| model: | STM32F103RDY6XXX |
|
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| IHS Manufacturer: | STMICROELECTRONICS |
| Part package code: | BGA |
| Packing instructions: | VFBGA, BGA64,8X8,20 |
| Number of stitches: | sixty-four |
| Reach Compliance Code： | compliant |
| HTS Code: | 8542.31.00.01 |
| Risk level: | five point three six |
| With ADC: | YES |
| Address bus width: | |
| Bit size: | thirty-two |
| Boundary scan: | YES |
| CPU series: | CORTEX-M3 |
| Maximum clock frequency: | 16 MHz |
| DAC channel: | YES |
| DMA channel: | YES |
| External data bus width: | |
| Format: | FIXED POINT |
| Integrated cache: | NO |
| JESD-30 code: | R-PBGA-B64 |
| Length: | 4.466 mm |
| Low power mode: | YES |
| Number of DMA channels: | twelve |
| Number of external interrupt devices: | sixteen |
| Number of I/O lines: | fifty-one |
| Number of terminals: | sixty-four |
| On chip program ROM width: | eight |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| PWM channel: | YES |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | VFBGA |
| Encapsulation equivalent code: | BGA64,8X8,20 |
| Package shape: | RECTANGULAR |
| Packaging form: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Certification status: | Not Qualified |
| RAM (bytes): | sixty-five thousand five hundred and thirty-six |
| ROM (word): | three hundred and ninety-three thousand two hundred and sixteen |
| ROM programmability: | FLASH |
| Maximum height of seating surface: | 0.635 mm |
| Speed: | 72 MHz |
| Maximum slewing rate: | 69 mA |
| Maximum supply voltage: | 3.6 V |
| Minimum supply voltage: | 2 V |
| Nominal supply voltage: | 3.3 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal type: | BALL |
| Terminal pitch: | 0.5 mm |
| Terminal location: | BOTTOM |
| Width: | 4.395 mm |
| UPs/uCs/peripheral integrated circuit type: | MICROCONTROLLER, RISC |
|
