| model: | OPA2354AIDDA |
|
| Brand Name： | Texas Instruments |
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| IHS Manufacturer: | TEXAS INSTRUMENTS INC |
| Part package code: | SOIC |
| Packing instructions: | SOP-8 |
| Number of stitches: | eight |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.33.00.01 |
| Factory Lead Time： | 1 week |
| Risk level: | one point six four |
| Samacsys Confidence： | four |
| Samacsys Status： | Released |
| 2D Presentation： | https://componentsearchengine.com/2D/0T/4057.1.2.png |
| Schematic Symbol： | https://componentsearchengine.com/symbol.php?partID=4057 |
| PCB Footprint： | https://componentsearchengine.com/footprint.php?partID=4057 |
| 3D View： | https://componentsearchengine.com/viewer/3D.php?partID=4057 |
| Samacsys PartID： | four thousand and fifty-seven |
| Samacsys Image： | https://componentsearchengine.com/Images/9/OPA2354AIDDA.jpg |
| Samacsys Thumbnail Image： | https://componentsearchengine.com/Thumbnails/1/OPA2354AIDDA.jpg |
| Samacsys Pin Count： | nine |
| Samacsys Part Category： | Integrated Circuit |
| Samacsys Package Category： | Small Outline Packages |
| Samacsys Footprint Name： | DDA (R-PDSO-G8) |
| Samacsys Released Date： | 2015-05-20 08:41:29 |
| Is Samacsys： | N |
| Amplifier type: | OPERATIONAL AMPLIFIER |
| framework: | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB): | 0.00005 µA |
| Maximum bias current (IIB) at 25C: | 0.00005 µA |
| Minimum common mode rejection ratio: | 66 dB |
| Nominal common mode rejection ratio: | 80 dB |
| Frequency compensation: | YES |
| Maximum input offset current (IIO): | 0.00005 µA |
| Maximum input offset voltage: | 8000 µV |
| JESD-30 code: | R-PDSO-G8 |
| JESD-609 code: | e3 |
| Length: | 4.89 mm |
| Low Offset: | YES |
| Low maladjustment: | NO |
| Micro power: | NO |
| Humidity sensitivity level: | one |
| Number of functions: | two |
| Number of terminals: | eight |
| Maximum operating temperature: | 125 °C |
| Minimum operating temperature: | -40 °C |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | HLSOP |
| Package shape: | RECTANGULAR |
| Packaging form: | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
| Packaging method: | TUBE |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power: | NO |
| Programmable power: | NO |
| Certification status: | Not Qualified |
| Maximum height of seating surface: | 1.7 mm |
| Nominal wobble rate: | 150 V/us |
| Subcategory: | Operational Amplifier |
| Maximum slewing rate: | 6 mA |
| Upper limit of supply voltage: | 7.5 V |
| Nominal supply voltage (Vsup): | 5 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | AUTOMOTIVE |
| Terminal surface layer: | Matte Tin (Sn) |
| Terminal type: | GULL WING |
| Terminal pitch: | 1.27 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Nominal uniform gain bandwidth: | 100000 kHz |
| Minimum voltage gain: | fifty thousand one hundred and eighteen point seven two three |
| Broadband: | YES |
| Width: | 3.9 mm |
| Base Number Matches： | one |
|
