K9F5616QOC-DCBO Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • K9F5616QOC-DCBO
  • number -
  • manufactor -
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  •  QQ:2881495808 QQ:2881495808 copy
     QQ:308365177 QQ:308365177 copy
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  K9F5616QOC-DCBO Diagram
  • Beijing Zhongqi Weiye Technology Co., Ltd

      This member has used this website for more than 16 years
  • K9F5616QOC-DCBO
  • number 1658 
  • manufactor SAMSUNG 
  • encapsulation N/A 
  • Batch No 16+ 
  • Special price, original genuine, absolute company stock, original special price!
  •  QQ:2880824479 QQ:2880824479 copy
  • 010-66001623  QQ:2880824479
  •  K9F5616QOC-DCBO Diagram
  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 11 years
  • K9F5616QOC-DCBO
  • number 12000 
  • manufactor Original brand
  • encapsulation Original factory appearance
  • Batch No  
  • New and original parts of the stock and other orders
  •  QQ:2881493920 QQ:2881493920 copy
     QQ:2881493921 QQ:2881493921 copy
  • 0755-88608801 multi line  QQ:2881493920 QQ:2881493921
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K9F5616U0B-DCB0 Product Parameters
model: K9F5616U0B-DCB0
Lifecycle: Obsolete
IHS Manufacturer: SAMSUNG SEMICONDUCTOR INC
Part package code: BGA
Packing instructions: 9 X 11 MM, 0.80 MM PITCH, TBGA-63
Number of stitches: sixty-three
Reach Compliance Code: compliant
ECCN code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Risk level: five point eight four
Is Samacsys: N
Maximum access time: 30 ns
Other features: CONTAINS ADDITIONAL 512K X 16 BIT NAND FLASH
Command user interface: YES
Data polling: NO
JESD-30 code: R-PBGA-B63
Length: 11 mm
Memory density: 268435456 bit
Memory IC type: FLASH
Memory width: sixteen
Number of functions: one
Number/scale of departments: 2K
Number of terminals: sixty-three
Number of words: 16777216 words
Word number code: sixteen million
Operating mode: ASYNCHRONOUS
Maximum operating temperature: 70 °C
Minimum operating temperature:
Organization: 16MX16
Packaging body material: PLASTIC/EPOXY
Encapsulation code: VFBGA
Encapsulation equivalent code: BGA63,10X12,32
Package shape: RECTANGULAR
Packaging form: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page size: 256 words
Parallel/serial: PARALLEL
Power Supply: 3.3 V
Programming voltage: 2.7 V
Certification status: Not Qualified
Ready/Busy: YES
Maximum height of seating surface: 1 mm
Department size: 8K
Maximum standby current: 0.00005 A
Subcategory: Flash Memories
Maximum slewing rate: 0.02 mA
Maximum supply voltage (Vsup): 3.6 V
Minimum supply voltage (Vsup): 2.7 V
Nominal supply voltage (Vsup): 3.3 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Switch bit: NO
Type: NAND TYPE
Width: 9 mm
Base Number Matches: one
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