| model: | STM32F103R4H6ATR |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| Part package code: | BGA |
| Packing instructions: | TFBGA, BGA64,8X8,20 |
| Number of stitches: | sixty-four |
| Reach Compliance Code： | compliant |
| HTS Code: | 8542.31.00.01 |
| Risk level: | five point one eight |
| With ADC: | YES |
| Address bus width: | |
| Bit size: | thirty-two |
| CPU series: | CORTEX-M3 |
| Maximum clock frequency: | 16 MHz |
| DAC channel: | NO |
| DMA channel: | YES |
| External data bus width: | |
| JESD-30 code: | S-PBGA-B64 |
| JESD-609 code: | e1 |
| Length: | 5 mm |
| Humidity sensitivity level: | three |
| Number of I/O lines: | forty-eight |
| Number of terminals: | sixty-four |
| On chip program ROM width: | eight |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| PWM channel: | YES |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | TFBGA |
| Encapsulation equivalent code: | BGA64,8X8,20 |
| Package shape: | SQUARE |
| Packaging form: | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 2.5/3.3 V |
| Certification status: | Not Qualified |
| RAM (bytes): | six thousand one hundred and forty-four |
| ROM (word): | sixteen thousand three hundred and eighty-four |
| ROM programmability: | FLASH |
| Maximum height of seating surface: | 1.2 mm |
| Speed: | 72 MHz |
| Subcategory: | Microcontrollers |
| Maximum supply voltage: | 3.6 V |
| Minimum supply voltage: | 2 V |
| Nominal supply voltage: | 3.3 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal type: | BALL |
| Terminal pitch: | 0.5 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 5 mm |
| UPs/uCs/peripheral integrated circuit type: | MICROCONTROLLER, RISC |
| Base Number Matches： | one |
|
