XC3S700A-5FGG484I Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • XC3S700A-5FGG484I
  • number -
  • manufactor -
  • encapsulation -
  • Batch No -
  • -
  •  QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:308365177
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  • Shenzhen Xinfulin Electronics Co., Ltd

      This member has used this website for more than 15 years
  • XC3S700A-5FGG484I
  • number 65000 
  • manufactor XILINX 
  • encapsulation FBGA484 
  • Batch No 23+ 
  • Real stock brand new genuine! Agent this model
  •  QQ:2881495753
  • 0755-23605827  QQ:2881495753
  •  XC3S700A-5FGG484I drawing
  • Shenzhen Yawei Electronic Co., Ltd

      This member has used this website for more than 15 years
  • XC3S700A-5FGG484I
  • number 8000 
  • manufactor Xilinx Inc 
  • encapsulation Shenzhen original spot 0755-83975781
  • Batch No BGA 
  •  QQ:767621813 QQ:1152937841
  • 0755-83975781  QQ:767621813 QQ:1152937841
  •  XC3S700A-5FGG484I drawing
  • Gather the core city

      This member has used this website for more than 13 years
  • XC3S700A-5FGG484I
  • number 15645 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No Latest batch
  • Original factory and original company
  •  QQ:3008092965 QQ:3008092965
  • 0755-83239307  QQ:3008092965 QQ:3008092965
  •  XC3S700A-5FGG484I drawing
  • Shenzhen SECCO Century Electronics Co., Ltd

      This member has used this website for more than 11 years
  • XC3S700A-5FGG484I
  • number 14879 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 22+ 
  • Acting as an agent for newly arrived original goods at special price, 13006691066
  •  QQ:2633815170 QQ:124766973
  • thirteen billion six million six hundred and ninety-one thousand and sixty-six  QQ:2633815170 QQ:124766973
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XC3S700A-5FTG256C product parameters
model: XC3S700A-5FTG256C
Rohs certification or not: accord with
Lifecycle: Active
Part package code: BGA
Packing instructions: LBGA, BGA256,16X16,40
Number of stitches: two hundred and fifty-six
Reach Compliance Code: compliant
ECCN code: EAR99
HTS Code: 8542.39.00.01
Factory Lead Time: 12 weeks
Risk level: five point two six
Maximum clock frequency: 770 MHz
Combined delay of CLB Max: 0.62 ns
JESD-30 code: S-PBGA-B256
JESD-609 code: e1
Length: 17 mm
Humidity sensitivity level: three
Number of configurable logical blocks: one thousand four hundred and seventy-two
Number of equivalent gateways: seven hundred thousand
Number of entries: one hundred and sixty-one
Number of logical units: thirteen thousand two hundred and forty-eight
Output times: one hundred and forty-eight
Number of terminals: two hundred and fifty-six
Maximum operating temperature: 85 °C
Minimum operating temperature:
Organization: 1472 CLBS, 700000 GATES
Packaging body material: PLASTIC/EPOXY
Encapsulation code: LBGA
Encapsulation equivalent code: BGA256,16X16,40
Package shape: SQUARE
Packaging form: GRID ARRAY, LOW PROFILE
Peak reflux temperature (° C): two hundred and sixty
Power Supply: 1.2,1.2/3.3,3.3 V
Programmable logic type: FIELD PROGRAMMABLE GATE ARRAY
Certification status: Not Qualified
Maximum height of seating surface: 1.55 mm
Subcategory: Field Programmable Gate Arrays
Maximum supply voltage: 1.26 V
Minimum supply voltage: 1.14 V
Nominal supply voltage: 1.2 V
Surface mounting: YES
Technology: CMOS
Temperature class: OTHER
Terminal surface layer: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal type: BALL
Terminal pitch: 1 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: thirty
Width: 17 mm
Base Number Matches: one
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Records selected for batch RFQ Selected zero 15 at most each time.