XC3SD1800A-4CSG484 New Original Schematic Diagram Functional Circuit Principle of Each Pin Chip Pin Definition - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  • Shenzhen Yihao Technology Co., Ltd

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  • XC3SD1800A-4CSG484C  Grade III spot
  • number 1450 
  • manufactor XILINX 
  • encapsulation FBGA 
  • Batch No 24+ 
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  • HECC GROUP CO.,LIMITED

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  • XC3SD1800A-4CSG484C  Grade III spot
  • number 1736 
  • manufactor XILINX 
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  •  QQ:3003819484 QQ:3003818780
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  • Shenzhen Wangnengxin Technology Co., Ltd

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  • manufactor XILINX/Xilinsi
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  • thirteen billion six hundred and two million five hundred and forty-nine thousand seven hundred and nine  QQ:2881495751
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  • Shenzhen Hengjia Microelectronics Co., Ltd

      This member has used this website for more than 12 years
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  • number 255 
  • manufactor XILINX 
  • encapsulation BGA 
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  • XC3SD1800A-4CSG484  Spot stock
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  • manufactor Xilinx Inc. 
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  • HECC GROUP CO.,LIMITED

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  • Shenzhen Mercury Electronics Co., Ltd

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  • encapsulation 484-LCSBGA 
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  • Shenzhen Lingchuangwei Technology Co., Ltd

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  • number 8442 
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  • Shenzhen Changhe Shengli Electronics Co., Ltd

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  • Shenzhen Xiangda Electronics Co., Ltd

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  • number 1800 
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  • Shenzhen SECCO Century Electronics Co., Ltd

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  • number 54820 
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  • Shenzhen Xinmai Industrial Co., Ltd

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  • Shenzhen Guangbaili Electronics Co., Ltd

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  • number 18500 
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  • Shenzhen Tuoyixian Electronics Co., Ltd

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  • Shenzhen Xiangda Electronics Co., Ltd

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  • Shenzhen Keyu Electronics Co., Ltd

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  • manufactor XILINX 
  • encapsulation BGA-484 
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  • Shenzhen Wangnengxin Technology Co., Ltd

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  • XC3SD1800A-4CSG484
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  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • Shenzhen brand new original stock
  •  QQ:2881495751
  • thirteen billion six hundred and two million five hundred and forty-nine thousand seven hundred and nine  QQ:2881495751
  •  XC3SD1800A-4CSG484 drawing
  • Shenzhen Hecheng Semiconductor Co., Ltd

      This member has used this website for more than 11 years
  • XC3SD1800A-4CSG484
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  • manufactor XILINX 
  • encapsulation BGA 
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  • Only original and genuine products, available in Shenzhen
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  • eighteen billion nine hundred and twenty-nine million three hundred and thirty-six thousand five hundred and fifty-three  QQ:2276916927 QQ:1977615742
  •  XC3SD1800A-4CSG484C drawing
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  • XC3SD1800A-4CSG484C
  • number 12797 
  • manufactor XILINX 
  • encapsulation BGA 
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  • Original factory and spot sold
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  • Shenzhen Dejie Core City Technology Co., Ltd

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  • number 3274 
  • manufactor XILINX/Xilinsi
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  • manufactor XILINX/Xilinsi
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  • Shenzhen Tuoyixian Electronics Co., Ltd

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  • Shenzhen Dejie Core City Technology Co., Ltd

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  • Shenzhen Hengdayi Technology Co., Ltd

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  • number 6500 
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  • number 19948 
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  • Shenzhen Xiyuan Information Technology Co., Ltd

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  • Shenzhen Jichuangxun Technology Co., Ltd

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  • number 7500 
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  • Batch No 24+ 
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  • Shenzhen Zhengxinxin Technology Co., Ltd

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  • XC3SD1800A-4CSG484C
  • number 3480 
  • manufactor XILINX 
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  • Batch No 22+ 
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  •  QQ:1686616797 QQ:2440138151
  • 0755-22655674  QQ:1686616797 QQ:2440138151
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XC3SD1800A-4CSG484C product parameters
model: XC3SD1800A-4CSG484C
Lead free: Lead free
Rohs certification or not: accord with
Lifecycle: Active
Part package code: BGA
Packing instructions: LEAD FREE, CSBGA-484
Number of stitches: four hundred and eighty-four
Reach Compliance Code: compliant
ECCN code: 3A991.D
HTS Code: 8542.39.00.01
Factory Lead Time: 12 weeks
Risk level: one point three six
Maximum clock frequency: 250 MHz
JESD-30 code: S-PBGA-B484
JESD-609 code: e1
Humidity sensitivity level: three
Number of configurable logical blocks: four thousand one hundred and sixty
Number of equivalent gateways: one million and eight hundred thousand
Number of entries: three hundred and nine
Number of logical units: thirty-seven thousand four hundred and forty
Output times: two hundred and forty-nine
Number of terminals: four hundred and eighty-four
Maximum operating temperature: 85 °C
Minimum operating temperature:
Organization: 4160 CLBS, 1800000 GATES
Packaging body material: PLASTIC/EPOXY
Encapsulation code: BGA
Encapsulation equivalent code: BGA484,22X22,32
Package shape: SQUARE
Packaging form: GRID ARRAY
Peak reflux temperature (° C): two hundred and sixty
Power Supply: 1.2,2.5/3.3 V
Programmable logic type: FIELD PROGRAMMABLE GATE ARRAY
Certification status: Not Qualified
Subcategory: Field Programmable Gate Arrays
Maximum supply voltage: 1.26 V
Minimum supply voltage: 1.14 V
Nominal supply voltage: 1.2 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL EXTENDED
Terminal surface layer: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: thirty
Base Number Matches: one
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