| model: | IS42S16160G-7BLI |
|
| Rohs certification or not: | accord with |
| Lifecycle: | Not Recommended |
| IHS Manufacturer: | INTEGRATED SILICON SOLUTION INC |
| Part package code: | BGA |
| Packing instructions: | TFBGA, BGA54,9X9,32 |
| Number of stitches: | fifty-four |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| Factory Lead Time： | 6 weeks |
| Risk level: | seven point eight four |
| Access mode: | FOUR BANK PAGE BURST |
| Maximum access time: | 5.4 ns |
| Other features: | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK): | 143 MHz |
| I/O type: | COMMON |
| Interlaced burst length: | 1,2,4,8 |
| JESD-30 code: | S-PBGA-B54 |
| JESD-609 code: | e1 |
| Length: | 8 mm |
| Memory density: | 268435456 bit |
| Memory IC type: | SYNCHRONOUS DRAM |
| Memory width: | sixteen |
| Humidity sensitivity level: | three |
| Number of functions: | one |
| Number of ports: | one |
| Number of terminals: | fifty-four |
| Number of words: | 16777216 words |
| Word number code: | sixteen million |
| Operating mode: | SYNCHRONOUS |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Organization: | 16MX16 |
| Output characteristics: | 3-STATE |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | TFBGA |
| Encapsulation equivalent code: | BGA54,9X9,32 |
| Package shape: | SQUARE |
| Packaging form: | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 3.3 V |
| Certification status: | Not Qualified |
| Refresh cycle: | eight thousand one hundred and ninety-two |
| Maximum height of seating surface: | 1.2 mm |
| Self refresh: | YES |
| Continuous burst length: | 1,2,4,8,FP |
| Maximum standby current: | 0.004 A |
| Subcategory: | DRAMs |
| Maximum slewing rate: | 0.13 mA |
| Maximum supply voltage (Vsup): | 3.6 V |
| Minimum supply voltage (Vsup): | 3 V |
| Nominal supply voltage (Vsup): | 3.3 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal type: | BALL |
| Terminal pitch: | 0.8 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | ten |
| Width: | 8 mm |
| Base Number Matches： | one |
|
