| model: | K6R4016V1D-TC10 |
|
| Lead free: | Lead |
| Rohs certification or not: | Non conformance |
| Lifecycle: | Obsolete |
| IHS Manufacturer: | SAMSUNG SEMICONDUCTOR INC |
| Part package code: | TSOP2 |
| Packing instructions: | TSOP2, TSOP44,.46,32 |
| Number of stitches: | forty-four |
| Reach Compliance Code： | compliant |
| ECCN code: | 3A991.B.2.A |
| HTS Code: | 8542.32.00.41 |
| Risk level: | five point eight |
| Maximum access time: | 10 ns |
| I/O type: | COMMON |
| JESD-30 code: | R-PDSO-G44 |
| JESD-609 code: | e0 |
| Length: | 18.41 mm |
| Memory density: | 4194304 bit |
| Memory IC type: | STANDARD SRAM |
| Memory width: | sixteen |
| Humidity sensitivity level: | three |
| Number of functions: | one |
| Number of terminals: | forty-four |
| Number of words: | 262144 words |
| Word number code: | two hundred and fifty-six thousand |
| Operating mode: | ASYNCHRONOUS |
| Maximum operating temperature: | 70 °C |
| Minimum operating temperature: | |
| Organization: | 256KX16 |
| Output characteristics: | 3-STATE |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | TSOP2 |
| Encapsulation equivalent code: | TSOP44,.46,32 |
| Package shape: | RECTANGULAR |
| Packaging form: | SMALL OUTLINE, THIN PROFILE |
| Parallel/serial: | PARALLEL |
| Peak reflux temperature (° C): | NOT SPECIFIED |
| Power Supply: | 3.3 V |
| Certification status: | Not Qualified |
| Maximum height of seating surface: | 1.2 mm |
| Maximum standby current: | 0.005 A |
| Minimum standby current: | 3 V |
| Subcategory: | SRAMs |
| Maximum slewing rate: | 0.065 mA |
| Maximum supply voltage (Vsup): | 3.6 V |
| Minimum supply voltage (Vsup): | 3 V |
| Nominal supply voltage (Vsup): | 3.3 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | COMMERCIAL |
| Terminal surface layer: | Tin/Lead (Sn/Pb) |
| Terminal type: | GULL WING |
| Terminal pitch: | 0.8 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 10.16 mm |
|
