model: | HV2762LA-G |
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Rohs certification or not: | accord with |
Lifecycle: | Active |
IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
Packing instructions: | VFBGA, |
Reach Compliance Code: | compliant |
HTS Code: | 8542.39.00.01 |
Risk level: | five point five six |
Analog integrated circuits - Other types: | SPST |
JESD-30 code: | S-PBGA-B64 |
JESD-609 code: | e3 |
Length: | 7 mm |
Number of channels: | one |
Number of functions: | one |
Number of terminals: | sixty-four |
Nominal open state isolation: | 33 dB |
Maximum operating temperature: | 70 °C |
Minimum operating temperature: | |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | VFBGA |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak reflux temperature (° C): | two hundred and sixty |
Certification status: | Not Qualified |
Maximum height of seating surface: | 0.85 mm |
Maximum supply voltage (Vsup): | 5.5 V |
Minimum supply voltage (Vsup): | 3 V |
Nominal supply voltage (Vsup): | 5 V |
Surface mounting: | YES |
Maximum disconnection time: | 5000 ns |
Maximum switching on time: | 5000 ns |
Technology: | HVCMOS |
Temperature class: | COMMERCIAL |
Terminal surface layer: | MATTE TIN |
Terminal type: | BALL |
Terminal pitch: | 0.65 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | forty |
Width: | 7 mm |
Base Number Matches: | one |
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