The evolution of advanced chip packaging technology can be traced back to the 1950s. With the emergence of integrated circuits, packaging technology began to develop. The following is the main evolution process of advanced chip packaging technology:
1. 2D packaging technology:
The earliest chip packaging technology was developed by LM741CN The chip is soldered to a metal lead and then packaged in a plastic or ceramic package. This two-dimensional packaging technology is simple and cheap, but the length of the lead and the distance between the leads limit the performance and density of the chip.
2. 3D packaging technology:
In order to improve the performance and density of chips, engineers began to try 3D packaging technology. This technology uses stacking or stacking to stack multiple chips together to form a chip stack. 3D packaging technology has greatly improved the performance and density of the chip, but it also faces problems such as heat dissipation and electromagnetic interference.
3. Ultra thin packaging technology:
In order to further improve the performance and density of chips, ultra-thin packaging technology came into being. This technology uses thinner packaging materials and packaging processes to package the chip into a thinner and lighter package, thus improving the performance and density of the chip. Ultra thin packaging technology mainly includes bare chip packaging, CSP (Chip Scale Package) packaging, etc.
4. Advanced packaging technology:
With the continuous development of integrated circuits, advanced packaging technology has gradually become a research hotspot. Advanced packaging technologies mainly include BGA (Ball Grid Array), QFN (Quad Flat No Lead), WLP (Wafer Level Package), etc. These packaging technologies have higher density, lower power consumption and better heat dissipation performance, which can meet the application requirements of high performance and high reliability.
5. Advanced packaging materials:
In order to meet the requirements of chip packaging technology, it is also necessary to develop advanced packaging materials. With the development of advanced packaging technology, packaging materials are also constantly innovating. For example, low-temperature packaging materials can reduce the thermal stress on the chip during packaging and improve the reliability of packaging; High thermal conductivity packaging materials can improve heat dissipation performance and reduce chip temperature.
In summary, the evolution process of advanced chip packaging technology includes the development of two-dimensional packaging technology, three-dimensional packaging technology, ultra-thin packaging technology, advanced packaging technology and advanced packaging materials. The continuous innovation of these technologies and materials has promoted the continuous progress of chip packaging technology and met the requirements of different application scenarios for chip performance and reliability.
