| model: | PIC16F876A-I/SP |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Not Recommended |
| IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
| Part package code: | DIP |
| Packing instructions: | DIP, DIP28,.3 |
| Number of stitches: | twenty-eight |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.31.00.01 |
| Factory Lead Time： | 4 weeks |
| Risk level: | seven point one nine |
| Samacsys Confidence： | three |
| Samacsys Status： | Released |
| 2D Presentation： | https://componentsearchengine.com/2D/0T/231952.1.4.png |
| Schematic Symbol： | https://componentsearchengine.com/symbol.php?partID=231952 |
| PCB Footprint： | https://componentsearchengine.com/footprint.php?partID=231952 |
| 3D View： | https://componentsearchengine.com/viewer/3D.php?partID=231952 |
| Samacsys PartID： | two hundred and thirty-one thousand nine hundred and fifty-two |
| Samacsys Image： | https://componentsearchengine.com/Images/9/PIC16F876A-I/SP.jpg |
| Samacsys Thumbnail Image： | https://componentsearchengine.com/Thumbnails/1/PIC16F876A-I/SP.jpg |
| Samacsys Pin Count： | twenty-eight |
| Samacsys Part Category： | Integrated Circuit |
| Samacsys Package Category： | Dual-In-Line Packages |
| Samacsys Footprint Name： | 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [PDIP] |
| Samacsys Released Date： | 2015-11-04 06:21:06 |
| Is Samacsys： | N |
| With ADC: | YES |
| Other features: | OPERATES AT 4 V MINIMUM SUPPLY |
| Address bus width: | |
| Bit size: | eight |
| CPU series: | PIC |
| Maximum clock frequency: | 20 MHz |
| DAC channel: | YES |
| DMA channel: | NO |
| External data bus width: | |
| JESD-30 code: | R-PDIP-T28 |
| JESD-609 code: | e3 |
| Length: | 34.67 mm |
| Number of I/O lines: | twenty-two |
| Number of terminals: | twenty-eight |
| On chip program ROM width: | fourteen |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| PWM channel: | YES |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | DIP |
| Encapsulation equivalent code: | DIP28,.3 |
| Package shape: | RECTANGULAR |
| Packaging form: | IN-LINE |
| Peak reflux temperature (° C): | NOT SPECIFIED |
| Power Supply: | 5 V |
| Certification status: | Not Qualified |
| RAM (bytes): | three hundred and sixty-eight |
| ROM (word): | eight thousand one hundred and ninety-two |
| ROM programmability: | FLASH |
| Maximum height of seating surface: | 4.06 mm |
| Speed: | 20 MHz |
| Subcategory: | Microcontrollers |
| Maximum slewing rate: | 15 mA |
| Maximum supply voltage: | 5.5 V |
| Minimum supply voltage: | 4.5 V |
| Nominal supply voltage: | 5 V |
| Surface mounting: | NO |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) |
| Terminal type: | THROUGH-HOLE |
| Terminal pitch: | 2.54 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 7.62 mm |
| UPs/uCs/peripheral integrated circuit type: | MICROCONTROLLER, RISC |
| Base Number Matches： | one |
|
