model: | PUMD3 |
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Lead free: | Lead free |
Rohs certification or not: | accord with |
Lifecycle: | Transferred |
IHS Manufacturer: | NXP SEMICONDUCTORS |
Part package code: | SC-88 |
Packing instructions: | PLASTIC, SC-88, 6 PIN |
Number of stitches: | six |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8541.21.00.75 |
Risk level: | three point five two |
Is Samacsys: | N |
Other features: | BUILT-IN BIAS RESISTOR RATIO IS 1 |
Maximum collector current (IC): | 0.1 A |
Maximum collector emitter voltage: | 50 V |
to configure: | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
Minimum DC current gain (hFE): | thirty |
JESD-30 code: | R-PDSO-G6 |
JESD-609 code: | e3 |
Humidity sensitivity level: | one |
Number of elements: | two |
Number of terminals: | six |
Maximum operating temperature: | 150 °C |
Packaging body material: | PLASTIC/EPOXY |
Package shape: | RECTANGULAR |
Packaging form: | SMALL OUTLINE |
Peak reflux temperature (° C): | two hundred and sixty |
Polarity/Channel Type: | NPN AND PNP |
Maximum power dissipation (Abs): | 0.2 W |
Certification status: | Not Qualified |
Subcategory: | BIP General Purpose Small Signal |
Surface mounting: | YES |
Terminal surface layer: | Tin (Sn) |
Terminal type: | GULL WING |
Terminal location: | DUAL |
Maximum time at peak reflux temperature: | thirty |
Transistor applications: | SWITCHING |
Transistor element material: | SILICON |
Base Number Matches: | one |
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