Aurexel MD

    • Cyanide-free electroless Au plating solution  and capable of forming micro-bump.
    • Capable of treating condition of neutral pH and low temperature and excellent operability and safety.
    • Capable of embedding and via sidewall thick plating.
    • Au plating speed is 2μm/hr and its hardness is 80~90Hk.


Au bump with Φ10μm, height of10μm
Cross section after FIB processing

Product Line

Products Temperature(℃) pH Features
Aurexel MD 50~60 7.0~7.5 Cyanide-free

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