UCC5630FQB Schematic Diagram Functional Circuit Principle Chip Pin Definition Pin Diagram and Functions - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • UCC5630FQB
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  •  UCC5630FQB diagram
  • Beijing Shoutian International Co., Ltd

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  • UCC5630FQB
  • number 5650 
  • manufactor TI 
  • encapsulation QFP 48 
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  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 11 years
  • UCC5630FQB
  • number 21000 
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UCC5630MWP product parameters
model: UCC5630MWP
Lead free: Lead free
Lifecycle: Active
IHS Manufacturer: ROCHESTER ELECTRONICS LLC
Part package code: SOIC
Packing instructions: 0.300 INCH, 0.88 MM PITCH, POWER, QSOP-36
Number of stitches: thirty-six
Reach Compliance Code: unknown
Risk level: five point six six
Differential output: YES
Interface IC type: SCSI BUS TERMINATOR
JESD-30 code: R-PDSO-G36
JESD-609 code: e0
Length: 15.4 mm
Humidity sensitivity level: NOT SPECIFIED
Number of functions: one
Number of signal lines: nine
Number of terminals: thirty-six
Maximum operating temperature: 70 °C
Minimum operating temperature:
Packaging body material: PLASTIC/EPOXY
Encapsulation code: SSOP
Package shape: RECTANGULAR
Packaging form: SMALL OUTLINE, SHRINK PITCH
Peak reflux temperature (° C): NOT SPECIFIED
Nominal pull-up resistance: 105 Ω
Certification status: COMMERCIAL
Maximum height of seating surface: 2.65 mm
Maximum supply voltage: 5.25 V
Minimum supply voltage: 2.7 V
Nominal supply voltage: 3.3 V
Surface mounting: YES
Technology: BICMOS
Temperature class: COMMERCIAL
Terminal surface layer: TIN LEAD
Terminal type: GULL WING
Terminal pitch: 0.8 mm
Terminal location: DUAL
Maximum time at peak reflux temperature: NOT SPECIFIED
Width: 7.5 mm
Base Number Matches: one
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