K4D26323RA-BC2B Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • K4D26323RA-BC2B
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  •  QQ:2881495808 QQ:2881495808 copy
     QQ:308365177 QQ:308365177 copy
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  K4D26323RA-BC2B Diagram
  • 80 Youchuang Group

      This member has used this website for more than 15 years
  • K4D26323RA-BC2B  Spot stock
  • number 685600 
  • manufactor SAMSUNG 
  • encapsulation BGA 
  • Batch No 22+ 
  • 18664558455 召召召召召召召召召召召召召召召
  •  QQ:2880720332 QQ:2880720332 copy
     QQ:2880720334 QQ:2880720334 copy
  • 0755-88601790  QQ:2880720332 QQ:2880720334
  •  K4D26323RA-BC2B Diagram
  • Shenzhen Xinfulin Electronics Co., Ltd

      This member has used this website for more than 15 years
  • K4D26323RA-BC2B
  • number 65000 
  • manufactor SAMSUNG 
  • encapsulation BGA 
  • Batch No 23+ 
  • Real stock brand new genuine! Agent this model
  •  QQ:2881495753 QQ:2881495753 copy
  • 0755-23605827  QQ:2881495753
  •  K4D26323RA-BC2B Diagram
  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 16 years
  • K4D26323RA-BC2B
  • number 28000 
  • manufactor Original brand
  • encapsulation Original factory appearance
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  • New and original parts of the stock and other orders
  •  QQ:2881493920 QQ:2881493920 copy
     QQ:2881493921 QQ:2881493921 copy
  • 0755-88608801 multi line  QQ:2881493920 QQ:2881493921
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K4D26323RA-GC2A product parameters
model: K4D26323RA-GC2A
Rohs certification or not: Non conformance
Lifecycle: Obsolete
IHS Manufacturer: SAMSUNG SEMICONDUCTOR INC
Part package code: BGA
Packing instructions: LFBGA, BGA144,12X12,32
Number of stitches: one hundred and forty-four
Reach Compliance Code: compliant
ECCN code: EAR99
HTS Code: 8542.32.00.02
Risk level: five point seven six
Is Samacsys: N
Access mode: FOUR BANK PAGE BURST
Maximum access time: 0.6 ns
Other features: AUTO/SELF REFRESH
Maximum clock frequency (fCLK): 350 MHz
I/O type: COMMON
Interlaced burst length: 2,4,8
JESD-30 code: S-PBGA-B144
JESD-609 code: e0
Length: 12 mm
Memory density: 134217728 bit
Memory IC type: DDR DRAM
Memory width: thirty-two
Number of functions: one
Number of ports: one
Number of terminals: one hundred and forty-four
Number of words: 4194304 words
Word number code: four million
Operating mode: SYNCHRONOUS
Maximum operating temperature: 65 °C
Minimum operating temperature:
Organization: 4MX32
Output characteristics: 3-STATE
Packaging body material: PLASTIC/EPOXY
Encapsulation code: LFBGA
Encapsulation equivalent code: BGA144,12X12,32
Package shape: SQUARE
Packaging form: GRID ARRAY, LOW PROFILE, FINE PITCH
Peak reflux temperature (° C): NOT SPECIFIED
Power Supply: 2.8 V
Certification status: Not Qualified
Refresh cycle: four thousand and ninety-six
Maximum height of seating surface: 1.4 mm
Self refresh: YES
Continuous burst length: 2,4,8,FP
Maximum standby current: 0.085 A
Subcategory: DRAMs
Maximum slewing rate: 1.2 mA
Maximum supply voltage (Vsup): 2.94 V
Minimum supply voltage (Vsup): 2.66 V
Nominal supply voltage (Vsup): 2.8 V
Surface mounting: YES
Technology: CMOS
Temperature class: COMMERCIAL
Terminal surface layer: Tin/Lead (Sn/Pb)
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: NOT SPECIFIED
Width: 12 mm
Base Number Matches: one
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