K4S51323PF-MF75000 New Original Schematic Diagram Functional Circuit Principle of Each Pin Chip Pin Definition - China IC Network - Core 37
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    • Shenzhen Xinfulin Electronics Co., Ltd

           This member has used this website for more than 15 years

    • K4S51323PF-MF75000
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    • K4S51323PF-MF75000 drawing

    • Shenzhen Yuchuanxiang Technology Co., Ltd

        This member has used this website for more than 6 years
    • K4S51323PF-MF75000
    • number 23000 
    • manufactor SAMSUNG SEMI 
    • encapsulation Original package
    • Batch No 23+ 
    • The original and genuine products are in stock, and we solemnly promise to only make the original!
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    • K4S51323PF-MF75000 drawing

    • Shenzhen Jingmeilong Technology Co., Ltd

        This member has used this website for more than 14 years
    • K4S51323PF-MF75000
    • number 13600 
    • manufactor SAMSUNG SEMI 
    • encapsulation Original packaging
    • Batch No 23+ 
    • Brand new genuine products are hot in stock
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    • K4S51323PF-MF75000 drawing

    • Shenzhen First Line Semiconductor Co., Ltd

        This member has used this website for more than 11 years
    • K4S51323PF-MF75000
    • number 28000 
    • manufactor Original brand
    • encapsulation Original factory appearance
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    K4S51323PF-MF750JR product parameters
    model: K4S51323PF-MF750JR
    Lifecycle: Obsolete
    IHS Manufacturer: SAMSUNG SEMICONDUCTOR INC
    Part package code: BGA
    Packing instructions: LFBGA,
    Number of stitches: ninety
    Reach Compliance Code： unknown
    ECCN code: EAR99
    HTS Code: 8542.32.00.28
    Risk level: five point eight four
    Access mode: FOUR BANK PAGE BURST
    Maximum access time: 6 ns
    Other features: AUTO/SELF REFRESH
    JESD-30 code: R-PBGA-B90
    Length: 13 mm
    Memory density: 536870912 bit
    Memory IC type: SYNCHRONOUS DRAM
    Memory width: thirty-two
    Number of functions: one
    Number of ports: one
    Number of terminals: ninety
    Number of words: 16777216 words
    Word number code: sixteen million
    Operating mode: SYNCHRONOUS
    Maximum operating temperature: 70 °C
    Minimum operating temperature: -25 °C
    Organization: 16MX32
    Packaging body material: PLASTIC/EPOXY
    Encapsulation code: LFBGA
    Package shape: RECTANGULAR
    Packaging form: GRID ARRAY, LOW PROFILE, FINE PITCH
    Certification status: Not Qualified
    Maximum height of seating surface: 1.4 mm
    Self refresh: YES
    Maximum supply voltage (Vsup): 1.95 V
    Minimum supply voltage (Vsup): 1.7 V
    Nominal supply voltage (Vsup): 1.8 V
    Surface mounting: YES
    Technology: CMOS
    Temperature class: OTHER
    Terminal type: BALL
    Terminal pitch: 0.8 mm
    Terminal location: BOTTOM
    Width: 11 mm
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