model: | PIC16F18313-E/P |
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Rohs certification or not: | accord with |
Lifecycle: | Active |
IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
Packing instructions: | DIP, DIP8,.3 |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8542.31.00.01 |
Factory Lead Time: | 12 weeks |
Risk level: | five point six three |
Samacsys Confidence: | three |
Samacsys Status: | Released |
2D Presentation: | https://componentsearchengine.com/2D/0T/251211.2.1.png |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=251211 |
PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=251211 |
3D View: | https://componentsearchengine.com/viewer/3D.php?partID=251211 |
Samacsys PartID: | two hundred and fifty-one thousand two hundred and eleven |
Samacsys Image: | https://componentsearchengine.com/Images/9/PIC16F18313-E/P.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/2/PIC16F18313-E/P.jpg |
Samacsys Pin Count: | eight |
Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Dual-In-Line Packages |
Samacsys Footprint Name: | PIC16F18313-E/P-1 |
Samacsys Released Date: | 2019-02-19 09:55:30 |
Is Samacsys: | N |
With ADC: | YES |
Other features: | 2.3 V MINIMUM SUPPLY AT 16 MHZ |
Address bus width: | |
Bit size: | eight |
Boundary scan: | NO |
CPU series: | PIC16 |
Maximum clock frequency: | 32 MHz |
DAC channel: | YES |
DMA channel: | NO |
External data bus width: | |
Format: | FIXED-POINT |
Integrated cache: | NO |
JESD-30 code: | R-PDIP-T8 |
JESD-609 code: | e3 |
Length: | 9.27 mm |
Low power mode: | YES |
Number of DMA channels: | |
Number of external interrupt devices: | one |
Number of I/O lines: | six |
Serial I/O number: | one |
Number of terminals: | eight |
Number of timers: | three |
On chip data RAM width: | eight |
On chip program ROM width: | fourteen |
Maximum operating temperature: | 125 °C |
Minimum operating temperature: | -40 °C |
PWM channel: | YES |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | DIP |
Encapsulation equivalent code: | DIP8,.3 |
Package shape: | RECTANGULAR |
Packaging form: | IN-LINE |
Peak reflux temperature (° C): | two hundred and sixty |
RAM (bytes): | two hundred and fifty-six |
RAM (number of words): | two hundred and fifty-six |
ROM (word): | two thousand and forty-eight |
ROM programmability: | FLASH |
Maximum height of seating surface: | 5.334 mm |
Speed: | 32 MHz |
Maximum slewing rate: | 2.6 mA |
Maximum supply voltage: | 5.5 V |
Minimum supply voltage: | 2.5 V |
Nominal supply voltage: | 3 V |
Surface mounting: | NO |
Technology: | CMOS |
Temperature class: | AUTOMOTIVE |
Terminal surface layer: | Matte Tin (Sn) - annealed |
Terminal type: | THROUGH-HOLE |
Terminal pitch: | 2.54 mm |
Terminal location: | DUAL |
Maximum time at peak reflux temperature: | thirty |
Width: | 7.62 mm |
UPs/uCs/peripheral integrated circuit type: | MICROCONTROLLER, RISC |
Base Number Matches: | one |
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