Jiupeng 30nm nano silica (special for epoxy resin)

Nano silica has strong electronic and electrical properties, which can greatly improve the properties of materials. Nano silica CY-SP30 is treated with special epoxy resin coupling agent to produce epoxy resin specific nano silica (CY-SP30S), which has better dispersion, can greatly improve the tensile strength, impact strength, elongation at break, thermal stability and other properties of epoxy resin, and maintain transparency

★ Application characteristics

1. Heat resistance:

Because the specific surface area of nano silica particles is large, the interface between nano silica particles and epoxy matrix is strong, absorbing a lot of impact energy, and also increasing the stiffness of the matrix, nano silica particles can strengthen and toughen the epoxy resin within a certain range, and also improve the heat resistance of the material

2. Strengthening and toughening:

Due to the addition of nano silica particles, the impact strength, tensile strength, elongation at break and other properties of epoxy resin composites have been greatly improved within a certain range, which indicates that nano silica particles play a role in strengthening and toughening. It highlights the excellent filling characteristics of nano silica, which greatly improves the material properties

3. Dispersive effect:

Due to the small size and high surface activity of nanoparticles, they are easy to agglomerate and lose their due role in strengthening and toughening the polymer. Therefore, when preparing nanoparticles filled composites, nanoparticles should be fully dispersed. Grinding, high-speed shearing, ball milling, sanding, ultrasonic and other treatments will help to disperse nanoparticles in the resin

★ Usage

Add the nano silica treated by silane coupling agent into the solvent under stirring state, and then treat it for tens of minutes with milling, high-speed shearing, ball milling, sanding, ultrasonic, etc. In the stirring state, the above solution and the epoxy resin are mixed evenly, the solvent is removed, and the temperature is raised to 130 ℃, so that the coupling agent reacts with the epoxy resin for 1 h. After cooling, the stoichiometric curing agent is added, mixed evenly, evacuated and degassed, and then poured into the steel mold coated with the release agent and preheated. After the temperature is programmed to cure completely, the film is cooled and removed.

★ Amount added

The recommended addition amount is 100:5 mass ratio of epoxy resin to nano silica. Customers can also choose the appropriate addition proportion according to their own actual situation.

★ Packaging

10kg/bag

★ Storage method

Nano silica should be stored in a dry and closed environment and should not be exposed to volatile substances.