| model: | K9F5608R0D-JIB0 |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Obsolete |
| IHS Manufacturer: | SAMSUNG SEMICONDUCTOR INC |
| Packing instructions: | FBGA, BGA63,10X12,32 |
| Reach Compliance Code： | unknown |
| Risk level: | five point eight three |
| Maximum access time: | 35 ns |
| Command user interface: | YES |
| Data polling: | NO |
| JESD-30 code: | R-PBGA-B63 |
| JESD-609 code: | e3 |
| Memory density: | 268435456 bit |
| Memory IC type: | FLASH |
| Memory width: | eight |
| Humidity sensitivity level: | one |
| Number/scale of departments: | 2K |
| Number of terminals: | sixty-three |
| Number of words: | 33554432 words |
| Word number code: | thirty-two million |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Organization: | 32MX8 |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | FBGA |
| Encapsulation equivalent code: | BGA63,10X12,32 |
| Package shape: | RECTANGULAR |
| Packaging form: | GRID ARRAY, FINE PITCH |
| Page size: | 512 words |
| Parallel/serial: | PARALLEL |
| Peak reflux temperature (° C): | two hundred and twenty-five |
| Power Supply: | 1.8 V |
| Certification status: | Not Qualified |
| Ready/Busy: | YES |
| Department size: | 16K |
| Maximum standby current: | 0.00005 A |
| Subcategory: | Flash Memories |
| Maximum slewing rate: | 0.02 mA |
| Nominal supply voltage (Vsup): | 1.8 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) |
| Terminal type: | BALL |
| Terminal pitch: | 0.8 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Switch bit: | NO |
|
![K9F5608R0D-JIB0 [Advantage Inventory] Diagram](https://public.ic37.com/style/img/page/noimg.jpg){kind=small}
