CMOS

Abbreviation for Complementary Metal Oxide Semiconductor
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CMOS is the abbreviation of Complex Metal Oxide Semiconductor. It refers to manufacturing large-scale Integrated circuit chip A technology used or a chip manufactured by this technology is a readable and writable piece on the computer motherboard RAM Chip. Because of the read-write feature Computer motherboard Used to save BIOS settings on Computer hardware The chip is only used to store data after parameters.
voltage control It is an amplification device of CMOS digital integrated circuit Basic unit
The setting of various parameters in BIOS should be done through special procedures. BIOS The setup program is generally integrated into the chip by the manufacturer. When starting up, you can enter the BIOS setup program through a specific key to facilitate the system setup. Therefore, BIOS settings are sometimes called CMOS settings.
Chinese name
Complementary metal oxide semiconductor
Foreign name
Complementary Metal Oxide Semiconductor
Abbreviation
CMOS
General category
PMOS And NMOS
Definition
manufacture large-scale integrated circuit A technology used in a chip or a chip produced by this technology
Basic unit
A voltage controlled amplifier

Terminological information

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abbreviation

In the computer field, CMOS usually refers to the chip that stores the basic computer startup information (such as date, time, startup settings, etc.). Sometimes people confuse CMOS and BIOS. In fact, CMOS is a read/write parallel or serial piece on the motherboard FLASH chip , is used to save BIOS Of hardware configuration And user settings for certain parameters.
Today, CMOS manufacturing process Also used in production Digital video Equipment Photosensitive element , especially Sheet Larger SLR digital camera
In addition, CMOS can also refer to complementary metal oxide half components and processes
So up to now, although they are all called CMOS for process reasons, there are three types of CMOS application area , showing completely different appearance characteristics:
First, it is used to save computer information. CMOS is used as a rewritable chip. In this field, users usually do not care about CMOS hardware problems, but only about the information written on CMOS, that is, BIOS settings system failure Remove the battery on the motherboard and discharge the CMOS to restore the BIOS settings.
Second, in digital image As a low-cost sensor technology, CMOS has been developed Electronics And its photosensitive elements are mainly CCD Or CMOS, especially low-end camera products, while high-end cameras are usually CCD sensor
CMOS
Third, more professional Integrated Circuit Design And manufacturing.
Circuit diagram

set up

Cmos setting diagram
If compatible Desktop computer , and it is the BIOS setup program of Award, AMI and Phoenix, then press Delete key or Keypad You can enter the CMOS setting interface by pressing the Del key on the.
If it is Brand machine (including desktop computers or Notebook computer )If you can't enter CMOS by pressing Delete, you should see the prompt on the computer screen after starting up. Generally, [Press XXX to Enter SETUP] appears, and then we can press the "XXX" key to enter CMOS. The trigger key of the notebook is generally F2 or Delete.
If there is no prompt, check the an instruction manual If you can't find them, try the following keys commonly used by brand computers:
“F2”,“F10”,“ F12 ”, "Ctrl+F10", "Ctrl+Alt+F8", "Ctrl+Alt+Esc", etc.

Setting method

1、 Enter the CMOS setting interface
After turning on or restarting the computer Screen display When "Waiting...", press the "Del" key to enter the CMOS setting interface. Note that if you press too late, the computer will Starting the system , you have to restart your computer. You can press and hold the Del key immediately after startup until you enter CMOS. After entering, you can use Direction key move cursor Select the option on the CMOS setting interface, and then press Enter to enter the sub Menu
2、 Set date
We can modify the computer time by modifying the CMOS settings. Select the first standard CMOS Setup and press Enter to enter the standard setting interface. The format of the date in CMOS is<;; Week><;; Month><;; Date><;; Year>;;, Except that the week is calculated by the computer according to the date, others can be entered by moving the cursor in turn with the number keys. If today is June 1, you can change it to June 2. Of course, you can also use Page Up/ Page Down To modify.
3、 Set startup sequence
If we want to install a new operating system, we generally need to change the starting sequence of the computer to floppy disk (A) Boot or CD( CD-ROM )Start. Select the second option BIOS Features Setup in the CMOS main interface, move the cursor to the boot sequence item, and then use PageUp or PageDown to select modification, where A means to change from Floppy startup , C means boot from hard disk, CD-ROM means boot from CD, SCSI It means to start from the SCSI device. The startup order is determined according to its order. The first one starts from the first one. For example, C: CDROM , A, means to start from the hard disk first. If the hard disk cannot start, start from the CD. If both the hard disk and the CD cannot start, start from the A disk Start. In BIOS feature settings, there are several important options:
① Quick Power On Self Test POST ), when the computer is powered on, a main board The BIOS will perform a series of checks and tests to check the system and Peripheral equipment If Enabled is selected, the BIOS will simplify the self-test steps to speed up power on. [1]
② Boot Up Floppy Seek floppy disk drive Check), when the computer is powered on, the BIOS will check whether the floppy drive exists. When Enabled is selected, if the BIOS cannot check the floppy drive, it will prompt the floppy drive error. If you select Disabled, the BIOS will skip this test.
③ Boot UP NumLock Status. Generally, Keypad (The right part of the keyboard) is used as a number key (the default is ON, and the enabled keypad is a number key). If there is a special need, just change ON to OFF, and the keypad will become a direction key.
④ Security Option
There are two options. If you set it to Setup, you do not need a password when starting up, but you need a password when entering CMOS (of course, you need to set a password in advance), but only Super user The password of can only be used to change various CMOS parameters. The password of ordinary users cannot. If it is set to System, a password is required when starting up (both super user and ordinary user passwords can be used). When CMOS is modified, only super user passwords are available Right to modify
4、 Settings CPU
As the core of the computer, CPU has special settings in CMOS. In the main interface, use the arrow keys to move to "<<<CPU PLUG&PLAY>>>;;", and then we can set various parameters of the CPU. In "Adjust CPU Voltage", set the Core voltage If you want to change this value, use the arrow keys to move to the item, and then use "Page UP/Page Down" or "+/-" to select the appropriate core voltage. Then use the arrow keys to move to "CPU Speed", and use "Page UP/Page Down" or "+/-" to select the applicable frequency multiplication and fsb Note that if there is no special need, beginners should not change the CPU related options at will!
5、 Set Password
CMOS provides users with two password settings, namely super VI SOR/USER PASSWORD. The password setting method is as follows:
1. Select "SUPER Ⅵ SOR PASSWORD" in the main interface, press the Enter key, and the Enter Password appears,
2. The password you entered cannot exceed 8 characters, and the screen will not display the entered password. Press Enter Key,
3. At this time, you will be asked to confirm the password: "Confirm Password". Enter the password you just entered to confirm, and then press Enter to set it.
The common user password is the same as its settings, so it is no longer Say more Has. If you need to delete your previously set password, just select this password and press Enter (do not enter any characters), so you will delete your previously set password. The difference between the passwords of super users and ordinary users is that when entering CMOS, entering the password of super users can modify all the options of CMOS, while ordinary users can only change the password of ordinary users, and cannot modify other parameters in CMOS. The contact is that when the security option is set to SYSTEM, entering any of them can power on.
6、 Set hard disk parameters
If you want to replace the hard disk, you need to set the hard disk parameters in CMOS after installing the hard disk. CMOS has the option of automatically detecting hard disk parameters. Select the "IDE HDD AUTO DETECTION" option in the main interface, and then press the Enter key, CMOS will automatically find the hard disk parameters and display them on the screen, where SIZE is Hard disk capacity , in MB MODE is the hard disk parameter, the first is NORMAL, and the second is LBA The third is LARGE. We type "Y" on the keyboard and press Enter to confirm.
Next, the system detects the remaining three IDE interface If it is detected, it will be displayed. You just need to select it. After detection, it will automatically return to the main interface. At this time, the information of the hard disk will be automatically written into the first option of the main interface - STANDARD CMOS SETUP.
7、 Save Settings
All the changes we have made must be saved before they take effect. Otherwise, all our previous efforts will be wasted. After setting, press ESC Return to the main interface , move the cursor to "SAVE&E XI T SETUP" (store and end setting) to save (or press F10), press Enter, select "Y", and it is OK.

Parameter setting

If CMOS does not provide shutdown operation, software settings can be used as follows:
1) Using opening menu - Run Command , Enter msconfig Instruction;
2) Select the "BOOT. INI" tab to enter BOOT INI setting interface;
3) Select Advanced Options to open the Advanced Options Settings dialog box.

Set content

They generally include the following settable contents:
1. Standard CMOS Setup: standard parameter setting, including date, time, software and hard disk parameters.
2. BIOS Features Setup: Set some system options.
3. Chipset Features Setup: parameter setting of motherboard chip.
⒋Power Management Setup: Power management set up.
⒌PnP/PCI Configuration Setup: Plug and Play And PCI plug-in parameter settings.
6. Integrated Peripherals: integrate the settings of peripherals.
7. Others: hard disk automatic detection, system password, loading default settings, exiting, etc

Battery discharge

Open the main box of the computer, you can see a "round" flat battery on the right side of the motherboard Button cell Also called cmos battery , save mainboard information BIOS settings When I work in an Internet cafe, I often encounter the situation that the host can not be started. Generally, the easy way to work is to unplug the host, which means power cord Remove it from the power box, which is completely powered off. Remove the The button battery Two pieces of metal can be seen, forming up and down, that is, the positive/negative circuit. Connect them and make them short circuited. Press them for a few seconds, and the discharge is basically successful
Another is called small CMOS discharge: also, unplug the power cord from the power box, press the "Start" button in this state, and then try again. The system will also discharge slightly, which can generally solve the problem that the computer cannot be started
It is often heard that computer experts or non experts say, "Forgot the password? Discharge the CMOS." What does this mean?
If you set the access password in the computer, and you happen to forget the password, you will not be able to access the computer. Fortunately, the password is stored in CMOS, and CMOS must have power to keep the data in it. Therefore, we can make the computer "give up" the requirement of password by discharging CMOS. The specific operations are as follows:
Open the chassis, find the button battery on the motherboard, and disconnect it from the motherboard (that is, remove the button battery or adjust the jumper). At this time, the CMOS will lose all information stored internally due to power failure. Then connect the button battery, close the chassis and start the machine. Since the CMOS is blank, it will no longer require you to enter a password. At this time, enter the BIOS setup program and select Main Menu LOADBIOSDEFAULT in Default )Or "LOADSETUPDEFAULT" (the default value of the load setup program). The former starts the computer in the safest way, and the latter enables your computer to play a higher performance.

data recovery

Document CMOS The contents of DAT can be displayed in DEBUG (or PCTOOLS And other tool software), you can also Writeback CMOS, Here is the program for automatically writing back data:
/*Put the A disk CMOS DAT file Write data back to CMOS*/
#include" stdio.h "
main()
{charcmos[64];FILE*fp;inti;
fp=fopen("A:\CMOS.DAT","rb");
fread(&cmos[0],1,64,fp);
for(i=0; i00)

Password

For various reasons, it is sometimes necessary to decode or destroy the CMOS password. At this time, different methods can be adopted according to the specific situation. If you can start the system, but cannot enter the CMOS setting state because you forget or do not know the CMOS password, you can use procedural law To decode the CMOS password, use the program to destroy the settings of the CMOS password:
/*Destroy CMOS password*/
#include
voidfar(*p)()= MK_FP (0xffff,0x0000);
main()
{inti;
for(i=0x34; iDEBUG
―O7010
―O7101
―Q
In addition, you can also write the above operation DEBUG into a program and put it in a file. The specific operations are as follows:
C:\>DEBUG
―A100
XXXX:0100MOVDX,70
XXXX:0103MOVAL,10
XXXX:0105OUTDX,AL
XXXX:0106MOVDX,71
XXXX:0109MOVAL,01
XXXX:010BOUTDX,AL
XXXX:010C
RCX
CX0000
:0C
―NDELCMOS. COM
―W
Writing000Cbytes
―Q
In the future, as long as you can use the floppy disk to start the system, run DELMOS COM can cancel the setting of CMOS.

history

CMOS is readable and writable on the motherboard RAM The chip is used to save the hardware configuration information of the current system and some parameters set by the user. CMOS RAM is powered by the button battery on the motherboard, and information will not be lost even if the system is powered off. The setting and updating of various parameters in CMOS can be realized by specific keys (generally Del key) when starting up. Enter BIOS setup program to set CMOS. Generally, CMOS settings are also called BIOS settings.

CMOS and BIOS

BIOS is a read-write part on the motherboard EPROM or EEPROM Chip, which contains important information and settings of the system system parameter Setup program of (BIOSSetup program); CMOS is a read-write RAM chip on the motherboard, which contains information about system configuration Its contents can be read and written through the setting program. The CMOS RAM chip is powered by a button battery, and the information will not be lost even after the system is powered off. CMOS RAM is not only the storage place for BIOS to set system parameters, but also the result of BIOS setting system parameters.
CMOS, That is: Complementary Metal Oxide Semiconductor storage , is a large-scale application of Integrated circuit chip It is a read-write RAM chip on the PC motherboard. The CMOS RAM chip is powered by the system through a button battery, so the CMOS information will not be lost whether the system is powered off or powered off.
BIOS is a set of computer programs for setting hardware, stored in an EPROM or EEPROM chip on the motherboard, which contains important system information and the setup program for setting system parameters - BIOS Setup program. CMOS, namely, Complex Metal Oxide Semiconductor, is a read-write RAM chip on the motherboard, which is used to save the current system hardware configuration and user's parameter settings. Its contents can be read and written through the setup program. CMOS chip It is powered by the button battery on the motherboard. Even if the system is powered off, the parameters will not be lost. CMOS chip only has the function of saving data, and the modification of various parameters in CMOS must be realized through the BIOS setting program. CMOS RAM is not only the storage place for BIOS to set system parameters, but also the result of BIOS setting system parameters. Therefore, the complete statement should be "setting CMOS parameters through the BIOS setup program". Since BIOS and CMOS are closely related to system settings, the BIOS settings and CMOS settings are the same thing in practice.
BIOS is actually a microcomputer Basic input/output system (BasicInput Output System), its contents are integrated on a ROM chip on the microcomputer motherboard, which mainly stores micro-computer system The most important basic I/O program, system information Setting and startup Power on self-test Program and system startup self-test program, etc.
BIOS functions mainly include the following aspects:
First, BIOS Interrupt service program , that is, between software and hardware in microcomputer system Programming interface , which is mainly used to realize the connection between program software functions and microcomputer hardware. The management of peripheral devices such as floppy disk, hard disk, CD-ROM drive, keyboard and display by the operating system is directly based on the interrupt service program of the BIOS system. The operator can also access INT5, INT13, etc Breakpoint Instead, directly call the BIOS interrupt service program.
BIOS System Setup As mentioned earlier, the configuration record of microcomputer components is placed in a read-write CMOS RAM chip, which mainly stores the basic information of the system, CPU characteristics, software Hard drive , display, keyboard and other components. The "System Setup" is installed in the BIOSROM chip, which is mainly used to set the parameters in the CMOS RAM. This program can enter the setting state by pressing a specific key when starting up, and provides a good interface for operators to use. In fact, this process of setting CMOS parameters is customarily called "BIOS setting".
Third POST power on self-test Program: After the microcomputer is powered on, the system first checks the internal devices by the POST (PowerOnSelfTest) program. Usually complete POST self inspection Will include CPU, 640K Basic memory , 1M and above Extended memory , ROM, mainboard, CMOS memory , serial and parallel port Display card The software and hard disk subsystem and keyboard are tested. Once problems are found in the self inspection, the system will give a prompt message or sound a horn warning.
The fourth is the bootstrap program for BIOS system startup. After the system completes POST self-test, ROMBIOS will first search the software and hard disk according to the startup sequence saved in the system CMOS settings Driver And CD ROM Network server Start the drive effectively, read the operating system boot record, and then control power It is handed over to the boot record, and the boot record completes the smooth startup of the system.

Camera field

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CMOS manufacturing process Also used in production Digital video Equipment Photosensitive element (Common CCD And CMOS), especially Sheet Larger SLR digital camera And then through the Analog-to-digital converter ADC )Transform the acquired image signal into digital signal Output.
Difference between CMOS and CCD

Imaging process

CCD and CMOS image sensor photoelectric conversion The main difference between them lies in the different readout processes of signals; Since CCD has only one (or a few) output nodes for unified readout, the consistency of its signal output is very good; In CMOS chips, each pixel has its own signal amplifier , and their signal output consistency is poor. However, in order to read the whole image signal, the CCD needs to output the Signal bandwidth Wide, while in CMOS chips, each pixel The low bandwidth requirement of the amplifier in the CMOS chip greatly reduces the power consumption of the chip, which is the main reason why the power consumption of the CMOS chip is lower than that of the CCD chip. Although the power consumption is reduced, millions of amplifiers Inconsistency But it brings higher fixed noise, which is the inherent disadvantage of CMOS compared with CCD.

Integration

From the perspective of manufacturing process, CCD Circuits and devices are integrated in semiconductors Single crystal The process is complex, and only a few manufacturers in the world can produce CCD Crystal unit , such as DALSA, SONY Panasonic Etc. CCD can only output Analog electrical signal , subsequent addresses are required decoder , analog converter, image Signal processor Processing, and three sets of power supplies with different voltages are also required Synchronize clock Control circuit, Integration Very low. CMOS is integrated in metallic oxide Of semiconductor material On the other hand, this process can produce tens of thousands of Computer chip and storage device The process of semiconductor integrated circuits is the same, so the cost of producing CMOS is much lower than that of CCD. At the same time, CMOS chip can transform image signal amplifier, signal reading circuit A/D conversion circuit , image signal processor and controller are integrated into one chip, and only one chip is needed to realize all the functions of the camera basic function The integration is very high. This is where the concept of chip level camera came into being. With the continuous development of CMOS imaging technology, more and more companies can provide high-quality CMOS imaging chips, including Micron, CMOS IS, Cypress, etc.
3. Speed
CCD adopts photosensitive output one by one, which can only be output according to the specified program, and the speed is slow. CMOS is controlled by multiple charge voltage converters and row column switches, with much faster readout speed High speed camera All are CMOS cameras. In addition, the CMOS address strobe switch can Random sampling To achieve sub window output, higher speed can be achieved when only sub window images are output.
CCD technological development Early, relatively mature, PN junction or silicon dioxide (SiO two Isolation layer Noise isolation, image quality relative to CMOS Photoelectric sensor It has certain advantages. Due to the high integration of CMOS image sensor and the close distance between components and circuits, the interference is serious image quality Great impact. With the continuous development of CMOS circuit noise elimination technology high-density High quality CMOS image sensor provides good conditions.

Integrated circuit

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CMOS can also refer to complementary metal oxide semiconductor and manufacturing process. Under the same functional requirements.
Since 1958, the United States Texas Instrument company( TI )Invention Integrated circuit After IC, with the development of silicon plane technology, two important integrated circuits, bipolar and MOS, were invented in the 1960s Electronic tube and transistor The era of manufacturing electronic complete machines has witnessed a leap in quantity and quality.
MOS Yes: Metal- oxide -The transistor with semiconductor structure is called MOS transistor for short, which can be divided into P-type MOS transistor and N-type MOS transistor. The integrated circuit composed of MOS tubes is called MOS integrated circuit By PMOS tube The complementary MOS integrated circuit composed with NMOS transistor is CMOS-IC (Complementary MOS Integrated Circuit)。
Digital integrated circuit Press Conductivity type Can be divided into Bipolar integrated circuit (Mainly TTL )And unipolar integrated circuits (CMOS NMOS , PMOS, etc.). cmos circuits Single door of Static power consumption In nanowatts (nw) Order of magnitude

Circuit Principle

C MOS , the full name is Complex Metal Oxide Semiconductor, which is a large-scale application of Integrated circuit chip Raw materials for manufacturing. Coupled metal oxide semiconductor field effect transistors (MOSFETs) can be integrated on a silicon chip using CMOS technology. This technology is usually used for production RAM And Exchange application system In the computer field, it usually refers to the RAM chip that stores the basic computer startup information (such as date, time, startup settings, etc.). [2]
CMOS is composed of PMOS transistor and NMOS transistor, and its characteristics are low power consumption Because a pair of MOS in CMOS Gate circuit At the instant, either PMOS is on, NMOS is on, or both are off, which is more linear than triode BJT )The efficiency is much higher, so the power consumption is very low.
Relative to other logical series, CMOS logic circuit It has the following advantages:
1. The allowable power supply voltage range is wide and convenient Power circuit Design of
2、 Logical swing Large, make the circuit Anti interference capability strong
4、 Barrier The structure of the CMOS device Input resistance Extremely, which enables CMOS devices to drive similar devices Logic gate Is much better than other series

advantage

Relative to other logical series, CMOS logic circuit It has the following advantages:
1. The allowable power supply voltage range is wide, facilitating the design of power circuit
2. Large logic swing makes the circuit have strong anti-interference ability
4. The isolation gate structure makes the input resistance during CMOS extremely high, so that the ability to drive similar logic gates during CMOS is much stronger than other series
CMOS developed later than TTL, but it gradually replaced TTL in many occasions with its higher advantages.
After comparing the performance of the two, we can see the reason.
1. CMOS is Field effect transistor Composition, TTL is Bipolar transistor constitute
2. CMOS Logic level The range is relatively large (5~15V), and TTL can only work at 5V
3. The level of CMOS level There is a big difference between them Immunity Strong, TTL has small difference and poor anti-interference ability
4. CMOS power consumption is very low, and TTL power consumption is high (1~5mA/gate)
5. CMOS working frequency It is slightly lower than TTL, but the high-speed CMOS speed is almost the same as TTL.

detailed information

1, TTL level
output High level >2.4V, output Low level <0.4V。 At room temperature, the general output high level is 3.5V, and the output low level is 0.2V. Minimum input high level and low level: input high level>=2.0V, input low level<=0.8V, Noise tolerance It is 0.4V.
2, CMOS level
The 1 logic level voltage is close to the power supply voltage, and the 0 logic level is close to 0V. It also has a wide noise tolerance.
3. Level conversion circuit:
Because the high and low level values of TTL and CMOS are different (ttl5v<==>cmos 3.3v), level conversion is required when connecting to each other: that is, two resistors are used to divide the level voltage, and there is nothing profound.
4. Drive door circuit
OC door, i.e Open collector Gate circuit, OD gate, i.e. open drain gate circuit, must be externally connected Pull up resistance And power supply can use the switch level as the high and low level. Otherwise, it is generally used as a switch for high voltage and large current Load, so it is also called driving gate circuit.
5. Comparison of TTL and CMOS circuits:
1) TTL circuit Is current Control device CMOS circuits are voltage control devices.
2) The TTL circuit is fast and transmits delay time Short (5-10ns), but high power consumption.
CMOS circuit has slow speed and long transmission delay (25-50ns), but low power consumption.
The power consumption of CMOS circuit and Input signal Of Pulse frequency It is normal that the higher the frequency, the hotter the chipset.
3) CMOS circuit Lock-in effect (Prime effect):
The internal current of CMOS circuit increases sharply due to too large current input. The current increases all the time unless the power supply is cut off. This effect is the lock-in effect. When the locking effect is generated, the internal current of CMOS can reach more than 40mA, which is easy to burn the chip.
Defensive measures:
1) Add Clamp circuit , so that the input and output do not exceed the specified voltage.
2) Power input terminal of the chip decoupling Circuit to prevent instantaneous high voltage at VDD end.
3) On VDD And external power supply Current limiting resistor , even if there is a large current, it will not be allowed to enter.
4) When the system is powered by several power supplies respectively, the switch shall be in the following order: when it is turned on, the power supply of CMOS circuit shall be turned on first, and then the power supply of input signal and load shall be turned on; When turning off, first turn off the power supply of input signal and load, and then turn off the power supply of CMOS circuit.
6. Precautions for use of CMOS circuit
1) CMOS circuit is a voltage control device, and its total input impedance is very large interference signal The ability to capture is very strong. Therefore, the unused pin shall not be suspended, and the pull-up resistor or Pull down resistance , give it a constant level.
2) Input Termination Low internal resistance Of signal source The current limiting resistor shall be connected in series between the input terminal and the signal source to limit the input current within 1mA.
3) When extended signal Transmission line In CMOS circuit Termination Matching resistance.
4) When the input terminal is connected with large capacitance Protective resistance The resistance value is R=V0/1mA V0 is the voltage on the external capacitance.
5) If the input current of CMOS exceeds 1mA, it may burn out CMOS.
7. Input terminal in TTL gate circuit Load characteristics (Handling of special cases of input terminal with resistance):
1) When suspended, it is equivalent to the high level of the input terminal. Because it can be regarded as an input terminal connected with a Infinity Resistance of.
2) After the 2.5K resistor is connected in series at the input end of the gate circuit, the low level is input, and the input end presents a high level rather than a low level. Because it can be known from the load characteristics of the input end of the TTL gate circuit (based on the 74 series TTL inverter For example, only when the series resistance connected to the input terminal is less than 910 Ω, the low-level signal it inputs can be recognized by the gate circuit, and if the series resistance is higher than 2.5K, the input terminal will always show a high level. This must be noted. CMOS gate circuits do not need to consider these.
8. Output processing of TTL and CMOS circuits
TTL circuit has Open collector OC gate and MOS tube also have and collector Corresponding Open drain Its output is called Open drain output OC gate has leakage current output when it is cut off, which is leakage current. Why does it have leakage current? That's because when the triode turns off, its Base current Approximately equal to 0, but it is not really 0. The current passing through the collector of the triode is not really 0, but about 0. This is the leakage current. Open drain output: the output of OC gate is open drain output; The output of OD gate is also open drain output. It can absorb a large amount of current, but can not output the current outward. Therefore, in order to input and output current, it should be used in accordance with the power supply and Pull up resistance Use them together. OD gate is generally used as output buffer/ Driver Level converter And large absorption load current Needs.
9. What is Totem pole What is the difference between it and open drain circuit?
In TTL integrated circuit, the output connected with pull-up triode is called totem pole output The one without is called OC gate. Because TTL is a three-level tube, and totem pole is a push-pull connection between two three-level tubes. So pushing and pulling is totem. General totem output, high level 400UA, low level 8MA

manufacturing process

1. p Hydrazine CMOS process
N-type with light doping in p-hydrazine CMOS process substrate Prepare PMOS devices. In order to make N-type device, it is necessary to make P-hydrazine on N-type substrate first, and make NMOS device in p-hydrazine.
The typical P-hydrazine silicon gate CMOS process, from substrate cleaning to intermediate testing, has more than 50 processes in total, requiring 5 times ion implantation , together with the etching and passivation window, 10 times in total Photolithography The following is combined with the main technological process The forming process of elements in P-hydrazine silicon gate CMOS integrated circuits is introduced.
(1) Light 1 - photolithography of hydrazine area, marking the injection hole of hydrazine area.
(2) Hydrazine zone injection and promotion to form hydrazine zone.
⑶ SiO2 removal, long thin oxygen, long Si3N4
(4) Light 2 - reverse etching Active region (Photolithography field area), reverse engraving the source, drain and gate area of P tube and N tube.
(5) Light 3 - lithography N tube field area, cut the glue on N tube area, and expose the injection hole of N tube field area. N tube field injection to improve field opening and reduce Latch up effect And improve hydrazine exposure.
(6) Long Field oxide layer , Si3N4, thin SiO2 Gate oxide
(7) Light 4 - photolithography P-tube area. P Tube area injection, adjust the Opening voltage , then long polysilicon
(8) Light 5 - reverse etching of polysilicon to form polysilicon gate and polysilicon resistance.
(9) Light 6 - lithography of the P+area, cutting off the glue on the P tube and other P+areas. P+area injection, forming the source Leaky area And P+ Protective ring
(10) Light 7 - Lithograph the N+area, and remove the glue on the N+area. The N+area is injected to form the source, drain area and N+protection ring of the NMOS tube.
(11) Long PSG
(12) Light 8 - photolithographic lead hole. Can grow Phosphosilicate glass After that, first open the primary hole, and then open the second hole after the phosphorus silicon glass reflux and junction injection are advanced Secondary hole
(13) Light 9 - reverse engraved aluminum lead.
(14) Light 10 - photolithography Pressure welding Block.

Development history

Early Split CMOS Logic element Only "4000 series"( RCA 'COS/MOS' process). By the time of the later "7400 series", many logic chips can already use CMOS, NMOS, or even BiCMOS (Double carrier Complementary metal oxygen half) process.
Early CMOS components and major competitor BJT is very vulnerable to electrostatic discharge (Electrostatic Discharge, ESD). And the new generation CMOS chip Most of the output and input pins (I/O pins) and power and ground terminals are equipped with ESD protection circuit To avoid internal Circuit element Of the grid or element PN junction (PN Junction) is burned by a large amount of current caused by ESD. However, most chip manufacturers still warn users to use anti-static measures as far as possible to prevent semiconductor components from being damaged by energy beyond the capacity of ESD protection circuit, such as installation Memory module reach personal computer Users are usually advised to wear anti-static bracelets and other equipment when installing.
In addition, early CMOS Logic element The operating range (e.g. 4000 series) can range from 3 volts to 18 volts DC voltage Therefore, the gate of CMOS components uses aluminum as the material. For many years, most of the logic chips made with CMOS also operated under 5 volts of TTL standard specifications. Until 1990, more and more low-power requirements and signal specifications appeared, replacing TTL, which has a relatively simple signal interface, but its power consumption and speed can not keep up with the needs of the times. In addition, as the size of MOSFET components becomes smaller and smaller, the thickness of the gate oxide layer becomes thinner and thinner, and the grid voltage that can withstand becomes lower and lower. Some of the latest CMOS processes have even seen operating voltages below 1 volt. These changes not only further reduce CMOS chips Power consumption And make the performance of components better and better.
Most modern CMOS gates are made of polysilicon. Compared with the metal gate, the advantage of polysilicon is that it has a wide temperature tolerance range, which makes the annealing process after ion implantation more successful during the manufacturing process. In addition, it is also possible to use self align when defining the grid area, which can reduce the grid area and further reduce the Stray capacitance (stray capacitance)。 After 2004, some new research began to use metal gates, but most of the manufacturing processes are still polysilicon gates. With regard to the improvement of grid structure, there are many studies focused on the use of different grid oxide materials to replace silicon dioxide , such as using high dielectric coefficient Dielectric material (high-K dielectrics) to reduce the gate leakage current.

Other abbreviations

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Research on Media Optimization

(Cross Media OptimizationStudy)
IAB's Internet Advertising Bureau has cooperated with well-known brands since 2003 Advertisers , Media Media Agency And other participants to jointly promote XMOS cross media optimization study to attract Dove McDonald's , Ford, ING and other brands, and Google ,Yahoo, AOL , MSN, cnet and other media.
IAB in the UK, Europe Australia etc. Internet advertising The synchronous promotion of more mature countries has formed very effective guidance and help for improving the ROI of advertising.
Dynamic Logic, a research company, has also promoted cross media research in the US market, including TV, Internet, flat media, outdoor and other media evaluations, to help advertisers optimize media and marketing methods.

Relevant technical terms

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complementary metal oxide semiconductor ( CMOS )Complementary metal oxide semiconductor
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Silicon-on-insulator CMOS Silicon insulator CMOS
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High speed Cmos With TTL thresholds (as in 74HCT245) CMOS Device (if 4HCT245)
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High speed Complex Metal Oxide Semiconductor CMOS
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Bipolar- CMOS -DMOS bipolar complementary metal oxide semiconductor double diffusion metal oxide semiconductor
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Advanced CMOS Logic (as in 74ACL245) Advanced CMOS Logic (e.g. 74 ACL245)
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Advanced CMOS Frame Aligner Advanced CMOS Frame calibrator