| model: | K4T51163QJ-BCF70 |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Obsolete |
| IHS Manufacturer: | SAMSUNG SEMICONDUCTOR INC |
| Part package code: | BGA |
| Packing instructions: | TFBGA, BGA84,9X15,32 |
| Number of stitches: | eighty-four |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.32.00.28 |
| Risk level: | five point seven one |
| Access mode: | FOUR BANK PAGE BURST |
| Maximum access time: | 0.4 ns |
| Other features: | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK): | 400 MHz |
| I/O type: | COMMON |
| Interlaced burst length: | 4,8 |
| JESD-30 code: | R-PBGA-B84 |
| JESD-609 code: | e1 |
| Length: | 12.5 mm |
| Memory density: | 536870912 bit |
| Memory IC type: | DDR DRAM |
| Memory width: | sixteen |
| Humidity sensitivity level: | two |
| Number of functions: | one |
| Number of ports: | one |
| Number of terminals: | eighty-four |
| Number of words: | 33554432 words |
| Word number code: | thirty-two million |
| Operating mode: | SYNCHRONOUS |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | |
| Organization: | 32MX16 |
| Output characteristics: | 3-STATE |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | TFBGA |
| Encapsulation equivalent code: | BGA84,9X15,32 |
| Package shape: | RECTANGULAR |
| Packaging form: | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 1.8 V |
| Certification status: | Not Qualified |
| Refresh cycle: | eight thousand one hundred and ninety-two |
| Maximum height of seating surface: | 1.2 mm |
| Self refresh: | YES |
| Continuous burst length: | 4,8 |
| Maximum standby current: | 0.008 A |
| Subcategory: | DRAMs |
| Maximum slewing rate: | 0.18 mA |
| Maximum supply voltage (Vsup): | 1.9 V |
| Minimum supply voltage (Vsup): | 1.7 V |
| Nominal supply voltage (Vsup): | 1.8 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | OTHER |
| Terminal surface layer: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal type: | BALL |
| Terminal pitch: | 0.8 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | forty |
| Width: | 7.5 mm |
| Base Number Matches： | one |
|
