model: | XC3S700AN-4FG484C |
|
Lead free: | Lead |
Rohs certification or not: | Non conformance |
Lifecycle: | Active |
Part package code: | BGA |
Packing instructions: | FBGA-484 |
Number of stitches: | four hundred and eighty-four |
Reach Compliance Code: | not_compliant |
ECCN code: | 3A991.D |
HTS Code: | 8542.39.00.01 |
Factory Lead Time: | 12 weeks |
Risk level: | one point four four |
Maximum clock frequency: | 667 MHz |
Combined delay of CLB Max: | 0.71 ns |
JESD-30 code: | S-PBGA-B484 |
JESD-609 code: | e0 |
Length: | 23 mm |
Humidity sensitivity level: | three |
Number of configurable logical blocks: | one thousand four hundred and seventy-two |
Number of equivalent gateways: | seven hundred thousand |
Number of entries: | three hundred and seventy-two |
Number of logical units: | thirteen thousand two hundred and forty-eight |
Output times: | two hundred and eighty-eight |
Number of terminals: | four hundred and eighty-four |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | |
Organization: | 1472 CLBS, 700000 GATES |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | BGA |
Encapsulation equivalent code: | BGA484,22X22,40 |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY |
Peak reflux temperature (° C): | two hundred and twenty-five |
Power Supply: | 1.2,1.2/3.3,3.3 V |
Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
Certification status: | Not Qualified |
Maximum height of seating surface: | 2.6 mm |
Subcategory: | Field Programmable Gate Arrays |
Maximum supply voltage: | 1.26 V |
Minimum supply voltage: | 1.14 V |
Nominal supply voltage: | 1.2 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | OTHER |
Terminal surface layer: | Tin/Lead (Sn63Pb37) |
Terminal type: | BALL |
Terminal pitch: | 1 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | thirty |
Width: | 23 mm |
Base Number Matches: | one |
|