| model: | K9K1208D0C-GCB00 |
|
| Rohs certification or not: | Non conformance |
| Lifecycle: | Obsolete |
| IHS Manufacturer: | SAMSUNG SEMICONDUCTOR INC |
| Part package code: | BGA |
| Packing instructions: | 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63 |
| Number of stitches: | sixty-three |
| Reach Compliance Code： | compliant |
| ECCN code: | 3A991.B.1.A |
| HTS Code: | 8542.32.00.51 |
| Risk level: | five point eight seven |
| Is Samacsys： | N |
| Maximum access time: | 30 ns |
| Command user interface: | YES |
| Data polling: | NO |
| JESD-30 code: | R-PBGA-B63 |
| Length: | 11 mm |
| Memory density: | 536870912 bit |
| Memory IC type: | FLASH |
| Memory width: | eight |
| Number of functions: | one |
| Number/scale of departments: | 4K |
| Number of terminals: | sixty-three |
| Number of words: | 67108864 words |
| Word number code: | sixty-four million |
| Operating mode: | ASYNCHRONOUS |
| Maximum operating temperature: | 70 °C |
| Minimum operating temperature: | |
| Organization: | 64MX8 |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | TFBGA |
| Encapsulation equivalent code: | BGA63,10X12,32 |
| Package shape: | RECTANGULAR |
| Packaging form: | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Page size: | 512 words |
| Parallel/serial: | PARALLEL |
| Power Supply: | 2.65 V |
| Programming voltage: | 2.7 V |
| Certification status: | Not Qualified |
| Ready/Busy: | YES |
| Maximum height of seating surface: | 1.2 mm |
| Department size: | 16K |
| Maximum standby current: | 0.00005 A |
| Subcategory: | Flash Memories |
| Maximum slewing rate: | 0.02 mA |
| Maximum supply voltage (Vsup): | 2.9 V |
| Minimum supply voltage (Vsup): | 2.4 V |
| Nominal supply voltage (Vsup): | 2.65 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | COMMERCIAL |
| Terminal type: | BALL |
| Terminal pitch: | 0.8 mm |
| Terminal location: | BOTTOM |
| Switch bit: | NO |
| Type: | NAND TYPE |
| Width: | 9 mm |
| Base Number Matches： | one |
|
