model: | MAX2044ETP+ |
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Lead free: | Lead free |
Rohs certification or not: | accord with |
Lifecycle: | Active |
Part package code: | QFN |
Packing instructions: | HVQCCN, LCC20,.20SQ,25 |
Number of stitches: | twenty |
Reach Compliance Code: | compliant |
ECCN code: | 5A991 |
HTS Code: | 8542.39.00.01 |
Factory Lead Time: | 6 weeks |
Risk level: | five point one three |
JESD-30 code: | S-XQCC-N20 |
JESD-609 code: | e3 |
Length: | 5 mm |
Humidity sensitivity level: | one |
Number of functions: | one |
Number of terminals: | twenty |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | -40 °C |
Packaging body material: | UNSPECIFIED |
Encapsulation code: | HVQCCN |
Encapsulation equivalent code: | LCC20,.20SQ,25 |
Package shape: | SQUARE |
Packaging form: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak reflux temperature (° C): | two hundred and sixty |
Power Supply: | 3.3/5 V |
Certification status: | Not Qualified |
Maximum height of seating surface: | 0.8 mm |
Subcategory: | Other Telecom ICs |
Maximum slewing rate: | 0.155 mA |
Nominal supply voltage: | 3.3 V |
Surface mounting: | YES |
Technology: | BICMOS |
Telecom IC type: | RF AND BASEBAND CIRCUIT |
Temperature class: | INDUSTRIAL |
Terminal surface layer: | Matte Tin (Sn) |
Terminal type: | NO LEAD |
Terminal pitch: | 0.65 mm |
Terminal location: | QUAD |
Maximum time at peak reflux temperature: | NOT SPECIFIED |
Width: | 5 mm |
Base Number Matches: | one |
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