model: | K4N51163QE-ZC25 |
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Lead free: | Lead free |
Rohs certification or not: | accord with |
Lifecycle: | Obsolete |
IHS Manufacturer: | SAMSUNG SEMICONDUCTOR INC |
Packing instructions: | FBGA, BGA84,9X15,32 |
Reach Compliance Code: | compliant |
Risk level: | five point eight |
Maximum access time: | 0.4 ns |
Maximum clock frequency (fCLK): | 400 MHz |
I/O type: | COMMON |
Interlaced burst length: | 4,8 |
JESD-30 code: | R-PBGA-B84 |
Memory density: | 536870912 bit |
Memory IC type: | CACHE DRAM MODULE |
Memory width: | sixteen |
Humidity sensitivity level: | three |
Number of terminals: | eighty-four |
Number of words: | 33554432 words |
Word number code: | thirty-two million |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | |
Organization: | 32MX16 |
Output characteristics: | 3-STATE |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | FBGA |
Encapsulation equivalent code: | BGA84,9X15,32 |
Package shape: | RECTANGULAR |
Packaging form: | GRID ARRAY, FINE PITCH |
Peak reflux temperature (° C): | two hundred and sixty |
Power Supply: | 1.8 V |
Certification status: | Not Qualified |
Refresh cycle: | eight thousand one hundred and ninety-two |
Continuous burst length: | 4,8 |
Maximum standby current: | 0.008 A |
Subcategory: | DRAMs |
Maximum slewing rate: | 0.28 mA |
Nominal supply voltage (Vsup): | 1.8 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | OTHER |
Terminal type: | BALL |
Terminal pitch: | 0.8 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | NOT SPECIFIED |
Base Number Matches: | one |
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