model: | L9A0212 |
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Lead free: | Lead |
Rohs certification or not: | Non conformance |
Lifecycle: | Transferred |
IHS Manufacturer: | LSI CORP |
Part package code: | BGA |
Packing instructions: | BGA, |
Number of stitches: | two hundred and fifty-six |
Reach Compliance Code: | compliant |
ECCN code: | 3A001.A.3 |
HTS Code: | 8542.31.00.01 |
Risk level: | five point eight eight |
Other features: | ALSO OPERATES AT 1.8V SUPPLY AT 50 MHZ |
Address bus width: | |
Bit size: | thirty-two |
Boundary scan: | YES |
Maximum clock frequency: | 85 MHz |
External data bus width: | |
Format: | FIXED POINT |
Integrated cache: | YES |
JESD-30 code: | S-PBGA-B256 |
JESD-609 code: | e0 |
Length: | 27 mm |
Low power mode: | YES |
Number of terminals: | two hundred and fifty-six |
Maximum operating temperature: | 70 °C |
Minimum operating temperature: | |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | BGA |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY |
Peak reflux temperature (° C): | two hundred and twenty-five |
Certification status: | Not Qualified |
Maximum height of seating surface: | 2.3 mm |
Speed: | 85 MHz |
Maximum supply voltage: | 2.63 V |
Minimum supply voltage: | 2.38 V |
Nominal supply voltage: | 2.5 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | COMMERCIAL |
Terminal surface layer: | TIN LEAD |
Terminal type: | BALL |
Terminal pitch: | 1.27 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | thirty |
Width: | 27 mm |
UPs/uCs/peripheral integrated circuit type: | MICROPROCESSOR, RISC |
Base Number Matches: | one |
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