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    • Shenzhen Xinfulin Electronics Co., Ltd

           This member has used this website for more than 15 years

    • K9F5608UOB-VIBO
    • number -
    • manufactor -
    • encapsulation -
    • Batch No -
    • -
    • QQ:2881495808 QQ:308365177
    • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven QQ:2881495808 QQ:308365177
    more
    • K9F5608UOB-VIBO Diagram

    • Beijing Zhongqi Weiye Technology Co., Ltd

        This member has used this website for more than 16 years
    • K9F5608UOB-VIBO
    • number 862 
    • manufactor SAMSUNG 
    • encapsulation N/A 
    • Batch No 16+ 
    • Special price, original genuine, absolute company stock, original special price!
    • QQ:2880824479
    • 010-66001621 QQ:2880824479
    • K9F5608UOB-VIBO Diagram

    • Shenzhen First Line Semiconductor Co., Ltd

        This member has used this website for more than 11 years
    • K9F5608UOB-VIBO
    • number 28000 
    • manufactor Original brand
    • encapsulation Original factory appearance
    • Batch No  
    • New and original parts of the stock and other orders
    • QQ:2881493920 QQ:2881493921
    • 0755-88608801 multi line QQ:2881493920 QQ:2881493921
    Direct train with order
    K9F5616D0C-DCB0 Product Parameters
    model: K9F5616D0C-DCB0
    Lifecycle: Obsolete
    Packing instructions: FBGA, BGA63,10X12,32
    Reach Compliance Code： compliant
    Risk level: five point eight four
    Maximum access time: 30 ns
    Command user interface: YES
    Data polling: NO
    JESD-30 code: R-PBGA-B63
    Memory density: 268435456 bit
    Memory IC type: FLASH
    Memory width: sixteen
    Number/scale of departments: 2K
    Number of terminals: sixty-three
    Number of words: 16777216 words
    Word number code: sixteen million
    Maximum operating temperature: 70 °C
    Minimum operating temperature:
    Organization: 16MX16
    Packaging body material: PLASTIC/EPOXY
    Encapsulation code: FBGA
    Encapsulation equivalent code: BGA63,10X12,32
    Package shape: RECTANGULAR
    Packaging form: GRID ARRAY, FINE PITCH
    Page size: 256 words
    Parallel/serial: PARALLEL
    Power Supply: 2.65 V
    Certification status: Not Qualified
    Ready/Busy: YES
    Department size: 8K
    Maximum standby current: 0.00005 A
    Subcategory: Flash Memories
    Maximum slewing rate: 0.02 mA
    Nominal supply voltage (Vsup): 2.65 V
    Surface mounting: YES
    Technology: CMOS
    Temperature class: COMMERCIAL
    Terminal type: BALL
    Terminal pitch: 0.8 mm
    Terminal location: BOTTOM
    Switch bit: NO
    Type: NAND TYPE
    Base Number Matches： one
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