FQPF13N10C Schematic Diagram Functional Circuit Principle Chip Pin Definition Pin Diagram and Functions - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  • FQPF13N10C
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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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FQPF13N10L product parameters
model: FQPF13N10L
Rohs certification or not: accord with
Lifecycle: Obsolete
IHS Manufacturer: FAIRCHILD SEMICONDUCTOR CORP
Part package code: TO-220F
Packing instructions: TO-220F, 3 PIN
Number of stitches: three
Reach Compliance Code: not_compliant
ECCN code: EAR99
Risk level: five point six eight
Avalanche energy efficiency grade (Eas): 95 mJ
Enclosure connection: ISOLATED
to configure: SINGLE WITH BUILT-IN DIODE
Minimum drain source breakdown voltage: 100 V
Maximum drain current (Abs) (ID): 8.7 A
Maximum drain current (ID): 8.7 A
Maximum drain source on resistance: 0.2 Ω
FET technology: METAL-OXIDE SEMICONDUCTOR
JESD-30 code: R-PSFM-T3
JESD-609 code: e3
Number of elements: one
Number of terminals: three
Operating mode: ENHANCEMENT MODE
Maximum operating temperature: 175 °C
Packaging body material: PLASTIC/EPOXY
Package shape: RECTANGULAR
Packaging form: FLANGE MOUNT
Peak reflux temperature (° C): NOT SPECIFIED
Polarity/Channel Type: N-CHANNEL
Maximum power dissipation (Abs): 30 W
Maximum pulse drain current (IDM): 34.8 A
Certification status: Not Qualified
Subcategory: FET General Purpose Power
Surface mounting: NO
Terminal surface layer: Matte Tin (Sn)
Terminal type: THROUGH-HOLE
Terminal location: SINGLE
Maximum time at peak reflux temperature: NOT SPECIFIED
Transistor applications: SWITCHING
Transistor element material: SILICON
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