| model: | FQD9N08 |
|
| Rohs certification or not: | Non conformance |
| Lifecycle: | Obsolete |
| Part package code: | TO-252 |
| Packing instructions: | DPAK-3 |
| Number of stitches: | three |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| Risk level: | five point three three |
| Avalanche energy efficiency grade (Eas): | 55 mJ |
| Enclosure connection: | DRAIN |
| to configure: | SINGLE WITH BUILT-IN DIODE |
| Minimum drain source breakdown voltage: | 80 V |
| Maximum drain current (Abs) (ID): | 7.4 A |
| Maximum drain current (ID): | 7.4 A |
| Maximum drain source on resistance: | 0.21 Ω |
| FET technology: | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code: | TO-252 |
| JESD-30 code: | R-PSSO-G2 |
| JESD-609 code: | e0 |
| Number of elements: | one |
| Number of terminals: | two |
| Operating mode: | ENHANCEMENT MODE |
| Maximum operating temperature: | 150 °C |
| Packaging body material: | PLASTIC/EPOXY |
| Package shape: | RECTANGULAR |
| Packaging form: | SMALL OUTLINE |
| Polarity/Channel Type: | N-CHANNEL |
| Maximum power dissipation (Abs): | 25 W |
| Maximum pulse drain current (IDM): | 29.6 A |
| Certification status: | Not Qualified |
| Subcategory: | FET General Purpose Power |
| Surface mounting: | YES |
| Terminal surface layer: | Tin/Lead (Sn/Pb) |
| Terminal type: | GULL WING |
| Terminal location: | SINGLE |
| Transistor applications: | SWITCHING |
| Transistor element material: | SILICON |
| Base Number Matches： | one |
|
