K9F1G08U0C-PLBO Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • K9F1G08U0C-PLBO
  • number -
  • manufactor -
  • encapsulation -
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  •  QQ:2881495808 QQ:2881495808 copy
     QQ:308365177 QQ:308365177 copy
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  K9F1G08U0C-PLBO Diagram
  • Gather the core city

      This member has used this website for more than 13 years
  • K9F1G08U0C-PLBO
  • number 14004 
  • manufactor SAMSUNG/Samsung
  • encapsulation TSOP 
  • Batch No Latest batch
  • Original factory spot sale
  •  QQ:2880133232 QQ:2880133232 copy
     QQ:2880133232 QQ:2880133232 copy
  • 0755-83202411  QQ:2880133232 QQ:2880133232
  •  K9F1G08U0C-PLBO Diagram
  • Shenzhen Dejie Core City Technology Co., Ltd

      This member has used this website for more than 11 years
  • K9F1G08U0C-PLBO
  • number 3267 
  • manufactor SAMSUNG/Samsung
  • encapsulation NA/ 
  • Batch No 23+ 
  • Original stock, delivered on the same day, invoiced with prototype number
  •  QQ:2881489419 QQ:2881489419 copy
     QQ:3007947087 QQ:3007947087 copy
  • 0755-82546830  QQ:2881489419 QQ:3007947087
  •  K9F1G08U0C-PLBO Diagram
  • Gather the core city

      This member has used this website for more than 11 years
  • K9F1G08U0C-PLBO
  • number 14004 
  • manufactor SAMSUNG/Samsung
  • encapsulation TSOP 
  • Batch No Latest batch
  • Original factory spot sale
  •  QQ:3008092962 QQ:3008092962 copy
     QQ:3008092962 QQ:3008092962 copy
  • 0755-83209072  QQ:3008092962 QQ:3008092962
  •  K9F1G08U0C-PLBO Diagram
  • Shenzhen Zongtian Technology Development Co., Ltd

      This member has used this website for more than 10 years
  • K9F1G08U0C-PLBO
  • number 17 
  • manufactor SAMSUNG/Samsung
  • encapsulation TSOP 
  • Batch No 21+ 
  • Zongtian Technology original spot/fake one for ten
  •  QQ:444961496 QQ:444961496 copy
     QQ:2824256784 QQ:2824256784 copy
  • 0755-88601327  QQ:444961496 QQ:2824256784
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K9F1G08U0D-HCB00 Product Parameters
model: K9F1G08U0D-HCB00
Rohs certification or not: accord with
Lifecycle: Obsolete
IHS Manufacturer: SAMSUNG SEMICONDUCTOR INC
Part package code: BGA
Packing instructions: 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63
Number of stitches: sixty-three
Reach Compliance Code: unknown
ECCN code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Risk level: five point eight four
Maximum access time: 20 ns
Other features: CONTAINS ADDITIONAL 32M BIT NAND FLASH
Command user interface: YES
Data polling: NO
JESD-30 code: R-PBGA-B63
Length: 11 mm
Memory density: 1073741824 bit
Memory IC type: FLASH
Memory width: eight
Number of functions: one
Number/scale of departments: 1K
Number of terminals: sixty-three
Number of words: 134217728 words
Word number code: one hundred and twenty-eight million
Operating mode: ASYNCHRONOUS
Maximum operating temperature: 70 °C
Minimum operating temperature:
Organization: 128MX8
Packaging body material: PLASTIC/EPOXY
Encapsulation code: VFBGA
Encapsulation equivalent code: BGA63,10X12,32
Package shape: RECTANGULAR
Packaging form: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page size: 2K words
Parallel/serial: PARALLEL
Power Supply: 3/3.3 V
Programming voltage: 2.7 V
Certification status: Not Qualified
Ready/Busy: YES
Maximum height of seating surface: 1 mm
Department size: 128K
Maximum standby current: 0.00008 A
Subcategory: Flash Memories
Maximum slewing rate: 0.035 mA
Maximum supply voltage (Vsup): 3.6 V
Minimum supply voltage (Vsup): 2.7 V
Nominal supply voltage (Vsup): 3.3 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Switch bit: NO
Type: SLC NAND TYPE
Width: 9 mm
Base Number Matches: one
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Records selected for batch RFQ Selected zero 15 at most each time.
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