SOP with pin center distance less than 1.27mm is also called SSOP;SOP with assembly height less than 1.27mm is also called TSOP (see SSOP, TSOP). There is another SOP with heat sink.
66、SOW
(Small Outline Package(Wide-Jype))
SOP for wide body.Name adopted by some semiconductor manufacturers.
manufacture
Since the 1930s,periodic table of ele mentsSemiconductors in the chemical elements in the are considered by researchers such as William Shockley of Bell Laboratories as the most likely raw materials for solid vacuum tubes.From copper oxide to germanium to silicon, raw materials were systematically studied from 1940s to 1950s.Today, although some III-V compounds of the periodic table, such as gallium arsenide, are used for special purposes, such as light-emitting diodes, lasers, solar cells and the fastest integrated circuits, monocrystalline silicon has become the mainstream base of integrated circuits.It took decades to create defect free crystals.
Semiconductor IC manufacturing process, including the following steps, and reuse:
Yellow light (micro shadow)
etching
film
spread
CMP
Single crystal silicon wafer (or III-V family, such as gallium arsenide) is used as the base layer.Then, the MOSFET or BJT and other components are made by using micro imaging, diffusion, CMP and other technologies, and then the wires are made by using micro imaging, thin film, and CMP technologies, thus completing the chip production.Due to product performance requirements and cost considerations, conductors can be divided into aluminum process and copper process.
IC consists of many overlapping layers, each of which is defined by image technology and usually represented by different colors.Some layers indicate where different dopants diffuse into the base layer (become the diffusion layer), some define where additional ions are implanted (implanted layer), some define conductors (polysilicon or metal layer), and some define the connection between conductive layers (via or contact layer).All components consist of specific combinations of these layers.
In a self alignment (CMOS) process, transistors are formed where all gate layers (polysilicon or metal) pass through the diffusion layer.
Resistance structure, the length width ratio of resistance structure, combined with the surface resistance coefficient, determines the resistance.
Capacitive structure, due to size constraints, can only produce very small capacitance on ICs.
The more rare inductance structure can be made on chip or simulated by gyrotron.
Because CMOS devices only guide current conversion between logic gates, CMOS devices consume much less current than two-stage components.
Random access memory(random access memory) is the most common type of integrated circuit, so the device with the highest density is memory, but even the microprocessor has memory.Although the structure is very complex - chip width has been reduced for decades - the layers of integrated circuits are still much thinner than the width.The component layer is made much like a photographic process.Although light waves in the visible spectrum cannot be used to expose component layers because they are too large.High frequency photons (usually ultraviolet light) are used to create the pattern of each layer.Because each feature is very small, for a process engineer who is debugging the manufacturing process,electron microscopeIt is a necessary tool.
in useAutomatic test equipment(ATE) Before packaging, each equipment shall be tested.The test process is called wafer testing or wafer probing.The wafer is cut into rectangular blocks, each called "die".Each good die is connected to the package by the aluminum wire or gold wire soldered on the "pads", and the pads are usually on the edge of the die.After packaging, the equipment shall undergo final inspection on the same or similar ATE used in wafer probing.The test cost can reach 25% of the manufacturing cost of low-cost products, but for low output, large and/or high cost equipment, it can be ignored.
In 2005, the construction cost of a manufacturing plant (usually referred to as semiconductor plant, often referred to as fab, which refers to the manufacturing facility) was more than US $1 billion, because most operations were automated.
Development trend
During the 10 years from 2001 to 2010, China's IC outputAnnual average growth rateOver 25%, the average annual growth rate of integrated circuit sales reached 23%.In 2010, the output of integrated circuits in China reached 64 billion pieces, and the sales volume exceeded 143 billion yuan, 10 times and 8 times of that in 2001, respectively.The scale of China's integrated circuit industry has increased from less than 2% of the total scale of the world's integrated circuit industry in 2001 to nearly 9% in 2010.China has become one of the fastest growing regions in the world's integrated circuit industry in the past 10 years.
The scale of the domestic integrated circuit market has also expanded from 114 billion yuan in 2001 to 735 billion yuan in 2010, an increase of 6.5 times.The ratio of domestic integrated circuit industry scale to market scale has never exceeded 20%.If the sales volume of the integrated circuit industry entrusted by overseas manufacturers is deducted, the actual domestic self-sufficiency rate of China's integrated circuit market is less than 10%, and the integrated circuit products required by the domestic market are mainly imported.In recent years, the import scale of domestic integrated circuits has expanded rapidly, reaching a record US $157 billion in 2010. Integrated circuits have exceeded crude oil for two consecutive years and become the largest import commodity in China.Compared with the huge and rapidly growing domestic market, China's integrated circuit industry, though developing rapidly, is still difficult to meet the requirements of domestic demand.
At present, the rapid development of strategic emerging industries represented by mobile Internet, three networks integration, Internet of Things, cloud computing, smart grid, and new energy vehicles will become a new driving force to promote the development of integrated circuit industry after computers, network communications, and consumer electronics.The Ministry of Industry and Information Technology predicts that the scale of the domestic integrated circuit market will reach 1200 billion yuan by 2015.
The ecological environment for the development of China's integrated circuit industry needs to be optimized urgently. The upstream and downstream collaboration of the industrial chain of design, manufacturing, packaging and testing, as well as special equipment, instruments, materials, etc. is insufficient, and the interaction between chips, software, complete machines, systems, applications, etc. is not close.During the "12th Five Year Plan" period, China will actively explore the virtual integration mode of upstream and downstream of the integrated circuit industry chain, give full play to the role of market mechanism, strengthen cooperation and collaboration between upstream and downstream of the industry chain, and jointly build the value chain.Cultivate and improve the ecological environment, strengthen the organic connection between integrated circuit product design and software, complete machines, systems and services, realize the group leap of enterprises in all links, and enhance the overall competitive advantage of the electronic information industry chain.
2023The general test device outside the components and modules module module will carry out the space environment effect test of large-scale integrated circuits and new semiconductor devices[6]。
Development countermeasures and suggestions
1. Innovative efficiency surpasses the traditional cost static efficiency
In theory, business cost belongs to the category of cost static efficiency, and plays a significant role in the initial stage of industrial development.The rise of external business costs is actually an external driving force for industrial upgrading and innovation.AsHigh tech industryShanghai's integrated circuit industry needs to actively take advantage of such cluster advantages as a complete industrial chain, a high degree of internal networking, and an organic connection with the global production network to realize the ecological relationship of high-tech industrial organism of interaction and symbiosis between enterprises, and effectively guarantee and promote the pace of industrial entrepreneurship and innovation.Facts show that in the 1980s, although the land cost of Silicon Valley was much higher than that of Highway 128, semiconductor companies established in Silicon Valley developed new products 60% faster than companies in other parts of the United States, and delivered products 40% faster.Specifically, hardware and software manufacturers in Silicon Valley have formed a close alliance, which can minimize the cost of related processes from creativity to product manufacturing. That is, through technology intensive association as a basic dynamic entrepreneurial alliance, entrepreneurial costs have been reduced, thus making up for the disadvantage of static business costs[2]。
2. Accurate product and market positioning
Many returned designers believe that Chinese consumers are the best food and clothing parents in the world. Compared with the developed countries in Europe and the United States, our consumers are curious about new products. Generally, they do not return goods or pay compensation.These characteristics provide good market opportunities for the entrepreneurship, innovation and development of design enterprises.Enterprises should be good at discovering product applications and finding markets[2]。
The expansion of design companies is mainly limited by talent and product positioning.Due to the lack of talent team, market and product definition, it is impossible for start-ups to do large projects, which is not suitable for large projects.Most of the existing design enterprises are still suitable for the decentralized market, actively supporting system manufacturers and providing a large number of services.Human intensive business projects are not suitable for European and American companies, but more suitable for us.For example, in the domestic market, if a product can ship 3 million pieces, then the company will do it, and foreign enterprises cannot do it[2]。
3. Create a "new hometown" for international elite talents and give full play to the advantages of overseas returnees
Overseas returnees have done a lot of advanced technology development and research abroad, and have industrial experience in some of the world's top companies. After returning home, they are engaged in the development and application of products in great demand, which is easy to succeed.The research and development of integrated circuit industry is afraid of directional errors and low-level duplication, and overseas returnees know how to do it to succeed[2]。
The typical development model of Shanghai's integrated circuit industry is "returned talent team+overseas work experience+preferential policy support+venture capital", which is particularly obvious in Zhangjiang High tech Park.However, due to the lagging construction of international community, restrictions on household registration policy, lack of international competitiveness of individual income tax policy and other reasons, Zhangjiang has not yet become an open and international high-tech park for overseas senior talents to settle down.The short-term plans of overseas students and the "migratory bird" atmosphere of "doing things" are strong, which is not conducive to the gathering of global high-level talents.We should give full play to Zhangjiang's regional advantages and Pudong's comprehensive
The policy advantages of the supporting reform pilot will change the simple attraction of foreign students into the attraction of high-level talents such as foreign students and foreign elites.Through the construction of the Science City, the international adjustment of individual income tax rates, and the optimization of settlement policies, we will give full play to the tradition of Shanghai's "Shanghai style culture", build Zhangjiang into a new hometown where talents from all over the world gather, live and work in peace, and greatly enhance Zhangjiang's international competitiveness in the competition for high-level talents[2]。
4. Focus on accumulation and overcome the eagerness for quick success and instant benefit
The complexity of the design industry is very high, which requires a strong and stable team and deep accumulation.Accumulation is an insurmountable process of development.The development of China's integrated circuit industry is like playing Go. We can't just compete for the short and the long. We need to compete with each other, not with each other.
The supply of talents in the integrated power industry, especially design talents, has long been the focus of public opinion. Many colleges and universities are eager for quick success and instant benefit in terms of specialty and setting, talent training, and one-sided follow the so-called social hot spots and academic counterparts, resulting in students' basic comprehensive quality and humanities literacy is not high enough, and their knowledge is too narrow.In fact, many design enterprises generally reflect that their criteria for recruiting talents are not simply the so-called professional counterparts, but more emphasis on basic knowledge and comprehensive quality. They generally reflect that college education is too eager for quick success and instant benefit[2]。
5. Promote inter enterprise cooperation and industrial chain cooperation
There are few horizontal connections between domestic enterprises. Outsourcing has just started. Basically, every design enterprise has its own chip and is developing in an all-round way.These factors have restricted the rapid development of enterprises.It is necessary to make full use of the solutions made by some enterprises in South China for foreign countries, so that end customers can directly apply the company's products to the original solutions.In addition, design enterprises should form close strategic partnership with solution providers, channel providers and system manufacturers[2]。
6. Discard the idealized industry university research model
The integration of industry, university and research has always been regarded as a good way to promote the development of high-tech industries, but the results of field research reveal that people have unrealistic illusions in this regard.Many design enterprises surveyed by the author do not expect universities to help make products.The progress required by the company's project is fast, and there is a problem of cooperation time;Colleges and universities generally do not have the ability to make factories more efficient use of plant space, but also apply to the use of research and development centers.The newly developed air cooling system reduces the dependence on external facilities and can be installed at any location. At the same time, it continues to support various T2000 modules that meet STC standards to meet the needs of various tests[2]。
Other information
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After the invention and mass production of transistors, various solid state semiconductor components such as diodes and transistors were used in large quantities, replacing the function and role of vacuum tubes in circuits.In the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible.Compared with the manual assembly circuit using individual discrete electronic components, the integrated circuit can integrate a large number of microcrystalline tubes into a small chip, which is a huge progress.The scale production capacity, reliability and modularization method of circuit design of integrated circuits ensure the rapid adoption of standardized ICs instead of discrete transistors.
IC has two main advantages for discrete transistors: cost and performance.The low cost is due to the fact that the chip prints all components as a unit through photolithography technology, rather than making only one transistor at a time.The high performance is due to the fast switching of components, which consumes less energy, because the components are small and close to each other.In 2006, the chip area ranged from several square millimeters to 350mm ², and each mm ² could reach one million transistors.
The first prototype of integrated circuit was completed by Jack Kilby in 1958, includingBipolar transistor, three resistors and a capacitor.
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:
1. Small scale integrated circuit
The full English name of SSI is Small Scale Integration, with less than 10 logic gates or less than 100 transistors.
2. Medium scale integrated circuit
MSI's full English name is Medium Scale Integration, with 11~100 logic gates or 101~1k transistors.
3. Large scale integrated circuit
The full English name of LSI is Large Scale Integration, with 101~1k logic gates or 1001~10k transistors.
4. VLSI
The full English name of VLSI is Very large scale integration, with 1001-10k logic gates or 10001-100k transistors.
5. VLSI
ULSI's full English name is Ultra Large Scale Integration, with 10001~1M logic gates or 100001~10M transistors.
The full English name of GLSI is Giga Scale Integration, with more than 10000001 logic gates or more than 10000001 transistors.
According to the different signal processing, it can be divided into analog integrated circuit, digital integrated circuit, and mixed signal integrated circuit with both analog and digital.
Development of integrated circuit
The most advanced integrated circuit is the "core" of microprocessor or multi-core processor, which can control everything from computers to mobile phones to digital microwave ovens.Memory and ASIC are examples of other IC families, which are very important for modern information society.Although the cost of designing and developing a complex integrated circuit is very high, the cost of each IC is minimized when it is distributed to products usually in millions.The performance of IC is very high, because the small size brings short paths, making low-power logic circuits can be used in fast switching speed applications.
Over the years, ICs have continued to develop towards smaller dimensions, enabling each chip to package more circuits.This increases the capacity per unit area, which can reduce costs and increase functions - see Moore's Law, the number of transistors in integrated circuits is doubled every two years.In conclusion, with the reduction of overall dimensions, almost all indicators have improved - unit cost and switching power consumption have decreased, and speed has increased.However, the IC integrated with nano level equipment is not without problems, mainly the leakage current.Therefore, the increase in speed and power consumption for end users is very obvious, and manufacturers face the sharp challenge of using better geometry.This process and the expected progress in the next few years are well described in the International Technology Roadmap for Semiconductors (ITRS).
More and more circuits appear in the hands of designers in the form of integrated chips, which makes the development of electronic circuits tend to be miniaturized and high-speed.More and more applications have been transformed from complex analog circuits to simple digital logic integrated circuits.
In 2022, the proposal on promoting the sustainable development of China's integrated circuit industry chain: integrated circuit industry is a strategic, basic and leading industry for national economic and social development, and the lack of weak links in the whole industry chain has become one of the key factors restricting the high-quality development of China's digital economy and influencing the improvement of comprehensive national strength.At this stage, the high-end of China's integrated circuit industry is suppressed by the blockade, and the shortage of middle and low-end production capacity is becoming increasingly serious. There are still some problems that need to be solved urgently.First, the weak capacity of domestic chip enterprises coexists with insufficient market.Second, the United States and the West blocked the high-end equipment with advanced technology in China's integrated circuit industry, forming new industrial barriers.Third, at present, China's integrated circuit industry is in a shortage of talents, and the training of process R&D personnel lacks the support of "production line".To this end, suggestions are as follows: First, give play to the advantages of the new national system and continue to support the development of the integrated circuit industry.Continue and expand major national science and technology projects, and focus on tackling core difficulties.Support the application of the first set and gradually realize domestic substitution.Expand new application fields.Increase the scale of industrial funds and extend the investment cycle.Second, adhere to the long-term industrial layout and deepen the reform of talent training.It is necessary to "make up for shortcomings" and "lengthen the board".Continue to strengthen the training of scientific research personnel and the investment guarantee for basic research personnel, and consolidate the talent base.Third, we will continue to open up to the outside world at a high level and expand and create emerging markets.Actively explore emerging markets related to integrated circuits in the future and support Chinese integrated circuit enterprises to go global.[4]
Popularization of IC
Only half a century after its development, integrated circuits have become ubiquitous, and computers, mobile phones and other digital appliances have become an indispensable part of the modern social structure.This is because modern computing, communication, manufacturing and transportation systems, including the Internet, all depend on the existence of integrated circuits.Even many scholars believe that the digital revolution brought about by integrated circuits is the most important event in human history.
Classification of IC
There are many ways to classify integrated circuits, which can be divided into analog integrated circuits, digital integrated circuits and mixed signal integrated circuits (analog and digital are on one chip) according to their analog or digital nature.
Digital integrated circuits can contain anything from thousands to millions of logic gates, flip flops, multiplexers and other circuits on a few square millimeters.The small size of these circuits makes them have higher speed, lower power consumption and lower manufacturing cost compared with board level integration.These digital ICs, represented by microprocessors, digital signal processors (DSPs) and single chips, use binary to process 1 and 0 signals in their work.
Analog integrated circuits, such as sensors, power control circuits and operational amplifiers, process analog signals.Complete the functions of amplification, filtering, demodulation and mixing.By using analog integrated circuits designed by experts with good characteristics, the burden of circuit designers is reduced, and everything does not need to be designed from the basic transistors.
IC can integrate analog and digital circuits on a single chip to makeAnalog digital converter(A/D converter) and digital to analog converter (D/A converter).This circuit provides a smaller size and lower cost, but you must be careful about signal collisions.
statistical data
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The Statistical Bulletin of National Economic and Social Development of the People's Republic of China in 2021 shows that in 2021, the output of integrated circuits will reach 359.43 billion, an increase of 37.5%.[3]
On February 28, 2023, the National Bureau of Statistics issued the Statistical Bulletin of the National Economic and Social Development of the People's Republic of China in 2022. According to the preliminary accounting, the output of integrated circuits in 2022 will be 324.19 billion pieces, an increase of - 9.8% over the previous year;The export volume of integrated circuits was 273.4 billion, an increase of - 12.0% over the previous year;The import volume of integrated circuits reached 538.4 billion, an increase of - 15.3% over the previous year.[5]
