IS42S16160G-5TLI brand new original schematic diagram Functional circuit principle of each pin Chip pin definition - China IC network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • IS42S16160G-5TLI
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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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  •  IS42S16160G-5TLI diagram
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      This member has used this website for more than 13 years
  • IS42S16160G-5TLI
  • number 16761 
  • manufactor ISSI 
  • encapsulation TSOP54 
  • Batch No Latest batch
  • Original factory and spot sold
  •  QQ:2880133232 QQ:2880133232
  • 0755-83202411  QQ:2880133232 QQ:2880133232
  •  IS42S16160G-5TLI diagram
  • Gather the core city

      This member has used this website for more than 13 years
  • IS42S16160G-5TLI
  • number 16761 
  • manufactor ISSI 
  • encapsulation TSOP54 
  • Batch No Latest batch
  • Original factory and spot sold
  •  QQ:3008092918 QQ:3008092918
  • 0755-83201437  QQ:3008092918 QQ:3008092918
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IS42S16160G-6BLI product parameters
model: IS42S16160G-6BLI
Rohs certification or not: accord with
Lifecycle: Not Recommended
Part package code: BGA
Packing instructions: TFBGA, BGA54,9X9,32
Number of stitches: fifty-four
Reach Compliance Code: compliant
ECCN code: EAR99
HTS Code: 8542.32.00.24
Factory Lead Time: 6 weeks
Risk level: seven point eight eight
Access mode: FOUR BANK PAGE BURST
Maximum access time: 5.4 ns
Other features: AUTO/SELF REFRESH
Maximum clock frequency (fCLK): 166 MHz
I/O type: COMMON
Interlaced burst length: 1,2,4,8
JESD-30 code: S-PBGA-B54
Length: 8 mm
Memory density: 268435456 bit
Memory IC type: SYNCHRONOUS DRAM
Memory width: sixteen
Number of functions: one
Number of ports: one
Number of terminals: fifty-four
Number of words: 16777216 words
Word number code: sixteen million
Operating mode: SYNCHRONOUS
Maximum operating temperature: 85 °C
Minimum operating temperature: -40 °C
Organization: 16MX16
Output characteristics: 3-STATE
Packaging body material: PLASTIC/EPOXY
Encapsulation code: TFBGA
Encapsulation equivalent code: BGA54,9X9,32
Package shape: SQUARE
Packaging form: GRID ARRAY, THIN PROFILE, FINE PITCH
Peak reflux temperature (° C): NOT SPECIFIED
Power Supply: 3.3 V
Certification status: Not Qualified
Refresh cycle: eight thousand one hundred and ninety-two
Maximum height of seating surface: 1.2 mm
Self refresh: YES
Continuous burst length: 1,2,4,8,FP
Maximum standby current: 0.004 A
Subcategory: DRAMs
Maximum slewing rate: 0.16 mA
Maximum supply voltage (Vsup): 3.6 V
Minimum supply voltage (Vsup): 3 V
Nominal supply voltage (Vsup): 3.3 V
Surface mounting: YES
Technology: CMOS
Temperature class: INDUSTRIAL
Terminal type: BALL
Terminal pitch: 0.8 mm
Terminal location: BOTTOM
Maximum time at peak reflux temperature: NOT SPECIFIED
Width: 8 mm
Base Number Matches: one
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