XC3S700AFGG484 Brand New Original Schematic Diagram Functional Circuit Principle of Each Pin Chip Pin Definition - China IC Network - Core 37
Publish Purchase
Location: model: accurate
  • Batch RFQ
  •  
  • supplier
  • model
  • number
  • manufacturer
  • encapsulation
  • Batch No
  • Transaction description
  • inquiry
  •  
  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • XC3S700AFGG484
  • number -
  • manufactor -
  • encapsulation -
  • Batch No -
  • -
  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
more
  •  XC3S700AFGG484 drawing
  • Huafuxin (Shenzhen) Intelligent Technology Co., Ltd

      This member has used this website for more than 7 years
  • XC3S700AFGG484  Hot spot sales
  • number 660 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • A large number of original and genuine products are hot in stock, with price advantage, and support for actual orders
  •  QQ:1368960024
  • 0755-23482756  QQ:1368960024
  •  XC3S700AFGG484 drawing
  • Shenzhen Wangnengxin Technology Co., Ltd

      This member has used this website for more than 4 years
  • XC3S700AFGG484  Hot stock
  • number 2600 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • Shenzhen brand new original stock
  •  QQ:2881495751
  • thirteen billion six hundred and two million five hundred and forty-nine thousand seven hundred and nine  QQ:2881495751
  •  XC3S700AFGG484AGQ Diagram
  • Shenzhen Hecheng Semiconductor Co., Ltd

      This member has used this website for more than 11 years
  • XC3S700AFGG484AGQ
  • number 5600 
  • manufactor XILINX 
  • encapsulation BGA 
  • Batch No 23+ 
  • Only original and genuine products, available in Shenzhen
  •  QQ:2276916927 QQ:1977615742
  • eighteen billion nine hundred and twenty-nine million three hundred and thirty-six thousand five hundred and fifty-three  QQ:2276916927 QQ:1977615742
  •  XC3S700AFGG484 drawing
  • Gather the core city

      This member has used this website for more than 13 years
  • XC3S700AFGG484
  • number 15747 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No Latest batch
  • Original factory and original company
  •  QQ:3008092965 QQ:3008092965
  • 0755-83239307  QQ:3008092965 QQ:3008092965
  •  XC3S700AFGG484AGQ Diagram
  • Shenzhen Hongnuode Electronic Technology Co., Ltd

      This member has used this website for more than 8 years
  • XC3S700AFGG484AGQ
  • number 68000 
  • manufactor XILINX 
  • encapsulation BGA 
  • Batch No 22+ 
  • Brand new, imported and original, superior spot stock, contact number if necessary: 18818596997 QQ: 84556259
  •  QQ:84556259 QQ:783839662
  • 0755-  QQ:84556259 QQ:783839662
  •  XC3S700AFGG484 drawing
  • Shenzhen Yixincheng Electronics Co., Ltd

      This member has used this website for more than 7 years
  • XC3S700AFGG484
  • number 5600 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • Yixincheng is only the original manufacturer. The channel price advantage
  •  QQ:2881498351
  • 0755-22968581  QQ:2881498351
  •  XC3S700AFGG484-4C Diagram
  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 16 years
  • XC3S700AFGG484-4C
  • number 15000 
  • manufactor Original brand
  • encapsulation Original factory appearance
  • Batch No  
  • New and original parts of the stock and other orders
  •  QQ:2881493920 QQ:2881493921
  • 0755-88608801 multi line  QQ:2881493920 QQ:2881493921
  •  XC3S700AFGG484 drawing
  • Shenzhen Chuangsike Technology Co., Ltd

      This member has used this website for more than 2 years
  • XC3S700AFGG484
  • number 8000 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • The brand new original factory has great strength. Welcome to the table
  •  QQ:1092793871
  • -0755-88910020  QQ:1092793871
Direct train with order
XC3S700AN-4FG484C product parameters
model: XC3S700AN-4FG484C
Lead free: Lead
Rohs certification or not: Non conformance
Lifecycle: Active
Part package code: BGA
Packing instructions: FBGA-484
Number of stitches: four hundred and eighty-four
Reach Compliance Code: not_compliant
ECCN code: 3A991.D
HTS Code: 8542.39.00.01
Factory Lead Time: 12 weeks
Risk level: one point four four
Maximum clock frequency: 667 MHz
Combined delay of CLB Max: 0.71 ns
JESD-30 code: S-PBGA-B484
JESD-609 code: e0
Length: 23 mm
Humidity sensitivity level: three
Number of configurable logical blocks: one thousand four hundred and seventy-two
Number of equivalent gateways: seven hundred thousand
Number of entries: three hundred and seventy-two
Number of logical units: thirteen thousand two hundred and forty-eight
Output times: two hundred and eighty-eight
Number of terminals: four hundred and eighty-four
Maximum operating temperature: 85 °C
Minimum operating temperature:
Organization: 1472 CLBS, 700000 GATES
Packaging body material: PLASTIC/EPOXY
Encapsulation code: BGA
Encapsulation equivalent code: BGA484,22X22,40
Package shape: SQUARE
Packaging form: GRID ARRAY
Peak reflux temperature (° C): two hundred and twenty-five
Power Supply: 1.2,1.2/3.3,3.3 V
Programmable logic type: FIELD PROGRAMMABLE GATE ARRAY
Certification status: Not Qualified
Maximum height of seating surface: 2.6 mm
Subcategory: Field Programmable Gate Arrays
Maximum supply voltage: 1.26 V
Minimum supply voltage: 1.14 V
Nominal supply voltage: 1.2 V
Surface mounting: YES
Technology: CMOS
Temperature class: OTHER
Terminal surface layer: Tin/Lead (Sn63Pb37)
Terminal type: BALL
Terminal pitch: 1 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: thirty
Width: 23 mm
Base Number Matches: one
  •  
  • supplier
  • model *
  • number *
  • manufacturer
  • encapsulation
  • Batch No
  • Transaction description
  • inquiry
Records selected for batch RFQ Selected zero 15 at most each time.