Manufacturing process refers to manufacturingCPUorGPUOr the size of the transistor gate circuit, in nanometers (nm).The mainstream CPU process has reached 7-14nm (the third generation of AMD has fully adopted the 7nm process, and the ninth generation of Intel has fully adopted the 14nm process). The higher development process has even reached 4nm or higher. The officially commercially available Qualcomm 855 has adopted the 7nm process.[1]
More advanced manufacturing technology can integrate more transistors inside the CPU and GPU, so that the processor has more functions and higher performance;More advanced manufacturing technology will reduce the thermal design power consumption (TDP) of the processor, so as to solve the problem of increasing processor frequency;More advanced manufacturing technology can also further reduce the core area of the processor, that iswafer It can produce more CPU and GPU products, directly reducing the cost of CPU and GPU products, which will ultimately reduce the sales price of CPU and GPU to the benefit of consumersThe development history of the processor itself fully illustrates this point. Advanced manufacturing technology not only improves the performance and function of the CPU, but also effectively controls the cost.
CPU manufacturing process refers to the processing of various circuits andelectronic component, manufacturing wires to connect various components, etc.Now its production precision is expressed in nanometers (previously in micrometers). The higher the precision, the more advanced the production process.More electronic components can be accommodated in the same material, and the thinner the connecting wire is, which is conducive to improving the CPU integration.The nanometer number of manufacturing process refers toICDistance between internal circuits.The trend of manufacturing technology is to develop in the direction of higher density. The higher density of IC circuit design means that in the same size and area of IC, there can be circuit designs with higher density and more complex functions.The development and progress of microelectronics technology mainly depends on the continuous improvement of process technology.Since 1971, the chip manufacturing process has gone through 10 microns, 6 microns, 3 microns, 1.5 microns, 1 micron, 800 nanometers, 600 nanometers, 350 nanometers, 250 nanometers, 180 nanometers, 130 nanometers, 90 nanometers, 65 nanometers, 45 nanometers, 32 nanometers, 22 nanometers, 14 nanometers, and 10 nanometers. It has been developed to the latest 7 nanometers (2019), and 5 nanometers will be the development goal of the next generation CPU.
On January 3, 2017,QualcommIn CES2017, it officially launched its latest top mobile platform, the Qualcomm Snapdragon 835 processor integrated with X16 LTE.Snapdragon 835 processor is the first mobile platform that uses 10nm FinFET process node to realize commercial manufacturing.[2]
GPU
NVIDIA's GM200 chip adopts a 28nm manufacturing process
The manufacturing process of graphics card actually refers toShow CoreIt refers to the size of the transistor gate circuit. At present, it is mainly in nanometer (nm).The manufacturing process of display chip is the same as that of CPU, and its machining accuracy is measured by micrometer.The improvement of manufacturing technology means that the display chip will be smaller, more integrated, and can accommodate more transistors.anda central processorSimilarly, the core chip of the display card is also made on a silicon chip.MicroelectronicsThe development and progress of the technology mainly depend on the continuous improvement of the process technology. Since 1995, the display chip manufacturing process has developed from 0.5 μ m, 0.35 μ m, 0.25 μ m, 0.18 μ m, 0.15 μ m, 0.13 μ m, 0.11 μ m, 90 nm, 80 nm, 65 nm, 55 nm, 40 nm, 28 nm, 16 nm, 12 nm to the current 7 nm process.AMD, a graphics card manufacturer, has three 7nnm process graphics cards on sale.[3]
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Silicon purification
manufacturing process
The material used to produce chips such as CPU and GPU is semiconductor. At present, the main material is silicon silicon, which is a non-metallic element. From a chemical point of view, because it is at the junction of metal element area and non-metallic element area in the periodic table of elements, it has the nature of semiconductor and is suitable for manufacturing various small transistors. It is most suitable for manufacturing modernlarge-scale integrated circuitOne of the materials.
In the process of silicon purification, the raw material silicon will be melted and put into a huge quartz furnace.At this time, a seed crystal is put into the furnace so that the silicon crystal grows around the seed crystal until a nearly perfect single crystal silicon is formed.In the past, the diameter of silicon ingot is mostly 200mm, while CPU or GPU manufacturers are increasing 300mmwafer Production.
Cut wafer
manufacturing process
The silicon ingot is made and shaped into a perfect cylinder. Next, it will be cut into sheets, calledwafer 。Wafers are really used for CPU and GPU manufacturing.The so-called "cutting wafer" is to cut a piece of silicon wafer with predetermined specifications from a single silicon bar by a machine and divide it into several small areas, each of which will become a core of a processor (Die).Generally speaking, the thinner the wafer is cut, the more processor products can be produced with the same amount of silicon materials.
photocopy
（Photolithography）
The silicon oxide layer obtained by heat treatment is coated with a photoresistive material. Ultraviolet rays irradiate the silicon substrate through the template printed with the complex circuit structure pattern of the processor, and the photoresistive material is dissolved where the ultraviolet rays irradiate.In order to avoid the areas that do not need to be exposed from the interference of light, masks must be made to cover these areas.This is a rather complicated process, and the complexity of each mask must be described with 10GB data.
This is an important operation in the production process of CPU and GPU, and also a key technology in the processor industry.Etching technology has pushed the application of light to the limit.Etching uses very short wavelength ultraviolet light with a large lens.Short wavelength light will shine through the holes of the quartz mask on the photoresist film to expose it.Next, stop lighting and remove the mask. Use a specific chemical solution to clean the exposed photoresist film and a layer of silicon next to the photoresist film.
Then, the exposed silicon will be bombarded by atoms, making the exposed silicon substrate locally doped, thus changing the conductive state of these areas to produce N wells or P wells. Combined with the substrate manufactured above, the processor gate circuit will be completed.
Duplicate Tiering
manufacturing process
In order to process a new layer of circuit, silicon oxide is grown again, then a layer of polysilicon is deposited, photoresist is coated, and the process of photocopying and etching is repeated to obtain a trench structure containing polysilicon and silicon oxide.Repeat several times to form a 3D structure, which is the core of the final CPU and GPU.The middle of each layer shall be filled with metal as conductor.
encapsulation
manufacturing process
At this time, the CPU or GPU is a blockwafer It can not be directly used by users. It must be sealed into a ceramic or plastic enclosure, so that it can be easily installed on a circuit board.The packaging structures are different, but the more advanced the processor packaging is, the more complex it is. The new packaging can often improve the electrical performance and stability of the chip, and indirectly provide a solid and reliable foundation for the improvement of the main frequency.
manufacturing process
Multiple tests
manufacturing process
Testing is an important part of processor manufacturing, and also a necessary test before a processor leaves the factory.This step will testwafer To check whether there are any errors and what steps (if possible) these errors occur.
Before the CPU or GPU is put into the packaging box, the last test is generally required to ensure the accuracy of the previous work.According to the different constitutions of the processors determined by the previous tests, they are put into different packages and sold all over the world.
