XC3S700A-5FFG4 brand new original schematic diagram Functional circuit principle of each pin Chip pin definition - China IC network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  • Shenzhen Yihao Technology Co., Ltd

      This member has used this website for more than 15 years
  • XC3S700A-5FFG484C  Grade III spot
  • number 965 
  • manufactor XILINX 
  • encapsulation FBGA 
  • Batch No 24+ 
  • Original certification, available from stock! Powerful merchants
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  • HECC GROUP CO.,LIMITED

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  • XC3S700A-5FFG484C  Grade III spot
  • number 1374 
  • manufactor XILINX 
  • encapsulation FBGA 
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  • XC3S700A-5FFG484C
  • number 65000 
  • manufactor XILINX 
  • encapsulation Original packaging
  • Batch No 23+ 
  • Real stock brand new genuine! Agent this model
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  • Shenzhen Yuxing Micro Technology Co., Ltd

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  • XC3S700A-5FFG484C
  • number 12600 
  • manufactor XILINX 
  • encapsulation Original packaging
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  • Xinde Microlink (Shenzhen) Electronics Co., Ltd

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  • XC3S700A-5FFG484C
  • number 6680 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
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  • Only make the original, one fake will be fined 100, and the real order will be supported!
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  • Shenzhen Chuangsike Technology Co., Ltd

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  • encapsulation BGA 
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  • The brand new original factory has great strength. Welcome to the table
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  • Shenzhen Wangnengxin Technology Co., Ltd

      This member has used this website for more than 4 years
  • XC3S700A-5FFG484C
  • number 2600 
  • manufactor XILINX/Xilinsi
  • encapsulation BGA 
  • Batch No 21+ 
  • Shenzhen brand new original stock
  •  QQ:2881495751
  • thirteen billion six hundred and two million five hundred and forty-nine thousand seven hundred and nine  QQ:2881495751
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XC3S700A-5FG484C product parameters
model: XC3S700A-5FG484C
Lead free: Lead
Rohs certification or not: Non conformance
Lifecycle: Active
Part package code: BGA
Packing instructions: BGA, BGA484,22X22,40
Number of stitches: four hundred and eighty-four
Reach Compliance Code: not_compliant
ECCN code: 3A991.D
HTS Code: 8542.39.00.01
Risk level: five point two
Maximum clock frequency: 770 MHz
Combined delay of CLB Max: 0.62 ns
JESD-30 code: S-PBGA-B484
JESD-609 code: e0
Length: 23 mm
Humidity sensitivity level: three
Number of configurable logical blocks: one thousand four hundred and seventy-two
Number of equivalent gateways: seven hundred thousand
Number of entries: three hundred and seventy-two
Number of logical units: thirteen thousand two hundred and forty-eight
Output times: two hundred and eighty-eight
Number of terminals: four hundred and eighty-four
Maximum operating temperature: 85 °C
Minimum operating temperature:
Organization: 1472 CLBS, 700000 GATES
Packaging body material: PLASTIC/EPOXY
Encapsulation code: BGA
Encapsulation equivalent code: BGA484,22X22,40
Package shape: SQUARE
Packaging form: GRID ARRAY
Peak reflux temperature (° C): two hundred and twenty-five
Power Supply: 1.2,2.5/3.3 V
Programmable logic type: FIELD PROGRAMMABLE GATE ARRAY
Certification status: Not Qualified
Maximum height of seating surface: 2.6 mm
Subcategory: Field Programmable Gate Arrays
Maximum supply voltage: 1.26 V
Minimum supply voltage: 1.14 V
Nominal supply voltage: 1.2 V
Surface mounting: YES
Technology: CMOS
Temperature class: OTHER
Terminal surface layer: Tin/Lead (Sn63Pb37)
Terminal type: BALL
Terminal pitch: 1 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: thirty
Width: 23 mm
Base Number Matches: one
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