Chiplet technology is a technology that splits the entire chip into several smaller chips, and then integrates these chips together to build larger and more complex system chips. The use of chiplet technology can reduce manufacturing costs, improve system integration density, accelerate product development cycle, and facilitate cooperation and collaboration between different manufacturers.
To use chiplet technology to build large chips, the following steps and considerations are required:
1. Chip splitting: First, the entire large chip needs to be functionally split to determine which functional modules can be implemented as separate chiplets. This usually requires complex functional analysis and architectural design.
2. Interposer design: Interposer is usually used as a medium when integrating chiplets DS2181AQ The intermediate layer between the chip and the substrate is used to connect each chiplet. Therefore, it is necessary to design and manufacture high-quality interposer.
3. Communication interface design: It is very important to carry out data transmission and communication between chiplets. Efficient and reliable communication interfaces need to be designed to ensure that all chiplets can work together effectively.
4. Overall system integration: Accurately stack, align and package each chiplet and interposer to ensure the stability and reliability of the entire system chip.
5. Testing and verification: After the integration is completed, comprehensive testing and verification are required to ensure that the entire large chip functions normally, performs well, and is stable and reliable.
In general, building a large chip with chiplet technology requires comprehensive consideration of many factors, including chip splitting, interposer design, communication interface design, system integration, test verification and other links, in order to finally achieve a large chip with complete functions and superior performance.
