SCP (Single Chip Package) refers to the external packaging mode of the chip. Single chip microcomputer is a kind of microcomputer that integrates microprocessor (CPU), memory (including ROM and RAM), input/output interface (I/O), timer/counter and other functional modules. Packaging refers to packaging these chips into entities for welding and use on the circuit board. The packaging forms of single chip microcomputer are various, mainly depending on the application requirements of single chip microcomputer B50610C1KMLG Factors such as chip size, number of pins and production cost.
The following are some common single-chip packaging types:
1. Dual In Line Package (DIP, Dual In-line Package）
DIP packaging is a classic packaging form. Its pins protrude vertically from both sides of the chip and are arranged in two rows. The DIP packaged MCU is easy to insert into the bread board or socket, which is easy to debug and replace, but it takes up large space and is not suitable for high-density installation.
2. Flatpack (QFP, Quad Flat Package）
The QFP packaged single-chip microcomputer has four side pins, which protrude from the edge of the chip in parallel. QFP package has a small size and a large number of pins, which is suitable for miniaturized and multi-functional electronic products.
3. BGA, Ball Grid Array
There are many solder balls at the bottom of the BGA packaged MCU, and the solder balls are arranged in a certain array. BGA packaging can provide more pins and better heat dissipation, but the welding process requires higher precision and technology.
4. Small size package (SOP, Small Outline Package）
SOP package is a kind of smaller package. Its pins protrude from both sides of the chip in parallel, which is smaller than DIP package. It is suitable for space constrained applications.
5. Ultra small package (TSSOP, Thin Shrink Small Outline Package）
TSSOP package is thinner and narrower than SOP package, and the pin spacing is smaller, which is suitable for high-density circuit board design.
6. Chip level packaging (CSP, Chip Scale Package）
The size of CSP package is close to the size of the chip itself, which greatly reduces the package volume of MCU, making it more suitable for portable and miniaturized devices.
The choice of packaging will affect the performance, heat dissipation, cost, circuit board design and other aspects of MCU. The designer needs to consider the following factors when choosing SCM packaging:
● Number of pins: The more functions of the single-chip microcomputer, the more pins are usually needed.
● Size limitation: portable and miniaturized devices usually have strict limits on the size of the MCU.
● Heat dissipation requirements: MCU will generate heat when working, and packaging needs to have good heat dissipation capacity.
● Signal integrity: high-speed MCU needs to consider the transmission quality and integrity of the signal.
● Reliability: Packaging needs to ensure mechanical and chemical stability in different environments.
● Cost: The complexity of packaging and material selection will affect the cost of SCM.
The packaging technology of single chip microcomputer is constantly improving, and new types of packaging such as 3D packaging and embedded packaging are also constantly developing to meet the needs of higher performance and smaller size. With the development of technology, the package of single-chip microcomputer in the future will be more miniaturized, intelligent and integrated.
