FBGA(commonly referred to asCSP）It is a plane array pin structure with solder balls at the bottom, so that the installation area required for packaging is close to the chip size.
useBGAThe technology encapsulated memory can increase the memory capacity by two to three times with the same volume,BGAAndTSOPCompared with, it has smaller volume, better heat dissipation performance and electrical performance.BGAPackaging technology has greatly improved the storage capacity per square inchBGAThe memory product of packaging technology has a volume of onlyTSOPOne third of the package;In addition, compared with traditionalTSOPCompared with packaging methods,BGAPackaging has a faster and more effective way of heat dissipation.
CSP and its advantages
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BGADevelopedCSPPackaging technology is gradually showing its new strength,Kingston, Qinmao Technology and other leading memory manufacturers have launched memory products using CSP packaging technology.CSP, full name isChip Scale Package, i.eChip size packagingMeans.As a new generation of chip packaging technologyBGA、TSOPOn the basis of,CSPIts performance has been revolutionary improved.CSPThe ratio of chip area to package area can exceed1：1.14, already quite close1：1The absolute size is onlythirty-twoMm2, about normalBGAOf1/3, only equivalent toTSOPMemory chipAreal1/6。So under the same volume,Memory moduleMore chips can be loaded to increase the capacity of a single chip.That is to say, withBGACompared with packaging, under the same spaceCSPPackaging can triple the storage capacity. Figure 4 shows the comparison of memory chips of three packaging technologies, from which we can clearly see that the memory chip packaging technology is developing towards smaller size.CSPEncapsulated memory is not only small, but also thinnerMetal substrateThe most effective cooling path to the radiator is0.2mmThe reliability of the memory chip after a long time operation is greatly improved, the line impedance is significantly reduced, and the chip speed is also greatly improved.CSPThe electrical performance and reliability of the package are also comparedBGA、TSOPThere has been considerable improvement.Under the same chip areaCSPThe number of pins that can be reached is obviously larger thanTSOP、BGAMore pins（TSOPmostthree hundred and fourRoot,BGAwithsix hundredRoot is limited,CSPIn principle, it can be manufacturedone thousandRoot) so that it can supportI∕OThe number of ports has increased a lot.In addition,CSPencapsulationMemory chipThe central pin of the chip effectively shortens the transmission distance of the signal, reduces its attenuation, and greatly improves the anti-interference and noise resistance performance of the chip, which also makesCSPAccess time ratio ofBGAimprove15%－20%。stayCSPIn the packaging mode of,Memory granuleIt is welded on thePCBOn the plate, due to the welding spot andPCBThe contact area of the board is large, so the heat generated by the memory chip during operation can be easily transmitted toPCBBoard and distribute;TraditionalTSOPIn the packaging mode, the memory chip is soldered on thePCBOn plate, solder joints andPCBThe contact area of the board is small, which makes the chipPCBThe heat transfer of the plate is relatively difficult.CSPThe package can dissipate heat from the back with good thermal efficiency,CSPThe thermal resistance of is35℃/W, andTSOPthermal resistance40℃/W。The test results show that the application ofCSPEncapsulated memory allows transmission toPCBThe heat on the plate is up to88.4%, andTSOPConducted to in memoryPCBThe heat energy on the plate is71.3%。In addition, due toCSPThe chip has a compact structure and low circuit redundancy, so it also saves a lot of unnecessary power consumption, resulting in a relatively low power consumption and operating temperature of the chip.Memory granuleFactory manufacturingDDR333andDDR400Memory is usedzero point one seven fiveMicron manufacturing process, low yield.If the manufacturing process is upgraded tozero point one fiveeven to the extent thatzero point one threeMicron, the yield will be greatly improved.To achieve this level of technologyCSPEncapsulation is inevitable.thereforeCSPEncapsulated high-performance memory is the general trend.
This high-density, compact, flat and thin packaging technology is very suitable for designing small handheld consumer electronic devices, such as personal information tools, mobile phonescamcorder, and digital cameras.
FBGA memory
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FBGA is just a packaging form of components, which is only to reduce the volume and slightly increase the speed.Your computer doesn't need to consider this problem at all, just install the appropriate driver.The memory only needs to update the memory speed
TinyBGA package
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Memory products using TinyBGA packaging technology have a volume of onlyTSOP package1/3 of.The pins of TSOP package memory are led out from around the chip, while TinyBGA is led out from the center of the chip.This method effectively shortens the transmission distance of the signal. The length of the signal transmission line is only 1/4 of that of the traditional TSOP technology, so the signal attenuation is also reduced.This not only greatly improves the anti-interference and anti noise performance of the chip, but also improves the electrical performance.TinyBGA packaging chip can withstand up to 300MHzfsb However, the traditional TSOP packaging technology can only resist 150MHz external frequency.
The memory of TinyBGA package is also thinner (package height is less than 0.8mm), and the effective heat dissipation path from the metal substrate to the heat sink is only 0.36mm.Therefore, TinyBGA memory has higher heat conduction efficiency and is very suitable for long running systems with excellent stability.
