IRF640NPBF (ROHS) brand new original schematic diagram Functional circuit principle of each pin Chip pin definition - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  •  QQ:2881495808 QQ:308365177
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  •  IRF640NPBF (ROHS) diagram
  • Shenzhen Xinmai Industrial Co., Ltd

      This member has used this website for more than 11 years
  • IRF640NPBF(ROHS)  Spot stock
  • number 26980 
  • manufactor VISHAY 
  • encapsulation TO-220 
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  •  IRF640NPBF (ROHS) diagram
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      This member has used this website for more than 13 years
  • IRF640NPBF(ROHS)
  • number 8533 
  • manufactor VISHAY/VISCH
  • encapsulation TO-220 
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  •  QQ:3008092965 QQ:3008092965
  • 0755-83239307  QQ:3008092965 QQ:3008092965
  •  IRF640NPBF (ROHS) diagram
  • Shenzhen Xinmai Industrial Co., Ltd

      This member has used this website for more than 11 years
  • IRF640NPBF(ROHS)
  • number 26980 
  • manufactor VISHAY 
  • encapsulation TO-220 
  • Batch No New environmental protection batch
  • Newly arrived spot goods, first-hand source of goods, same day delivery, bom order allocation
  •  QQ:2881614656
  • 0755-84507451  QQ:2881614656
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IRF640NS product parameters
model: IRF640NS
Lead free: Lead
Rohs certification or not: Non conformance
Lifecycle: Transferred
Part package code: D2PAK
Packing instructions: PLASTIC, D2PAK-2/3
Number of stitches: three
Reach Compliance Code: unknown
ECCN code: EAR99
HTS Code: 8541.29.00.95
Risk level: five point zero three
Other features: AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
Avalanche energy efficiency grade (Eas): 247 mJ
Enclosure connection: DRAIN
to configure: SINGLE WITH BUILT-IN DIODE
Minimum drain source breakdown voltage: 200 V
Maximum drain current (Abs) (ID): 18 A
Maximum drain current (ID): 18 A
Maximum drain source on resistance: 0.15 Ω
FET technology: METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code: TO-263AB
JESD-30 code: R-PSSO-G2
JESD-609 code: e0
Humidity sensitivity level: one
Number of elements: one
Number of terminals: two
Operating mode: ENHANCEMENT MODE
Maximum operating temperature: 175 °C
Packaging body material: PLASTIC/EPOXY
Package shape: RECTANGULAR
Packaging form: SMALL OUTLINE
Peak reflux temperature (° C): two hundred and twenty-five
Polarity/Channel Type: N-CHANNEL
Maximum power dissipation (Abs): 150 W
Maximum pulse drain current (IDM): 72 A
Certification status: Not Qualified
Subcategory: FET General Purpose Powers
Surface mounting: YES
Terminal surface layer: Tin/Lead (Sn/Pb)
Terminal type: GULL WING
Terminal location: SINGLE
Maximum time at peak reflux temperature: thirty
Transistor applications: SWITCHING
Transistor element material: SILICON
Base Number Matches: one
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