UCC27322QDGN brand new original schematic diagram Functional circuit principle of each pin Chip pin definition - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • UCC27322QDGN
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      This member has used this website for more than 13 years
  • UCC27322QDGNRQ1  Spot stock
  • number 2500 
  • manufactor Texas Instruments 
  • encapsulation Original
  • Batch No 2019+ 
  • Original genuine
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      This member has used this website for more than 13 years
  • UCC27322QDGNRQ1  Spot stock
  • number 15052 
  • manufactor TI
  • encapsulation  
  • Batch No 22+ 
  • Original factory stock
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      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1  Spot stock
  • number 3822 
  • manufactor TI
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  • Batch No 22+ 
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  • Shenzhen Yingdezhou Technology Co., Ltd

      This member has used this website for more than 2 years
  • UCC27322QDGNRQ1  Spot stock
  • number 42500 
  • manufactor TI
  • encapsulation PowerPad-MSOP-8 
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  • Shenzhen Xinmai Industrial Co., Ltd

      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1  Spot stock
  • number 2500 
  • manufactor TI 
  • encapsulation HVSSOP (DGN) 
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  • Shenzhen Guangbaili Electronics Co., Ltd

      This member has used this website for more than 6 years
  • UCC27322QDGNRQ1  Spot stock
  • number 18500 
  • manufactor TI
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  • Batch No 23+ 
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  • Shenzhen Tuoyixian Electronics Co., Ltd

      This member has used this website for more than 12 years
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  • number 22000 
  • manufactor TI 
  • encapsulation HVSSOP-8 
  • Batch No 23+ 
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  • Shenzhen Topsun Electronics Co., Ltd

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  • UCC27322QDGNRQ1
  • number 5300 
  • manufactor TI
  • encapsulation PowerPad-MSOP-8 
  • Batch No 21+ 
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  • Shenzhen Keyu Electronics Co., Ltd

      This member has used this website for more than 8 years
  • UCC27322QDGNRQ1
  • number 3854 
  • manufactor TI 
  • encapsulation MSOP-8 
  • Batch No 21+ 
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  • Shenzhen Xinfulin Electronics Co., Ltd

      This member has used this website for more than 15 years
  • UCC27322QDGNRQ1
  • number 85000 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP-8 
  • Batch No 23+ 
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  • Shenzhen Wangnengxin Technology Co., Ltd

      This member has used this website for more than 4 years
  • UCC27322QDGNRQ1
  • number 15000 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP-8 
  • Batch No 22+ 
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  • Shenzhen Xinjie Micro Semiconductor Co., Ltd

      This member has used this website for more than 1 year
  • UCC27322QDGNRQ1
  • number 35601 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
  • Batch No 23+ 
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  • Shenzhen Longyicheng Technology Co., Ltd

      This member has used this website for more than 3 years
  • UCC27322QDGNRQ1
  • number 2563 
  • manufactor TI 
  • encapsulation PowerPad-MSOP-8 
  • Batch No 22+ 
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  • Shenzhen Hecheng Semiconductor Co., Ltd

      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1
  • number 5600 
  • manufactor TI 
  • encapsulation MSOP8 
  • Batch No 23+ 
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  • Shenzhen Yuchuanxiang Technology Co., Ltd

      This member has used this website for more than 6 years
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  • number 23000 
  • manufactor Texas Instruments 
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  • Batch No 23+ 
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  • Modern Core City (Shenzhen) Technology Co., Ltd

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  • number 56800 
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  • number 19316 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
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  • Shenzhen Dejie Core City Technology Co., Ltd

      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1
  • number 17250 
  • manufactor TI/Texas Instruments
  • encapsulation NA/ 
  • Batch No 23+ 
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  • number 6516 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
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  • number 19316 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
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  • Shenzhen Dejie Core City Technology Co., Ltd

      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1
  • number 7602 
  • manufactor TI
  • encapsulation HVSSOP-8 
  • Batch No 23+ 
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  • number 17878 
  • manufactor TI
  • encapsulation HVSSOP-8-EP-0.65mm 
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  • Modern Core City (Shenzhen) Technology Co., Ltd

      This member has used this website for more than 15 years
  • UCC27322QDGNRQ1
  • number 88000 
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  • Shenzhen Xiyuan Information Technology Co., Ltd

      This member has used this website for more than 9 years
  • UCC27322QDGNRQ1
  • number 8800 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
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  • Shenzhen Jichuangxun Technology Co., Ltd

      This member has used this website for more than 5 years
  • UCC27322QDGNRQ1
  • number 8500 
  • manufactor TI/Texas Instruments
  • encapsulation HVSSOP-8 
  • Batch No 24+ 
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  • Shenzhen Huasidun Electronic Technology Co., Ltd

      This member has used this website for more than 16 years
  • UCC27322QDGNRQ1
  • number 12500 
  • manufactor TI/Texas Instruments
  • encapsulation HVSSOP-8 
  • Batch No 2023+ 
  • Absolutely genuine brand new Shenzhen import spot, high-quality channel supplier!
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  • Shenzhen Sinuo Electronic Technology Co., Ltd

      This member has used this website for more than 8 years
  • UCC27322QDGNRQ1
  • number 34577 
  • manufactor TI 
  • encapsulation MSOP8 
  • Batch No 17+ 
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  • Modern Core City (Shenzhen) Technology Co., Ltd

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  • UCC27322QDGNRQ1
  • number 88000 
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  • Shenzhen Huaxin Shengshi Technology Co., Ltd

      This member has used this website for more than 13 years
  • UCC27322QDGNRQ1
  • number 865000 
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  • encapsulation MSOP8 
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  • Shenzhen Huasidun Electronic Technology Co., Ltd

      This member has used this website for more than 16 years
  • UCC27322QDGNRQ1
  • number 24734 
  • manufactor TI 
  • encapsulation MSOP8 
  • Batch No 2023+ 
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  • Shenzhen Jingyu Technology Co., Ltd

      This member has used this website for more than 11 years
  • UCC27322QDGNRQ1
  • number 6328 
  • manufactor TI Texas Instruments
  • encapsulation MSOP-8 
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  • Shenzhen Yicheng Technology Co., Ltd

      This member has used this website for more than 9 years
  • UCC27322QDGNRQ1
  • number 5280 
  • manufactor TI
  • encapsulation PowerPad-MSOP-8 
  • Batch No 23+ 
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  • Shenzhen Yuxing Micro Technology Co., Ltd

      This member has used this website for more than 4 years
  • UCC27322QDGNRQ1
  • number 12600 
  • manufactor TI/Texas Instruments
  • encapsulation MSOP8 
  • Batch No 22+ 
  • Shenzhen original spot, supporting actual orders
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  • Shenzhen Yingdezhou Technology Co., Ltd

      This member has used this website for more than 2 years
  • UCC27322QDGNRQ1
  • number 32500 
  • manufactor TI
  • encapsulation PowerPad-MSOP-8 
  • Batch No Within 2 years
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  • -0755-88604592  QQ:2355734291
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  • Shenzhen Hongshijia Electronic Technology Co., Ltd

      This member has used this website for more than 13 years
  • UCC27322QDGNRQ1
  • number 4035 
  • manufactor TI 
  • encapsulation 8-TSSOP, 8-MSOP (0.118, 3.00mm wide) bare pad
  • Batch No 2023+ 
  • Brand new original products, spot sales of the company
  •  QQ:2881894393 QQ:2881894393 copy
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  • Shenzhen Ouruixin Electronics Co., Ltd

      This member has used this website for more than 12 years
  • UCC27322QDGNRQ1
  • number 36580 
  • manufactor TI 
  • encapsulation HVSSOP8 
  • Batch No 23+ 
  • The original factory's agent warehouse supports BOM allocation. Welcome to the consultation
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  • Shenzhen Lingchuangwei Technology Co., Ltd

      This member has used this website for more than 12 years
  • UCC27322QDGNRQ1
  • number 23997 
  • manufactor TI 
  • encapsulation 8-MSOP-PowerPad 
  • Batch No 21+ 
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  • Shenzhen Hexie Shijia Electronics Co., Ltd

      This member has used this website for more than 13 years
  • UCC27322QDGNRQ1
  • number 634 
  • manufactor Texas Instruments 
  • encapsulation Standard packaging
  • Batch No Latest batch number
  • Absolutely imported original packaging
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  • 0755+84501032  QQ:1158840606
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  • Shenzhen Xiyuan Information Technology Co., Ltd

      This member has used this website for more than 9 years
  • UCC27322QDGNRQ1
  • number 8800 
  • manufactor TI 
  • encapsulation HVSSOP-8 
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  • The original spot goods will be sold at the acceptable price at zero cost
  •  QQ:840638855 QQ:840638855 copy
  • 0755-84876394  QQ:840638855
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UCC27322QDGNRQ1 Product Parameters
model: UCC27322QDGNRQ1
Brand Name: Texas Instruments
Lead free: Lead free
Rohs certification or not: accord with
Lifecycle: Active
IHS Manufacturer: TEXAS INSTRUMENTS INC
Part package code: MSOP
Packing instructions: MSOP-8
Number of stitches: eight
Reach Compliance Code: compliant
ECCN code: EAR99
HTS Code: 8542.39.00.01
Factory Lead Time: 6 weeks
Risk level: one point six nine
Samacsys Confidence: three
Samacsys Status: Released
2D Presentation: https://componentsearchengine.com/2D/0T/608229.3.1.png
Schematic Symbol: https://componentsearchengine.com/symbol.php?partID=608229
PCB Footprint: https://componentsearchengine.com/footprint.php?partID=608229
3D View: https://componentsearchengine.com/viewer/3D.php?partID=608229
Samacsys PartID: six hundred and eight thousand two hundred and twenty-nine
Samacsys Image: https://componentsearchengine.com/Images/9/UCC27322QDGNRQ1.jpg
Samacsys Thumbnail Image: https://componentsearchengine.com/Thumbnails/3/UCC27322QDGNRQ1.jpg
Samacsys Pin Count: nine
Samacsys Part Category: Integrated Circuit
Samacsys Package Category: Small Outline Packages
Samacsys Footprint Name: DGN (S-PDSO-G8)+
Samacsys Released Date: 2017-01-12 12:59:53
Is Samacsys: N
High side drive: NO
Interface IC type: BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code: S-PDSO-G8
JESD-609 code: e4
Length: 3 mm
Humidity sensitivity level: two
Number of functions: one
Number of terminals: eight
Maximum operating temperature: 125 °C
Minimum operating temperature: -40 °C
Output characteristics: TOTEM-POLE
Maximum output current: 9 A
Nominal output peak current: 9 A
Output polarity: TRUE
Packaging body material: PLASTIC/EPOXY
Encapsulation code: HTSSOP
Encapsulation equivalent code: TSSOP8,.19
Package shape: SQUARE
Packaging form: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak reflux temperature (° C): two hundred and sixty
Power Supply: 4.5/15 V
Certification status: Not Qualified
Filter level: AEC-Q100
Maximum height of seating surface: 1.1 mm
Subcategory: MOSFET Drivers
Maximum slewing rate: 1 mA
Maximum supply voltage: 15 V
Minimum supply voltage: 4.5 V
Nominal supply voltage: 14 V
Surface mounting: YES
Technology: BICMOS
Temperature class: AUTOMOTIVE
Terminal surface layer: Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal type: GULL WING
Terminal pitch: 0.65 mm
Terminal location: DUAL
Maximum time at peak reflux temperature: NOT SPECIFIED
Disconnection time: 0.075 µs
On time: 0.075 µs
Width: 3 mm
Base Number Matches: one
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Records selected for batch RFQ Selected zero 15 at most each time.
  Copy succeeded!