| model: | USB3300-EZK |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
| Part package code: | QFN |
| Packing instructions: | HVQCCN, |
| Number of stitches: | thirty-two |
| Reach Compliance Code： | compliant |
| HTS Code: | 8542.39.00.01 |
| Factory Lead Time： | 11 weeks |
| Risk level: | one point seven |
| JESD-30 code: | S-XQCC-N32 |
| JESD-609 code: | e3 |
| Length: | 5 mm |
| Humidity sensitivity level: | three |
| Number of functions: | one |
| Number of terminals: | thirty-two |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Packaging body material: | UNSPECIFIED |
| Encapsulation code: | HVQCCN |
| Package shape: | SQUARE |
| Packaging form: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak reflux temperature (° C): | two hundred and sixty |
| Maximum height of seating surface: | 1 mm |
| Nominal supply voltage: | 3.3 V |
| Surface mounting: | YES |
| Telecom IC type: | INTERFACE CIRCUIT |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) - annealed |
| Terminal type: | NO LEAD |
| Terminal pitch: | 0.5 mm |
| Terminal location: | QUAD |
| Maximum time at peak reflux temperature: | forty |
| Width: | 5 mm |
| Base Number Matches： | one |
|
