IS42S16320D-6BI Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • IS42S16320D-6BI
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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  IS42S16320D-6BI diagram
  • Gather the core city

      This member has used this website for more than 13 years
  • IS42S16320D-6BI
  • number 15583 
  • manufactor ISSI/Silicone
  • encapsulation  
  • Batch No Latest batch
  • Original factory and original company
  •  QQ:3008092965 QQ:3008092965
  • 0755-83239307  QQ:3008092965 QQ:3008092965
  •  IS42S16320D-6BI diagram
  • Shenzhen First Line Semiconductor Co., Ltd

      This member has used this website for more than 15 years
  • IS42S16320D-6BI
  • number 7448 
  • manufactor ISSI. Integrated Silicon Solution Inc 
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  • New and original parts of the stock and other orders
  •  QQ:2881493920 QQ:2881493921
  • 0755-88608801 multi line  QQ:2881493920 QQ:2881493921
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IS42S16320D-7BLI product parameters
model: IS42S16320D-7BLI
Lead free: Lead free
Rohs certification or not: accord with
Lifecycle: Not Recommended
Part package code: DSBGA
Packing instructions: TFBGA, BGA54,9X9,32
Number of stitches: fifty-four
Reach Compliance Code: compliant
ECCN code: EAR99
HTS Code: 8542.32.00.28
Factory Lead Time: 6 weeks
Risk level: seven point nine eight
Access mode: FOUR BANK PAGE BURST
Maximum access time: 5.4 ns
Other features: AUTO/SELF REFRESH
Maximum clock frequency (fCLK): 143 MHz
I/O type: COMMON
Interlaced burst length: 1,2,4,8
JESD-30 code: R-PBGA-B54
JESD-609 code: e1
Length: 13 mm
Memory density: 536870912 bit
Memory IC type: SYNCHRONOUS DRAM
Memory width: sixteen
Humidity sensitivity level: three
Number of functions: one
Number of ports: one
Number of terminals: fifty-four
Number of words: 33554432 words
Word number code: thirty-two million
Operating mode: SYNCHRONOUS
Maximum operating temperature: 85 °C
Minimum operating temperature: -40 °C
Organization: 32MX16
Output characteristics: 3-STATE
Packaging body material: PLASTIC/EPOXY
Encapsulation code: TFBGA
Encapsulation equivalent code: BGA54,9X9,32
Package shape: RECTANGULAR
Packaging form: GRID ARRAY, THIN PROFILE, FINE PITCH
Peak reflux temperature (° C): two hundred and sixty
Power Supply: 3.3 V
Certification status: Not Qualified
Refresh cycle: eight thousand one hundred and ninety-two
Maximum height of seating surface: 1.2 mm
Self refresh: YES
Continuous burst length: 1,2,4,8,FP
Maximum standby current: 0.004 A
Subcategory: DRAMs
Maximum slewing rate: 0.22 mA
Maximum supply voltage (Vsup): 3.6 V
Minimum supply voltage (Vsup): 3 V
Nominal supply voltage (Vsup): 3.3 V
Surface mounting: YES
Technology: CMOS
Temperature class: INDUSTRIAL
Terminal surface layer: Tin/Silver/Copper (Sn/Ag/Cu)
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: ten
Width: 8 mm
Base Number Matches: one
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