K9F5608U00 Schematic Diagram Functional Circuit Principle Chip Pin Definition Pin Diagram and Functions - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • K9F5608U00
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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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K9F5608U0A-YCB0 Product Parameters
model: K9F5608U0A-YCB0
Lead free: Lead
Rohs certification or not: Non conformance
Lifecycle: Obsolete
IHS Manufacturer: SAMSUNG SEMICONDUCTOR INC
Part package code: TSOP1
Packing instructions: TSOP1, TSSOP48,.8,20
Number of stitches: forty-eight
Reach Compliance Code: compliant
ECCN code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Risk level: five point eight nine
Is Samacsys: N
Maximum access time: 35 ns
Other features: CONTAINS ADDITIONAL 1M X 8 BIT NAND FLASH
Command user interface: YES
Data polling: NO
JESD-30 code: R-PDSO-G48
JESD-609 code: e0
Length: 18.4 mm
Memory density: 268435456 bit
Memory IC type: FLASH
Memory width: eight
Number of functions: one
Number/scale of departments: 2K
Number of terminals: forty-eight
Number of words: 33554432 words
Word number code: thirty-two million
Operating mode: ASYNCHRONOUS
Maximum operating temperature: 70 °C
Minimum operating temperature:
Organization: 32MX8
Packaging body material: PLASTIC/EPOXY
Encapsulation code: TSOP1
Encapsulation equivalent code: TSSOP48,.8,20
Package shape: RECTANGULAR
Packaging form: SMALL OUTLINE, THIN PROFILE
Page size: 512 words
Parallel/serial: PARALLEL
Peak reflux temperature (° C): NOT SPECIFIED
Power Supply: 3.3 V
Programming voltage: 2.7 V
Certification status: Not Qualified
Ready/Busy: YES
Maximum height of seating surface: 1.2 mm
Department size: 16K
Maximum standby current: 0.00005 A
Subcategory: Flash Memories
Maximum slewing rate: 0.02 mA
Maximum supply voltage (Vsup): 3.6 V
Minimum supply voltage (Vsup): 2.7 V
Nominal supply voltage (Vsup): 3.3 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL
Terminal surface layer: Tin/Lead (Sn/Pb)
Terminal type: GULL WING
Terminal pitch: 0.5 mm
Terminal location: DUAL
Maximum time at peak reflux temperature: NOT SPECIFIED
Switch bit: NO
Type: NAND TYPE
Width: 12 mm
Base Number Matches: one
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