K4H561838TCB-3000 Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • K4H561838TCB-3000
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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  K4H561838TCB-3000 drawing
  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 16 years
  • K4H561838TCB-3000
  • number 28000 
  • manufactor Original brand
  • encapsulation Original factory appearance
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  • New and original parts of the stock and other orders
  •  QQ:2881493920 QQ:2881493921
  • 0755-88608801 multi line  QQ:2881493920 QQ:2881493921
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K4H641638N-FCB30 Product Parameters
model: K4H641638N-FCB30
Rohs certification or not: accord with
Lifecycle: Obsolete
Part package code: BGA
Packing instructions: TFBGA, BGA60,9X12,40/32
Number of stitches: sixty
Reach Compliance Code: unknown
ECCN code: EAR99
HTS Code: 8542.32.00.02
Risk level: five point eight three
Access mode: FOUR BANK PAGE BURST
Maximum access time: 0.7 ns
Other features: AUTO/SELF REFRESH
Maximum clock frequency (fCLK): 166 MHz
I/O type: COMMON
Interlaced burst length: 2,4,8
JESD-30 code: R-PBGA-B60
Length: 12 mm
Memory density: 67108864 bit
Memory IC type: DDR DRAM
Memory width: sixteen
Number of functions: one
Number of ports: one
Number of terminals: sixty
Number of words: 4194304 words
Word number code: four million
Operating mode: SYNCHRONOUS
Maximum operating temperature: 70 °C
Minimum operating temperature:
Organization: 4MX16
Output characteristics: 3-STATE
Packaging body material: PLASTIC/EPOXY
Encapsulation code: TFBGA
Encapsulation equivalent code: BGA60,9X12,40/32
Package shape: RECTANGULAR
Packaging form: GRID ARRAY, THIN PROFILE, FINE PITCH
Peak reflux temperature (° C): NOT SPECIFIED
Power Supply: 2.5 V
Certification status: Not Qualified
Refresh cycle: four thousand and ninety-six
Maximum height of seating surface: 1.2 mm
Self refresh: YES
Continuous burst length: 2,4,8
Maximum standby current: 0.004 A
Subcategory: DRAMs
Maximum slewing rate: 0.2 mA
Maximum supply voltage (Vsup): 2.7 V
Minimum supply voltage (Vsup): 2.3 V
Nominal supply voltage (Vsup): 2.5 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: NOT SPECIFIED
Width: 8 mm
Base Number Matches: one
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