| model: | PIC16F677-E/ML |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
| Part package code: | QFN |
| Packing instructions: | 4 X 4 MM, 0.90 MM HEIGHT, PLASTIC, QFN-20 |
| Number of stitches: | twenty |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.31.00.01 |
| Factory Lead Time： | 6 weeks |
| Risk level: | zero point eight five |
| Samacsys Confidence： | three |
| Samacsys Status： | Released |
| 2D Presentation： | https://componentsearchengine.com/2D/0T/237518.1.1.png |
| Schematic Symbol： | https://componentsearchengine.com/symbol.php?partID=237518 |
| PCB Footprint： | https://componentsearchengine.com/footprint.php?partID=237518 |
| 3D View： | https://componentsearchengine.com/viewer/3D.php?partID=237518 |
| Samacsys PartID： | two hundred and thirty-seven thousand five hundred and eighteen |
| Samacsys Image： | https://componentsearchengine.com/Images/9/PIC16F677-E/ML.jpg |
| Samacsys Thumbnail Image： | https://componentsearchengine.com/Thumbnails/1/PIC16F677-E/ML.jpg |
| Samacsys Pin Count： | twenty-one |
| Samacsys Part Category： | Integrated Circuit |
| Samacsys Package Category： | Quad Flat No-Lead |
| Samacsys Footprint Name： | 20-Lead (ML) - 4x4x0.9 mm Body [QFN] |
| Samacsys Released Date： | 2015-11-04 07:36:15 |
| Is Samacsys： | N |
| With ADC: | YES |
| Other features: | ALSO OPERATES AT 2V SUPPLY AT 8 MHZ |
| Address bus width: | |
| Bit size: | eight |
| CPU series: | PIC |
| Maximum clock frequency: | 20 MHz |
| DAC channel: | NO |
| DMA channel: | NO |
| External data bus width: | |
| JESD-30 code: | S-PQCC-N20 |
| JESD-609 code: | e3 |
| Length: | 4 mm |
| Humidity sensitivity level: | one |
| Number of I/O lines: | eighteen |
| Number of terminals: | twenty |
| On chip program ROM width: | fourteen |
| Maximum operating temperature: | 125 °C |
| Minimum operating temperature: | -40 °C |
| PWM channel: | YES |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | HVQCCN |
| Encapsulation equivalent code: | LCC20,.16SQ,20 |
| Package shape: | SQUARE |
| Packaging form: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 2.5/5 V |
| Certification status: | Not Qualified |
| RAM (bytes): | one hundred and twenty-eight |
| ROM (word): | two thousand and forty-eight |
| ROM programmability: | FLASH |
| Maximum height of seating surface: | 1 mm |
| Speed: | 20 MHz |
| Subcategory: | Microcontrollers |
| Maximum supply voltage: | 5.5 V |
| Minimum supply voltage: | 4.5 V |
| Nominal supply voltage: | 5 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | AUTOMOTIVE |
| Terminal surface layer: | Matte Tin (Sn) - annealed |
| Terminal type: | NO LEAD |
| Terminal pitch: | 0.5 mm |
| Terminal location: | QUAD |
| Maximum time at peak reflux temperature: | forty |
| Width: | 4 mm |
| UPs/uCs/peripheral integrated circuit type: | MICROCONTROLLER, RISC |
| Base Number Matches： | one |
|
