The printed circuit board (PCB) containing CPU chips is one of the core components of the computer motherboard, which connects various electronic components and AQW414EH Chip, and provide signal transmission and power distribution. When designing such PCB, it is necessary to consider manufacturability, that is, to ensure that the design can be reliably and efficiently manufactured. The manufacturing design of PCB with CPU chip will be introduced in detail below.
1. PCB hierarchical structure design: PCB with CPU chip usually contains multiple layers of circuit board, such as signal layer, ground wire layer, power layer, etc. In the design, it is necessary to reasonably arrange the layout between all levels to avoid signal interference and electromagnetic interference.
2. Chip packaging and layout: CPU chips are usually packaged with BGA (Ball Grid Array), whose pins are densely distributed. For PCB designers, it is necessary to reasonably layout chips and other electronic components to ensure the reliability of pin connection and signal integrity.
3. Power supply and ground wire layout: CPU chips have high requirements for power supply and ground wire, and need to provide stable power supply and low impedance ground wire. In the design, it is necessary to reasonably distribute the power supply and ground wire to reduce the influence of resistance, inductance and capacitance.
4. Signal integrity design: The CPU chip has a high working frequency and requires high signal integrity. In the design, the transmission line length, impedance matching, signal layer distribution and other factors of the signal need to be considered to ensure the accurate transmission of the signal.
5. Thermal design: CPU chip will generate a lot of heat during operation, so thermal design is required to maintain the normal operating temperature of the chip. In the design, it is necessary to reasonably arrange the heat sink, fan and cooling channel to ensure the heat dissipation effect of the chip.
6. Pad design: CPU chip packaged with BGA needs to be connected with PCB through pad. During design, it is necessary to reasonably arrange the position and size of pads to ensure the reliability and consistency of welding.
7. PCB material selection: For PCB design with CPU chip, high-performance materials with good thermal conductivity, low dielectric constant and low dielectric loss need to be selected to improve the heat dissipation performance and signal integrity of PCB.
8. DFM (Design for Manufacturing) design: In the design process, it is necessary to consider the constraints and requirements in the manufacturing process, such as minimum line width, line spacing, minimum aperture, etc., to ensure that the design can be reliably manufactured by the manufacturer.
The above are some important issues in the manufacturing design of PCB with CPU chips. Designers need to consider these issues comprehensively and work closely with manufacturers to ensure that the design can be successfully transformed into reliable PCB products.
